The present invention provides a conductive laminate for a touch panel which includes a substrate, and a patterned metal layer which is visually recognized to have greater blackness when viewed from the substrate side; a touch panel; and a transparent conductive laminate. The conductive laminate includes a substrate which has two main surfaces; a patterned plated layer which is disposed on at least one main surface of the substrate and has a functional group that interacts with metal ions; and a patterned metal layer which is disposed on the patterned plated layer, in which the patterned plated layer includes a metal component constituting the patterned metal layer and the ratio of the average peak intensity resulting from the metal component contained in the patterned plated layer to the average peak intensity resulting from the metal component constituting the patterned metal layer is in a range of 0.5 to 0.95.

The present invention relates to a chrome free etch for plating on plastic processes, wherein plastic surfaces are contacted in a first etching step with an etching solution at least comprising Mn(IV)-ions and, in a second etching step, with a solution at least comprising Mn(III)- and Mn(VII)-ions prior to the metal plating step.

An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming an electrical device on a first substrate, depositing a passivation layer on the electrical device, printing a palladium-containing ink on exposed aluminum pads in or on the electrical device, converting the palladium-containing ink to a palladium-containing layer, and forming a conductive pad or bump on the palladium-containing layer. The passivation layer exposes the aluminum pads.

A process for metallizing a three-dimensional-printed polymeric structure includes soaking the three-dimensional-printed polymeric structure in a metal salt solution; transferring the three-dimensional polymeric structure to a solution comprising a first reducing agent; soaking the three-dimensional polymeric structure in a metal plating bath, the metal plating bath comprising a coordinating agent, a palladium or platinum salt, a pH buffer component, and a second reducing agent, to form a metal plated polymeric structure. A metal plated porous structure and an apparatus for improving metallization are also disclosed.

According to the present disclosure, a method for coating nickel on an organosiloxane polymer wherein the said method comprises the steps of; forming a transition metal oxide on the organosiloxane polymer; etching the transition metal oxide with a basic solution; contacting the organosiloxane polymer comprising the etched transition metal oxide with an aqueous solution comprising a positively charged species to attach the positively charged species on the etched transition metal oxide; depositing a metal catalyst on the positively charged species; and treating the metal catalyst with an acidic solution to develop an activated organosiloxane polymer before transferring the activated organosiloxane polymer to a solution comprising nickel and/or nickel derivatives. A nickel organosiloxane composite is provided herein comprising a transition metal oxide layer and a positively charged species attached on the said oxide layer with nickel coated in the said positively charged species.

A method for the manufacture of plastic components that are corrosion-stable, optionally coated in metallic color and decorative first manufactures the components to be coated from a galvanizable plastic in the plastic injection-molding process and then subjects them to a chemical pretreatment, in which a first conductive metal layer is deposited and then an aluminum surface is deposited galvanically. The deposited aluminum surface is oxidized in a subsequent aluminum anodization process.

A compound represented by Formula (1). [In the formula, X represents a halogen atom or an alkoxy group, R.sup.1 represents any one group selected from an alkyl group having 1 to 5 carbon atoms, a group represented by Formula (R2-1), and a group represented by Formula (R2-2), R.sup.2 represents a group represented by Formula (R2-1) or (R2-2), n0 represents an integer of 0 or greater, n1 represents an integer of 0 to 5, and n2 represents a natural number of 1 to 5.] ##STR00001##

A water-soluble composition includes reducible copper ions or copper nanoparticles complexed with a reactive polymer. The reactive polymer can be crosslinked using suitable irradiation to provide copper-containing water-insoluble complexes. The water-soluble composition can be used to provide various articles and electrically-conductive materials that can be assembled in electronic devices. The reactive polymer has greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally at least 1 mol % of recurring units comprising a pendant amide, amine, hydroxyl, lactam, phosphonic acid, or carboxylic acid group.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

The present invention relates to a process for obtaining a multilayer composition, to a composition obtainable via such method and to an article comprising said composition. The process comprises at least the following: i. providing a polymeric layer (L1) comprising an aromatic polymer selected from the group consisting of poly(aryl ether sulfone) polymer (P1) and a polyarylene sulphide (P2), and having at least one surface (S1); ii. treating at least the surface (S1) of (L1) with a radio-frequency glow N discharge process in the presence of an etching gas medium comprising a nitrogen-containing gas to obtained an etched surface (52); iii. optionally, contacting the etched surface (S2) obtained in step ii. with a composition (LC3) comprising a surfactant to obtain at least a pre-treated surface (S2a); iv. contacting the etched surface (S2) obtained in step ii. or the pre-treated surface (S2a) obtained in step iii. with a liquid composition (LC1) comprising at least a metal (MC) in ionic form and having a pH not less than 9.0, so as to provide an article having at least one surface (S-3) treated with a composition containing metal (MC) in ionic form; v. reducing metal (MC) in ionic form on (S-3) to its metallic form by contacting (S-3) with a liquid composition (LC2) containing a reducing agent; vi. forming by electroless deposition a layer (L2) onto the at least one treated surface obtained in step v., said layer (L2) comprising at least one metal compound (M1) and metal (MC) in ionic form; vii. applying an additional layer (L3) comprising a metal (M2), equal to or different from (M1), directly on layer (L2); and, optionally, viii. applying an additional layer (L4) of a metal (M2) on (L3).