Provided is a method that is for manufacturing a conductive pattern-provided structure, that involves simple manufacturing steps, and that enables formation of a conductive pattern-provided structure having excellent interlayer adhesion. One mode of the present invention provides a method for manufacturing a conductive pattern-provided structure, the method comprising: a coating film formation step for obtaining a coating film by printing, on a base material, a dispersion that contains copper oxide-containing particles; and a plating step for performing electroless plating on the coating film by using a plating solution. The plating solution contains EDTA (ethylenediaminetetraacetic acid).

It is provided a method for manufacturing a metal coated substrate by forming a metal coating on a surface of a substrate, comprising: immersing the substrate in a palladium/tin colloidal solution; immersing the substrate in an acid solution; and carrying out electroless metal plating in order to obtain a continuous film-coated substrate which is permeable to visible light. It is also provided a metal coated substrate obtainable by the mentioned method and an article of manufacture made of the metal coated substrate.

A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

The present invention discloses a novel activator system for electroless metallization deposition, particularly activators that may be free of tin and surfactants. Activators of the invention are preferably employed for electroless copper deposition.

Systems and methods are provided that entail polymeric fibers produced via an electrospinning process, and metallic nanostructures adhered to surfaces of the polymeric fibers via an electroless deposition process. Suitable materials for the polymeric fibers and metallic nanostructures include polyacrylonitrile (PAN) fibers and copper nanostructures, respectively.

According to the present disclosure, a method for coating nickel on an organosiloxane polymer is provided. A nickel organosiloxane polymer composite is also provided.

A present disclosure relates to a metallic film manufacturing method including a first step of forming a layer which has functional groups ion-exchangeable with metal ions on a surface of a resin substrate made of an insulating material, a second step of treating the resin substrate having the layer with a metal ion solution such that metal ions are introduced into the layer by ion exchange, and a third step of treating the resin substrate with a reducing agent such that metal particles are precipitated on a surface of the layer. The present disclosure relates to a metallic film manufacturing method a metallic film in which there are voids between metal particles precipitated on a surface of the metallic film, and the average particle diameter of the metal particles is 5 nm to 200 nm.

Proposed is a mobile device case that accommodates or covers a substrate and an electronic element located on the substrate. The case includes: a case frame made of a high molecular material including a resin and having a cover part for accommodating or covering the substrate and protrusions protruding from the cover part in such a manner as to be extended close to the electronic element; and a metal coating layer formed by coating a metal on a surface of the case frame including the protrusions to improve electromagnetic shielding ability.

Additive manufacturing compositions and methods for fabricating a conductive article with the same are provided. The additive manufacturing composition may include a 3D printable material, a plurality of porogens disposed in the 3D printable material, and a metal precursor disposed in the 3D printable material. The metal precursor may include a metal salt, a metal particle, or combinations thereof. The method may include forming a first layer of the article on a substrate, where the first layer includes the additive manufacturing composition, forming a second layer of the article adjacent the first layer, and binding the first layer with the second layer to fabricate the article. The method may also include plating a metal on the article to fabricate the conductive article.

The invention relates to a method for functionalising a surface of a solid substrate with at least one acrylic acid polymer layer, said method including the steps of: i) placing the surface in contact with a solution having of at least one acrylic acid homopolymer, a solvent and, optionally, metal salts; ii) removing the solvent from the solution in contact with the surface; and iii) binding the polymer to the surface by thermal treatment.