E04F15/203

UNCOUPLING MAT
20170298637 · 2017-10-19 ·

An uncoupling mat includes an uncoupling layer; a layer of adhesive underlying the uncoupling layer, the adhesive layer having a subfloor-bonding surface; and an entangled filament sheet overlying the uncoupling layer, the entangled filament sheet being a resilient three-dimensional web of extruded polymer monofilaments, the polymer monofilaments being heat welded at junctions to form an open network of tangled monofilament.

FLOOR MAT FOR LAYING ON THE GROUND AND FLOOR USING THE SAME
20220034101 · 2022-02-03 ·

The disclosure belongs to the technical field of soundproof flooring, and discloses a floor mat and a floor. The floor mat includes a floor mat body made of foamed material. At least one surface of the floor mat body is provided with a number of soundproof units with the same area. Each of the soundproof unit has at least one soundproof structure. At least one of the numbers, shapes and distribution positions of the soundproof structures are different. The floor mat of the present disclosure can play a sound absorption effect; at the same time, a plurality of chaotic sounds are dispersed and mutually offset, which effectively isolates most of the sounds and has a good soundproof effect.

Mold-resistant field-assembled flooring systems
11236516 · 2022-02-01 ·

Described herein are methods for installing field-assembled flooring systems wherein the underlayment is a hybrid design that includes a combination of structural board and cementitious product. The hybrid design is configured to reduce or eliminate the curing time requirement after pouring the cementitious product (e.g., gypsum concrete). The field-assembled flooring systems can reduce or eliminate the chances of the onset of mold due to high moisture levels by removing the cementitious product from the prone areas and replacing it with structural boards. The structural boards (e.g., cellulose fiberboards) can be installed in non-critical areas such as underneath cabinets, around the perimeter of the floor, under bathtubs, in non-walk-in closets, anywhere drywall reaches the floor, or the like.

Insulating underlay elements for parquet and laminate flooring, having lateral push-in connections and adhesive strips
20170260756 · 2017-09-14 ·

An insulating underlay element for arranging between a subfloor and floor coverings laid thereon. The underlay element comprises a push-in connection on at least two sides of the insulating underlay element for connecting the insulating underlay elements to form an extensive insulating underlay in a gap-free and extensive manner, wherein an adhesive strip is arranged on the underside of the insulating underlay element in the region of the push-in connection, such that the adhesive surface is facing upward in the receptacles of the push-in connections and is in contact with the undersides of the pushed-in protrusions. The adhesive strip comprises a backing material coated with a release adhesive, and the insulating underlay elements being coated on their underside with a permanent adhesive in the region of the arrangement of the adhesive strips to establish a permanent adhesive connection between the adhesive strips and the underside of the insulating underlay element.

FIELD-ASSEMBLED FLOORING SYSTEMS WITH MOLD-RESISTANT ISOLATION BOARDS
20220228374 · 2022-07-21 ·

Described herein are methods for installing field-assembled flooring systems that include isolation boards on a wall frame, a subfloor, or on both the wall frame and the subfloor. The underlayment can be a hybrid design that includes a combination of isolation panels and cementitious product. The field-assembled flooring systems can use mold-resistant isolation boards to reduce or eliminate the chances of the onset of mold and effects from water damage. The isolation boards can be installed on floors alone, on walls alone, or on both floors and walls to reduce the onset of mold and/or to reduce damage from water.

MODULAR BUILDING SYSTEM

A manufactured building system is described. The building system can include modular components such as floor panels, roof panels, window walls, demising walls, utility walls, end walls, and/or corbel beams.

SOUND INSULATION TILE FOR BUILDING AND METHOD OF MANUFACTURING THE SAME
20220195722 · 2022-06-23 ·

A sound insulation tile having a tile body and a sound insulation layer on a back surface of the tile body and used for buildings and a method of manufacturing the same are revealed. The sound insulation layer is made of unfoamed or foamed PU material containing special substances. A method of manufacturing sound insulation tiles includes the steps of preparing a plurality pieces of sound insulation layer whose size matches size of a tile body and then attaching the sound insulation layer to a back surface of the tile body by an adhesive layer. Another method of manufacturing sound insulation tiles includes the steps of coating thick PU material over a back side of a tile body to form an even sound insulation layer integrated with the tile body, and then curing the sound insulation layer for mass production of the sound insulation tile.

UNDERLAY ELEMENT FOR FLOORING AND FLOOR ASSEMBLY

An underlay element configured to be provided between a floor covering and a subfloor. The underlay element includes a base matrix and a plurality of restriction members at least partly embedded in the base matrix. The base matrix includes a first material which is compressible and, preferably, foamed. The restriction members include a second material, wherein a size of each of the restriction members exceeds 0.25 mm in at least one direction. A compression of the underlay element is configured to be restricted by the restriction members. Also, a corresponding floor assembly including a floor covering and an underlay element.

FLOOR LIFT LAYER PROVIDING RIGIDITY, SOUND REDUCTION, AND THERMAL INSULATION
20230243162 · 2023-08-03 ·

A floor structure includes a subfloor, a floor covering disposed above the subfloor, and a floor lift layer disposed between the subfloor and the floor covering. The floor covering is disposed above the subfloor. The floor lift layer is a fiber structure that includes a substrate fiber bound together by a thermoplastic binder fiber. The thermoplastic binder fiber makes up between 25 percent (%) and 35% by weight of the floor lift layer.

FIELD-ASSEMBLED WALL AND FLOORING SYSTEMS
20230279673 · 2023-09-07 ·

Described herein are methods for installing field-assembled flooring systems wherein the underlayment is a hybrid design that includes a combination of structural board and cementitious product. The hybrid design is configured to reduce or eliminate the curing time requirement after pouring the cementitious product (e.g., gypsum concrete). The field-assembled flooring systems can reduce or eliminate the chances of the onset of mold due to high moisture levels by removing the cementitious product from the prone areas and replacing it with structural boards. The structural boards (e.g., cellulose fiberboards) can be installed in non-critical areas such as underneath cabinets, around the perimeter of the floor, under bathtubs, in non-walk-in closets, anywhere drywall reaches the floor, or the like.