A spin rinse dryer for treating a substrate has an enclosure, a rotatable support for supporting the substrate, a rotatable member located within the enclosure above the rotatable support, and a drive for rotating the rotatable member. During cleaning of the wafer, liquid that splashes up from the wafer will strike the rotatable member, rather than the upper wall of the enclosure, and may form droplets on the rotatable member. After the flow of cleaning liquid has stopped, the drive can rotate the rotatable member at high speed, which tends to throw the liquid droplets off the rotatable member through centrifugal force. The liquid then runs down the walls of the enclosure, away from the wafer, so that there is a much reduced chance of contamination of the cleaned wafer. The rotatable member and support may be integrally formed and rotated together or may be separate members.

A spin rinse dryer for treating a substrate has an enclosure, a rotatable support for supporting the substrate, a rotatable member located within the enclosure above the rotatable support, and a drive for rotating the rotatable member. During cleaning of the wafer, liquid that splashes up from the wafer will strike the rotatable member, rather than the upper wall of the enclosure, and may form droplets on the rotatable member. After the flow of cleaning liquid has stopped, the drive can rotate the rotatable member at high speed, which tends to throw the liquid droplets off the rotatable member through centrifugal force. The liquid then runs down the walls of the enclosure, away from the wafer, so that there is a much reduced chance of contamination of the cleaned wafer. The rotatable member and support may be integrally formed and rotated together or may be separate members.

The present invention, a carwash dryer apparatus and method, is detailed. The apparatus uses a plurality of drying scoop assemblies to remove water from a wet vehicle through contact. The drying scoops are made from 10-lb foam or felt. The apparatus is then dried by spinning until it has released the absorbed water. The scoop shape facilitates both quick drying of vehicles and the rapid elimination of moisture from the scoops, themselves. The method allows for the sensing of the water retained in the plurality of drying scoop assemblies and adjusts the voltage in order to eliminate the water.

Methods and systems for post-processing molds are provided. In some embodiments, a method includes using a layer-by-layer build process on a polymeric resin to produce a plurality of aligner molds. The method can include transporting the plurality of aligner molds to a resin removal station. The method can also include applying high pressure air to the plurality of aligner molds to remove residual material from the plurality of aligner molds. The residual material can include excess polymeric resin. The method can further include collecting the excess polymeric resin.

Methods and systems for post-processing molds are provided. In some embodiments, a method includes using a layer-by-layer build process on a polymeric resin to produce a plurality of aligner molds. The method can include transporting the plurality of aligner molds to a resin removal station. The method can also include applying high pressure air to the plurality of aligner molds to remove residual material from the plurality of aligner molds. The residual material can include excess polymeric resin. The method can further include collecting the excess polymeric resin.

A method of producing a bioplastic granulate on the basis of sunflower seed shells or sunflower seed hulls. In the method, ground sunflower seed shells/sunflower seed hull material is provided, wherein the particle size is in the region of 3 mm or less, preferably in the region of 0.01 to 1 mm, preferably in the region of 0.1 to 0.3 mm. A plastic material is provided, which is compounded with the sunflower seed shells/sunflower seed hull material, wherein the compounding operation is preferably effected in an extruder, preferably a double-screw extruder. The compounded material is chopped at the end of the extruder section with a tool with the addition of water, wherein the water is at a temperature of preferably more than 50° C., preferably about 80 to 90° C., to cool down the compound material. During the compounding operation, the compounding material is subjected to atmospheric degassing and/or vacuum degassing.

A pressurizing centrifugal dehydrator for removing moisture according to the present disclosure includes: an inner basket into which slurry is introduced; an outer basket surrounding the inner basket; a blocking barrier disposed in the outer basket; and a gas supplying portion for supplying gas into the inner basket and/or the outer basket, wherein a dehydration product is positioned between an outer circumference of the blocking barrier and an inner side of the outer basket to maintain airtightness of the outer basket.

A pressurizing centrifugal dehydrator for removing moisture according to the present disclosure includes: an inner basket into which slurry is introduced; an outer basket surrounding the inner basket; a blocking barrier disposed in the outer basket; and a gas supplying portion for supplying gas into the inner basket and/or the outer basket, wherein a dehydration product is positioned between an outer circumference of the blocking barrier and an inner side of the outer basket to maintain airtightness of the outer basket.

In order to enable dehydration of a slurry of expanded particles with a simple structure, a dehydration device includes: a transporting tube configured to transport a liquid mixture of expanded particles, the transporting tube having a curved part in which the transporting tube is curved, and a mesh member provided to the curved part of the transporting tube. The mesh member is configured to separate the expanded particles and a liquid component in the liquid mixture from each other.

A wafer processing apparatus includes a rotating chuck which is rotatably installed inside a cup housing and on which a substrate is mounted, a nozzle table rotatably installed inside the rotating chuck, a guide installed inside the nozzle table, a moving module movably installed on the guide, a guide arm configured to support a fluid supply line part, a lower nozzle part coupled to the guide arm to move together with the moving module and connected to the fluid supply line part, a driving shaft part connected to the rotating chuck and the nozzle table to rotate the rotating chuck and the nozzle table, a moving shaft rotatably installed inside the driving shaft part and connected to the moving module to move the moving module, and a driver connected to the driving shaft part and the moving shaft.