The present disclosure provides a PCB board, a manufacturing method of a PCB board, and an electrical device, where the PCB board includes an insulating dielectric layer which is a glass substrate layer including a top surface and a bottom surface disposed oppositely; a conductive wiring layer which is disposed on a top surface of the insulating dielectric layer; and a top ink layer which is coated on the conductive wiring layer. According to the technical solution provided by the embodiment of the disclosure, the PCB board does not generate the phenomenon of deformation warping, and the conductive wiring layer is not easily peeled off from the insulating medium layer, and the use performance of the PCB board is good.

The present disclosure relates to a lighting fixture that is configured to transfer heat that is generated by a light source and any associated electronics toward the front of the lighting fixture. The lighting fixture includes a heat spreading cup that is formed from a material that efficiently conducts heat and a light source that is coupled inside the heat spreading cup. The heat spreading cup has a bottom panel, a rim, and at least one sidewall extending between the bottom panel and the rim. The light source is coupled inside the heat spreading cup to the bottom panel and configured to emit light in a forward direction through an opening formed by the rim. Heat generated by the light source during operation is transferred radially outward along the bottom panel and in a forward direction along the at least one sidewall toward the rim of the heat spreading cup.

An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

The present invention relates to a linkage modularized LED display module including linkage lock unit. The said linkage lock unit is provided on the back of the bottom shell plate and includes a driving head and multiple linking rods. The driving head can drive the multiple linking rods to work simultaneously, so that the LED display module can be clamped in the assembly frame or different LED modules can be assembled together.

The present invention relates to a linkage modularized LED display module including linkage lock unit. The said linkage lock unit is provided on the back of the bottom shell plate and includes a driving head and multiple linking rods. The driving head can drive the multiple linking rods to work simultaneously, so that the LED display module can be clamped in the assembly frame or different LED modules can be assembled together.

An LED lamp, comprising a base; a lamp envelope coupled to the base; a support module accommodated in the lamp envelope, a first inner cavity being formed between the support module and the lamp envelope, the first inner cavity containing therein a first gas medium; a driver module accommodated in the first inner cavity and coupled to the support module; and an LED inner vessel accommodated in the first inner cavity and coupled to at least one of the support module and the driver module, a sealed second inner cavity being formed within the LED inner vessel, and the second inner cavity containing therein a second gas medium and an LED light source module.

An LED lamp, comprising a base; a lamp envelope coupled to the base; a support module accommodated in the lamp envelope, a first inner cavity being formed between the support module and the lamp envelope, the first inner cavity containing therein a first gas medium; a driver module accommodated in the first inner cavity and coupled to the support module; and an LED inner vessel accommodated in the first inner cavity and coupled to at least one of the support module and the driver module, a sealed second inner cavity being formed within the LED inner vessel, and the second inner cavity containing therein a second gas medium and an LED light source module.

An LED lighting fixture includes a housing; a substrate located within the housing; a plurality of LED groups of various colors mounted on the substrate, each LED color group including multiple LED components; at least one circuit communicating with a power supply and adapted for powering the LED components; and an optical component located at an output end of the housing. The LED components are arranged along first and second directions orthogonal to one another, such that no two LED of the same color reside adjacent one another along both of the first and second directions, and each LED component is spaced-apart from an adjacent LED component a distance no greater than 1.0 mm.

The invention describes a light converting device comprising: a bonded layer stack comprising a light converter and a diamond layer, wherein the diamond layer is bonded to a bonding surface of the light converter, wherein the light converter is adapted to convert laser light to converted light, wherein a peak emission wavelength of the converted light is in a longer wavelength range than a laser peak emission wavelength of the laser light, wherein a refractive index of the diamond layer is bigger than a refractive index of the light converter, and a light outcoupling structure attached to a first surface of the bonded layer stack, wherein a second surface of the bonded layer stack is a light-entrance surface arranged to receive the laser light, wherein the bonding surface is arranged between the first surface and the second surface of the bonded layer stack, wherein a refractive index of the light outcoupling structure is at least 90% of the refractive index of the light converter, and wherein the light outcoupling structure is optically coupled to the first surface of the bonded layer stack such that total internal reflection of light traversing an emission path from the light-entrance surface to the light outcoupling structure is reduced. The invention further describes a laser-based light source comprising such a light converting device and a vehicle headlight comprising such a laser-based light source.