A leveling shim (1) for building is described, comprising a plastic plate (2), coupling means and through holes. The coupling means comprise flexible coupling means (5) able to be housed in at least one cavity (6) of the plate (2), and at least one coupling through hole (4).

A base pad includes a main body that has a top side and a bottom side. The top side is configured to receive a pier support. The base pad includes a plurality of ribs positioned on the bottom side of the main body. The base pad includes at least one aperture that is defined by the main body. The aperture passes through the top side to the bottom side of the main body. The aperture is configured to receive a fastener for securing the pier support to the top side of the main body.

Improved support systems, including seismic isolation platforms, tracks and flooring systems are disclosed for protecting a payload, for example, data center racks containing delicate computer equipment such as a hard disk drive, from damage due to vibrations such as seismic vibrations and the like. The systems are modular in design, and can be assembled and changed quickly, while being strong and robust enough to support heavy loads.

There is disclosed a modular platform assembly including a plurality of legs (18), a plurality of floor beams (20a,b,c), and a plurality of connectors (24a,b,c,d) for connecting the legs (18) and the floor beams (20a,b,c). Each said connector (24a,b,c,d) comprises: a downwardly open blind recess (59) with a closed top end (60) and an open bottom end (62); and an upwardly open blind recess (64) with a closed bottom end (66) and an open top end (68). The legs (18) are mounted into the downwardly open blind recesses (59) of the connectors (24a,b,c,d) and the floor beams (20a,b,c) are mounted into the upwardly open blind recesses (64) of the connectors (24a,b,c,d) such that the legs (18) extend downwardly from the floor beams (20a,b,c).

A panel for composing a floor covering or wall covering. A panel system including at least one panel. A method of composing a covering, in particular a floor covering, by using a panel system.

In one aspect of a tile and support structure, a support structure may be engaged with a top portion of a pedestal. The support structure may be formed with a generally vertical spine having at least one rail extending outward from a distal end thereof. The spine and rail(s) may be configured to secure one or more tiles, which tiles may be formed with a groove on at least one edge thereof, and wherein one or more rails may be positioned within the groove.

The present disclosure provides a method, system, and fabrication facility that eliminates or substantially reduces process-limiting vibrations within a high-precision device manufacturing facility, wherein an elevated structure supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure.

Improved support systems, including seismic isolation platforms, tracks and flooring systems are disclosed for protecting a payload, for example, data center racks containing delicate computer equipment such as a hard disk drive, from damage due to vibrations such as seismic vibrations and the like. The systems are modular in design, and can be assembled and changed quickly, while being strong and robust enough to support heavy loads.

According to an embodiment of the invention, there is provided an adjustable footing for a post, the adjustable footing comprising: a base, the base comprising a base plate, a fixed base nut secured to the base plate and a threaded rod secured to the base nut and extending perpendicular to the base; and a top, the top comprising a post plate having a hole and a fixed post nut secured to the post plate over the hole and dimensioned to engage the threaded rod. The post plate is secured to the post such that the threaded rod passes through the post nut and hole into a cavity in the post, and the overall height of the footing is adjustable by rotation of the base via the base nut.

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation/reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.