To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles M.sub.OH of hydroxy groups and the number of moles M.sub.COOH of carboxy groups, derived from the acrylic polymer, and the number of moles M.sub.NCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

A biodegradable core-shell microcapsule composition with controlled release of an active material is provided, wherein the shell of the microcapsule is composed of a biopolymer cross-linked with a combination of two or more different types of cross-linking agents.

There are provided: a microcapsule that includes a shell part containing a polymer and a core part which is encapsulated in the shell part, where the core part contains a coloring material and the polymer has an ultraviolet absorbent skeleton in the main chain thereof; and an application of the microcapsule.

Disclosed herein is a polyurethane resin containing, as copolymerization components, a polycarbonate polyol (A), an organic diisocyanate (B) and a chain extender (C), wherein the polycarbonate polyol (A) contains a specific structure in an amount of 60 mol % or more and a glass transition temperature of the polyurethane resin is 50° C. or higher. The polyurethane resin has excellent heat resistance and satisfactory adhesive property to various substrates, and is usable as an adhesive composition.

To provide a polyurethane prepolymer whereby a pressure-sensitive adhesive having excellent moisture permeability and also having both low adhesion to skin and high adhesion to a substrate can be obtained, a pressure-sensitive adhesive, an adhesive skin patch, a pressure-sensitive adhesive tape, a wearable device and a wearable device kit.

A hydroxy group-terminated polyurethane prepolymer which is obtained by reacting an oxyalkylene polymer A having an average number of hydroxy groups per molecule of from 2.1 to 3, an oxyalkylene polymer B having one hydroxy group per molecule, and a diisocyanate compound, wherein the number average molecular weight of the oxyalkylene polymer B is at least 5,000, and the content of ethylene oxide units in the hydroxy group-terminated polyurethane prepolymer is more than 10 mass %, a pressure-sensitive adhesive, an adhesive skin patch, a pressure-sensitive adhesive tape, a wearable device and a wearable device kit.

To provide a polyurethane prepolymer whereby a pressure-sensitive adhesive having excellent moisture permeability and also having both low adhesion to skin and high adhesion to a substrate can be obtained, a pressure-sensitive adhesive, an adhesive skin patch, a pressure-sensitive adhesive tape, a wearable device and a wearable device kit.

A hydroxy group-terminated polyurethane prepolymer which is obtained by reacting an oxyalkylene polymer A having an average number of hydroxy groups per molecule of from 2.1 to 3, an oxyalkylene polymer B having one hydroxy group per molecule, and a diisocyanate compound, wherein the number average molecular weight of the oxyalkylene polymer B is at least 5,000, and the content of ethylene oxide units in the hydroxy group-terminated polyurethane prepolymer is more than 10 mass %, a pressure-sensitive adhesive, an adhesive skin patch, a pressure-sensitive adhesive tape, a wearable device and a wearable device kit.

A solvent-based two-component polyurethane-type adhesive composition comprises an —OH component and an —NCO component. The —OH component comprises an amorphous prepolymer including two —OH end groups, with a number-average molar mass M.sub.n of 8000 to 12, 000 g and is chosen from: a) a copolyester (A1) obtained by a polycondensation reaction of at least one aliphatic diol (i) with at least one aromatic diacid (ii) and at least one aliphatic diacid (iii); and b) a polyurethane (A2) obtained by a polyaddition reaction between an aliphatic diisocyanate compound and an amorphous copolyester diol with a number-average molecular weight M.sub.n ranging from 4000 to 11 500 g/mol. The —NCO component comprises a compound (B1) including three —NCO end groups, obtained by the reaction of meta-xylylene diisocyanate (m-XDI) with a triol, said compound (B1) being alone or as a mixture with a compound (B2) derived from an aliphatic diisocyanate.

The present invention provides a microcapsule encompassing water or a water-soluble compound and having excellent leakage resistance and morphological stability. Further, the present invention provides a method for producing the microcapsule.

The microcapsule of the present invention is a microcapsule encompassing at least one of water or a water-soluble compound, in which a capsule wall of the microcapsule contains a resin having a repeating unit derived from a hydrophobic monomer having a ClogP value of 0.70 or more and a repeating unit derived from a hydrophilic monomer having a ClogP value of less than 0.70, and the microcapsule satisfies a relationship of Expression (1).

[00001]$\begin{array}{cc}\delta /\mathrm{Dm}\le 0.40& \mathrm{Expression}\left(1\right)\end{array}$

δ represents a number average wall thickness (μm) of the microcapsule. Dm represents a volume-based median diameter (μm) of the microcapsule.

An adhesive kit 1 separately includes a main agent layer 2 containing a polyamine component, and a curing agent layer 3 containing a polyisocyanate component. When the main agent layer 2 is reacted with the curing agent layer 3, the reactive parameter Pr exceeds 40% and the diffusion parameter Pd exceeds 15%.

The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.