Patent classifications
E04F15/02194
SYSTEM AND METHOD FOR DECKING TILES
A deck tile assembly is disclosed. The deck tile assembly comprises a frame having at least four sides. The deck tile assembly further comprises a plurality of bars for providing a support structure to the frame. The deck tile assembly further comprises at least two parallel sleepers permanently attached between two opposite sides of the frame and mounted on the plurality of bars. The deck tile assembly further comprises at least two step clip fastening devices, wherein each of the step clip fastening device is mounted on one of the at least two parallel sleepers. The deck tile assembly further comprises at least two supporting members for attaching the frame with the ground surface.
Underpayment panel having drainage channels
An impact-absorbing assembly includes a covering layer being one or more of artificial turf, rubber mats, polymer mats, short pile carpeting, particulate infill, wood chips, and ground rubber chips. Also included is a layer of underlayment panels positioned beneath the covering layer. The panels have a panel section with a plurality of drain holes formed therethrough. A top surface of the panels is configured to support the covering layer. A bottom surface of the panels has a plurality of bottom projections that cooperate to define bottom channels suitable to permit water flow across the bottom surface, the bottom channels being in fluid communication with the panel drain holes. The bottom projections define a first spring rate characteristic that is part of a first stage and a second spring rate characteristic is part of a second stage, the first stage having a smaller volume of material than the second stage.
Structural element for forming a ground covering
A structural element for forming a ground covering, in particular in an outdoor area, including a rectangular tile. A molded-on portion which is made of a plastic material and runs around the edge of the tile like a frame is preferably injection-molded and/or foamed onto the tile.
TILE CLADDING SYSTEM AND METHOD FOR MOUNTING TILE ELEMENTS ON A BUILDING SURFACE
The tile cladding system having a mounting plate and a number of tile elements. Each tile element has a front side adapted to face away from a building surface and a back side adapted to be connected to a front side of the mounting plate. The front side of the mounting plate and the back side of each tile element are provided with a number of protrusions and/or indentations in such a way that protrusions may fit into indentations in order to form a snap-fit or friction fit connection. The mounting plate have such a configuration that the mounting plate is able to bend.
Carrier plate for a floor, wall or ceiling structure
The invention relates to a carrier plate for a floor, wall or ceiling structure, which has a film-like plate (12) made of plastic having a plurality of protrusions (14), having an adhesion-enhancing layer (26) on a first plate side (17), having a further layer (29), which engages with a second plate side (18) opposite the first plate side (17), wherein the further layer (29) is in contact with the protrusions (14), which spans recesses (19) provided in between, wherein the protrusions (14) are formed to protrude alternately from a central plane (16) of the film-like plate (12), such that a plurality of rows and columns is formed, in which protrusions (14) and recesses (19) are alternately lined up and only recesses (19) are lined up along one diagonal (21) to the rows and columns in a direction along the diagonal (21) and only protrusions (14) are lined up at right angles to the diagonal (21) along a further diagonal (22).
FLOOR PANEL
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
FLOOR PANEL
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
Floor panel
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
Floor panel
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
Panel having decorative layer and method for printing panels
A printed image for the decor of a panel and a method for imprinting plates, in particular wall, ceiling or floor panels. The method includes the following steps: (i) providing a plate; (ii) applying a primer by means of a liquid curtain of coating material on/to a main surface of the plate; (iii) optionally drying and/or curing the primer; (iv) treating the surface of the primer by means of at least one of the following measures: a) corona treatment; b) plasma treatment; c) applying an oil in an aqueous dilution and (v) applying a decorative decor.