Disclosed herein is a flexible conductive substrate. According to the present invention, the flexible conductive substrate comprises a fabric substrate, a first film formed of metal or metal oxide on the fabric substrate, a second film formed of ITO film including tin oxide on the first film, and a third film formed of ITO film including tin oxide on the second film. A content of tin oxide included in the second film is smaller than that of oxide included in the third film.

Disclosed herein is a flexible conductive substrate. According to the present invention, the flexible conductive substrate comprises a fabric substrate, a first film formed of metal or metal oxide on the fabric substrate, a second film formed of ITO film including tin oxide on the first film, and a third film formed of ITO film including tin oxide on the second film. A content of tin oxide included in the second film is smaller than that of oxide included in the third film.

An arc resistant acrylic fiber includes an acrylic polymer. The arc resistant acrylic fiber also includes an infrared absorber in an amount of 1 wt % to 30 wt % with respect to a total weight of the acrylic polymer.

The present invention relates to a method for producing a functional yarn, in which zirconium phosphate having a multiple-layered structure is used as a deodorizing material and a melted polymer is spun through a spinning nozzle having a multi-lobal sectional shape. According to the present invention, the melted polymer contains layered fine zirconium phosphate inorganic particles having low hardness, and thus the abrasion of production process equipment can be minimized during fiber production and also an excellent deodorizing property and an excellent sweat-absorbing and quick-drying property are exhibited.

A ball-shaped photothermal filler is provided, which is formed by making one or more short fibers selected from a polyamide short fiber, a polyester short fiber, and a polypropylene short fiber in the shape of a ball, wherein the filler contains a photothermal material.

A ball-shaped photothermal filler is provided, which is formed by making one or more short fibers selected from a polyamide short fiber, a polyester short fiber, and a polypropylene short fiber in the shape of a ball, wherein the filler contains a photothermal material.

The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

The present disclosure relates to a process for obtaining and formulating functional silica particles and other materials with active ingredients/compounds for use in polymers, paints, mortars, ceramic, cement, textile, pharmaceutics, varnishes, paper, clays, cosmetics, sensors and effluents.

The present disclosure describes a functional particle for binding to a substrate comprising:

a granule comprising oxide or hydroxide of an element selected from the following list: silica, magnesium, zinc, iron, copper, silver, aluminum, gold, titanium, or mixtures thereof having a size between 90 nm-500 nm;

a binder comprising silane-based compounds which binds the outer granule to the substrate;

a functional compound/active compound bound to the surface of the granule, to the binder, or to both;

wherein the functional compound is at least one of the following compounds: anti-mosquito/repellent/anti-insect, fungicide, antimicrobial/bactericide, antimycotic, anti-fire, UV protectors, larvicides, hydrophobics, vitaminics, moisturizers, cosmetics, drugs, mechanical properties, magnetic properties enhancement, or mixtures thereof.

Disclosed are nanostructured materials that reflect light in selected spectra incorporated in dark colored textiles or substrates. In one aspect, a light reflecting material includes a textile exhibiting a dark color and formed of a plurality of fibers, and nanostructures arranged on the fibers and formed of a plurality of nanoparticles, the nanostructures having a dimension size of substantially less than ½of a visible light wavelength, in which the nanostructures reflect light from the textile or substrate in at least one of infrared, near-infrared, or red visible light spectra.