The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

A board including a plurality of layers having a different composition. At least one of the layers is based on MgO and MgChloride and/or at least one of said layers is based on MgO and MgSulphate. Methods for manufacturing such boards, and methods for manufacturing coated panels include such board.

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

The present disclosure is generally directed to a mold inhibiting composition. The mold inhibiting composition can be used to treat various different substrates, including building material products, such as facing layers for wallboard. In general, any suitable paper product may be treated with the composition. The composition contains a mold inhibiting agent in combination with a defoamer. The mold inhibiting agent may comprise a pyrithione. The defoamer, on the other hand, may comprise an oil based defoamer containing metal oxide particles, such as silica particles. The mold inhibiting composition can be combined with a water repellent and applied to a substrate without excessive amounts of foam or froth being formed. The defoamer is selected so as to not interfere with the resulting water absorption properties of the product.

The present disclosure is generally directed to a mold inhibiting composition. The mold inhibiting composition can be used to treat various different substrates, including building material products, such as facing layers for wallboard. In general, any suitable paper product may be treated with the composition. The composition contains a mold inhibiting agent in combination with a defoamer. The mold inhibiting agent may comprise a pyrithione. The defoamer, on the other hand, may comprise an oil based defoamer containing metal oxide particles, such as silica particles. The mold inhibiting composition can be combined with a water repellent and applied to a substrate without excessive amounts of foam or froth being formed. The defoamer is selected so as to not interfere with the resulting water absorption properties of the product.

An impregnate with antistatic properties for use in laminates or for coating wood-based panels is disclosed. A resin used for impregnating and/or coating paper may include carbon-based particles, at least one compound of the general formula (Ia) R.sup.1.sub.aSiX.sub.(4-a), R.sup.3.sub.cSiX.sub.(4-c)(II), and inorganic particles. X is methoxy, ethoxy, n-propoxy or i-propoxy. R.sup.1 is an organic radical selected from the group including methyl, ethyl, propyl, or vinyl, and has at least one functional group Q.sub.1, selected from the group including acrylic, acryloxy, methacrylic, methacyloxy, or epoxy. R.sup.3 is a non-hydrolyzable organic radical selected from the group including C1-C10 alky, C6-10 aryl, wherein C is 1, 2, or 3, and the inorganic particles have a size between 2 nm and 400 nm.

An impregnate with antistatic properties for use in laminates or for coating wood-based panels is disclosed. A resin used for impregnating and/or coating paper may include carbon-based particles, at least one compound of the general formula (I) R.sup.1.sub.aR.sup.2.sub.bSiX.sub.(4-a-b), and/or hydrolysis products thereof. X is H, OH, or a hydrolysable moiety selected from the group including halogen, alkoxy, carboxy, amino, monoalkylamino or dialkylamino, aryloxy, acyloxy, or alkylcarbonyl. R.sup.1 is an organic moiety selected from the group including alkyl, aryl, or cycloalkyl, which may be interrupted by —O— or —NH—. R.sup.1 has at least one functional group Q.sup.1 selected from a group including a hydroxy-, amino, monoalkylamino, carboxy, mercapto, alkoxy, aldehyde, acrylic, acryloxy, methacrylic, methacryloxy, cyano, isocyano or epoxide group. R.sup.2 is a non-hydrolyzable organic moiety selected from the group including alkyl, aryl, alkenyl, alkynyl, cycloalkyl, cycloalkenyl; a is 0, 1, 2, or 3, and b is 1, 2, 3, or 4.

The present disclosure is generally directed to a mold inhibiting composition. The mold inhibiting composition can be used to treat various different substrates, including building material products, such as facing layers for wallboard. In general, any suitable paper product may be treated with the composition. The composition contains a mold inhibiting agent in combination with a defoamer. The mold inhibiting agent may comprise a pyrithione. The defoamer, on the other hand, may comprise an oil based defoamer containing metal oxide particles, such as silica particles. The mold inhibiting composition can be combined with a water repellent and applied to a substrate without excessive amounts of foam or froth being formed. The defoamer is selected so as to not interfere with the resulting water absorption properties of the product.