A plate heat exchanger includes a plurality of heat transfer plates stacked together and each having openings at four corners thereof. The heat transfer plates are partially brazed together such that a first flow passage through which first fluid flows and a second flow passage through which second fluid flows are alternately arranged with one of the heat transfer plates disposed therebetween, openings at the four corners being connected forming first headers through which the first fluid enters and is discharged and second headers through which the second fluid enters and is discharged. At least one of two heat transfer plates between which the first flow passage or the second flow passage is disposed is formed by a pair of metal plates stacked together. The metal plate adjacent to the second flow passage is thinner than the metal plate adjacent to the first flow passage.

A heat exchanger includes a heat exchanging portion, a reservoir that performs gas-liquid separation on a gas-liquid two-phase refrigerant that flows out from the heat exchanging portion into a gas-phase refrigerant and a liquid-phase refrigerant and stores the liquid-phase refrigerant, and an inflow passage that allows the gas-liquid two-phase refrigerant flowing out from the heat exchanging portion to flow into the reservoir. The inflow passage is connected so as to be in communication with an inlet port of the reservoir which is disposed above a liquid surface of the liquid-phase refrigerant stored in the reservoir.

A heat exchanger includes a heat exchanging portion, a reservoir that performs gas-liquid separation on a gas-liquid two-phase refrigerant that flows out from the heat exchanging portion into a gas-phase refrigerant and a liquid-phase refrigerant and stores the liquid-phase refrigerant, and an inflow passage that allows the gas-liquid two-phase refrigerant flowing out from the heat exchanging portion to flow into the reservoir. The inflow passage is connected so as to be in communication with an inlet port of the reservoir which is disposed above a liquid surface of the liquid-phase refrigerant stored in the reservoir.

The present disclosure is directed to devices, systems, and products for attracting, capturing and converting atmospheric water vapor into useful liquid water utilizing the thermal dynamic processes of deposition, phase change states and fusion.

The present disclosure is directed to devices, systems, and products for attracting, capturing and converting atmospheric water vapor into useful liquid water utilizing the thermal dynamic processes of deposition, phase change states and fusion.

Embodiments of the present disclosure are directed toward purge units of vapor compression systems, and methods of control thereof, that selectively activate and deactivate the purge unit in response to one or more conditions to, for example, control refrigerant-to-air ratios while still minimizing the durations of the purge cycles. For example, in certain embodiments, these conditions may include conditions within the chiller condenser, time since last purge activation, time since last venting of non-condensables, and combinations thereof. By reducing an amount of time that the purge unit would be active without removing a substantial amount non-condensables from the vapor compression system, present embodiments reduce the power consumption of the purge unit, as well as the vapor compression system as a whole, while still being responsive to prevent or mitigate a loss of efficiency due to a substantial accumulation of non-condensables in the condenser of the vapor compression system.

Embodiments of the present disclosure are directed toward purge units of vapor compression systems, and methods of control thereof, that selectively activate and deactivate the purge unit in response to one or more conditions to, for example, control refrigerant-to-air ratios while still minimizing the durations of the purge cycles. For example, in certain embodiments, these conditions may include conditions within the chiller condenser, time since last purge activation, time since last venting of non-condensables, and combinations thereof. By reducing an amount of time that the purge unit would be active without removing a substantial amount non-condensables from the vapor compression system, present embodiments reduce the power consumption of the purge unit, as well as the vapor compression system as a whole, while still being responsive to prevent or mitigate a loss of efficiency due to a substantial accumulation of non-condensables in the condenser of the vapor compression system.

Provided are an integrated connector and a heat exchanger including the same, which may prevent assembly defects and leaks of a heat exchanger because the connector may be manufactured with precise dimensions, and is easy to manufacture, by integrally forming the connector that connects and firmly couples a header tank and a gas-liquid separator so that a heat exchanger medium communicates in the heat exchanger such as a condenser, in which the integrated connector is formed by molding a first pipe portion inserted into a hole of the header tank, a first flange portion in surface contact with an outer surface of the header tank, a second pipe portion inserted into a hole of the gas-liquid separator, and a second flange portion in surface contact with an outer surface of the gas-liquid separator so as to be connected to one another and have an interior communicating with one another.

A system includes a heat-pump circuit and a heating-fluid circuit. The heat-pump circuit includes a compressor and a first condenser conduit. The heating-fluid circuit includes first, second, and third flow-paths. The third flow-path selectively communicates with the first and second flow-paths. The first flow-path includes a first valve. The first valve moves between an open position allowing fluid flow through the first flow-path and a closed position restricting fluid flow through the first flow-path. The second flow-path includes a second condenser conduit and a second valve. When the second valve is open, fluid flows through the second flow-path. In the closed position, the second valve restricts fluid flow through the second flow-path. The third flow-path includes a heat exchanger receiving fluid from the first flow-path when the first valve is in the open position and receiving fluid from the second flow-path when the second valve is in the open position.

A system includes a heat-pump circuit and a heating-fluid circuit. The heat-pump circuit includes a compressor and a first condenser conduit. The heating-fluid circuit includes first, second, and third flow-paths. The third flow-path selectively communicates with the first and second flow-paths. The first flow-path includes a first valve. The first valve moves between an open position allowing fluid flow through the first flow-path and a closed position restricting fluid flow through the first flow-path. The second flow-path includes a second condenser conduit and a second valve. When the second valve is open, fluid flows through the second flow-path. In the closed position, the second valve restricts fluid flow through the second flow-path. The third flow-path includes a heat exchanger receiving fluid from the first flow-path when the first valve is in the open position and receiving fluid from the second flow-path when the second valve is in the open position.