Provided is a hot isostatic pressing (HIP) device that improves the heat uniformity of a hot zone during a pressurization process of an object being processed. This HIP device (100) is provided with: an outer casing (4) having an open outer opening part (4H); an inner casing (5) having an open inn opening part (5H); a heat-insulating body (R) disposed between the outer casing (4) and the inner casing (5); a gas flow generation part (30); and a plurality of first gas conduits (12), A hot zone (P) in which a pressurization process is performed is formed inside the inner casing (5). During the pressurization process, a low-temperature pressurization medium gas which has been generated by the gas flow generation part (30) and has passed through the first gas conduits (12) moves upward in an inner flow passage (L1) between the casings, and then flows into the hot zone (P) from the inner opening part (5H), Even when the pressurization medium gas leaks from the vicinity of a bottom all part (20) and flows into the hot zone (P), the heat uniformity of the hot zone (P) is maintained.

Provided is a hot isostatic pressing (HIP) device that improves the heat uniformity of a hot zone during a pressurization process of an object being processed. This HIP device (100) is provided with: an outer casing (4) having an open outer opening part (4H); an inner casing (5) having an open inn opening part (5H); a heat-insulating body (R) disposed between the outer casing (4) and the inner casing (5); a gas flow generation part (30); and a plurality of first gas conduits (12), A hot zone (P) in which a pressurization process is performed is formed inside the inner casing (5). During the pressurization process, a low-temperature pressurization medium gas which has been generated by the gas flow generation part (30) and has passed through the first gas conduits (12) moves upward in an inner flow passage (L1) between the casings, and then flows into the hot zone (P) from the inner opening part (5H), Even when the pressurization medium gas leaks from the vicinity of a bottom all part (20) and flows into the hot zone (P), the heat uniformity of the hot zone (P) is maintained.

The present disclosure includes a furnace for heating and/or sintering one or more three-dimensional printed metal parts. The furnace includes a furnace chamber, insulation within the furnace chamber, a retort within the furnace chamber, and one or more getters containing getter material. The retort is configured to receive the one or more three-dimensional printed metal parts.

The present disclosure includes a furnace for heating and/or sintering one or more three-dimensional printed metal parts. The furnace includes a furnace chamber, insulation within the furnace chamber, a retort within the furnace chamber, and one or more getters containing getter material. The retort is configured to receive the one or more three-dimensional printed metal parts.

The disclosure relates to substrate processing apparatus, with a first and second reactor, each reactor configured for processing a plurality of substrates; and, a substrate handling robot constructed and arranged to transfer substrates between a substrate cassette at a substrate transfer position and the first and second reactor. The apparatus is constructed and arranged with a maintenance area between the first and second reactors to allow maintenance of the reactors from the maintenance area to both the first and second reactor.

The disclosure relates to substrate processing apparatus, with a first and second reactor, each reactor configured for processing a plurality of substrates; and, a substrate handling robot constructed and arranged to transfer substrates between a substrate cassette at a substrate transfer position and the first and second reactor. The apparatus is constructed and arranged with a maintenance area between the first and second reactors to allow maintenance of the reactors from the maintenance area to both the first and second reactor.

The disclosure relates to substrate processing apparatus, with a first and second reactor, each reactor configured for processing a plurality of substrates; and, a substrate handling robot constructed and arranged to transfer substrates between a substrate cassette at a substrate transfer position and the first and second reactor. The apparatus is constructed and arranged with a maintenance area between the first and second reactors to allow maintenance of the reactors from the maintenance area to both the first and second reactor.

The disclosure relates to substrate processing apparatus, with a first and second reactor, each reactor configured for processing a plurality of substrates; and, a substrate handling robot constructed and arranged to transfer substrates between a substrate cassette at a substrate transfer position and the first and second reactor. The apparatus is constructed and arranged with a maintenance area between the first and second reactors to allow maintenance of the reactors from the maintenance area to both the first and second reactor.

A heating furnace includes: a heating furnace main body that includes an accommodation chamber capable of accommodating a heating target object; a heat source capable of heating an inside of the accommodation chamber to an annealing point; a gas supply source that is arranged outside the heating furnace main body; and a pipeline that includes a pipeline main body that is arranged inside the accommodation chamber, and that is heated by the heat source, the pipeline main body being configured to retain a gas supplied from the gas supply source and heat the gas to the annealing point, and a discharge outlet that is formed on an end portion of the pipeline main body, and that is opened inside the accommodation chamber, the discharge outlet being configured to discharge the gas that is heated to the annealing point, to the inside of the accommodation chamber.

Disclosed is a thermal reduction apparatus. The thermal reduction apparatus according to the exemplary embodiment includes: a preheating unit which preheats a to-be-reduced material and loads the to-be-reduced material into a reducing unit; the reducing unit which is connected to the preheating unit and in which a thermal reduction reaction of the to-be-reduced material occurs; a cooling unit which is connected to the reducing unit and from which the to-be-reduced material flowing into the cooling unit is unloaded to the outside; a gate device which is installed between the preheating unit and the reducing unit; a gate device which is installed between the reducing unit and the cooling unit; a condensing device which is connected to the reducing unit and condenses a metal vapor; a first blocking unit which is installed in the reducing unit; and a second blocking unit which is installed in the reducing unit so as to be spaced apart from the first blocking unit.