A method for heat treating metal alloy powder includes (a) introducing metal alloy powder to a chamber having a floor and a sidewall; (b) flowing a fluidizing gas through the floor and into the chamber to fluidize the metal alloy powder in the chamber; (c) flowing an additional gas through the sidewall into the chamber; and (d) heating the chamber to heat treat the metal alloy powder in the chamber. A system for heat treating metal alloy powder includes an inner chamber having a porous floor and a porous sidewall; an outer chamber, the inner chamber being inside of the outer chamber and defining an annular space between the outer chamber and the inner chamber, wherein the outer chamber and the inner chamber are inside a furnace; a source of fluidizing gas connected to the porous floor through the annular space; and a source of additional gas communicated with the porous sidewall through the annular space.

In a known method for treating pourable, inorganic grain, a heated rotary tube is used that rotates about an axis of rotation and surrounds a treatment chamber that is divided into a plurality of treatment zones by means of separating elements. The grain is supplied to the treatment chamber at a grain inlet side and is transported, in a grain transport direction, to a grain outlet side and is exposed to a treatment gas in the process. In order, proceeding herefrom, to allow for reliable and reproducible thermal treatment of pourable inorganic grain, in particular SiO.sub.2 grain in the rotary kiln, in a manner having low and effective consumption of treatment gas, it is proposed for spent treatment gas to be suctioned out of a reaction zone of the treatment chamber, by a gas manifold that rotates about the longitudinal axis thereof.

In a known method for treating pourable, inorganic grain, a heated rotary tube is used that rotates about an axis of rotation and surrounds a treatment chamber that is divided into a plurality of treatment zones by means of separating elements. The grain is supplied to the treatment chamber at a grain inlet side and is transported, in a grain transport direction, to a grain outlet side and is exposed to a treatment gas in the process. In order, proceeding herefrom, to allow for reliable and reproducible thermal treatment of pourable inorganic grain, in particular SiO.sub.2 grain in the rotary kiln, in a manner having low and effective consumption of treatment gas, it is proposed for spent treatment gas to be suctioned out of a reaction zone of the treatment chamber, by a gas manifold that rotates about the longitudinal axis thereof.

Sensors measure magnetic field components, and the measured fields are used to calculate and estimated transverse position of a longitudinal electric current flowing as an electric discharge across a discharge gap. Based on the estimated position, and according to a selected transverse trajectory or distribution of the estimated discharge position, magnetic fields are applied transversely across the discharge gap so as to control or alter the estimated discharge position. Inventive apparatus and methods can be employed, inter alia, during operation of a vacuum arc furnace.

Sensors measure magnetic field components, and the measured fields are used to calculate and estimated transverse position of a longitudinal electric current flowing as an electric discharge across a discharge gap. Based on the estimated position, and according to a selected transverse trajectory or distribution of the estimated discharge position, magnetic fields are applied transversely across the discharge gap so as to control or alter the estimated discharge position. Inventive apparatus and methods can be employed, inter alia, during operation of a vacuum arc furnace.

A gas phase type heating method includes loading an object into a vapor heating furnace or a heating furnace via a loading/unloading portion, cooling vapor of a heat transfer liquid by a cooler provided above the loading/unloading portion in the vapor heating furnace, and causing a gas to go in and out, making a pressure in a continuous furnace uniform, and heating the loaded object, by a connection portion that is provided above the cooler and has a pressure loss smaller than a pressure loss of the loading/unloading portion.

A gas phase type heating method includes loading an object into a vapor heating furnace or a heating furnace via a loading/unloading portion, cooling vapor of a heat transfer liquid by a cooler provided above the loading/unloading portion in the vapor heating furnace, and causing a gas to go in and out, making a pressure in a continuous furnace uniform, and heating the loaded object, by a connection portion that is provided above the cooler and has a pressure loss smaller than a pressure loss of the loading/unloading portion.

Novel tools and techniques for heat and pressure treatment are provided. A system for heat and pressure treatment includes a vacuum pump, an enclosure, and an oven. The enclosure may include a body defining an inner volume, wherein the enclosure is configured to enclose at least part of a component within the inner volume, and sustain a vacuum pressure that is less than an ambient atmospheric pressure within the inner volume. The oven may be configured to receive and heat the enclosure. The vacuum pump may evacuate gases from within the inner volume and create the vacuum pressure. Under the vacuum pressure, the body may be configured to make surface contact with a surface of the at least part of the component, and to apply a mechanical pressure against the surface of the at least part of the component.

Novel tools and techniques for heat and pressure treatment are provided. A system for heat and pressure treatment includes a vacuum pump, an enclosure, and an oven. The enclosure may include a body defining an inner volume, wherein the enclosure is configured to enclose at least part of a component within the inner volume, and sustain a vacuum pressure that is less than an ambient atmospheric pressure within the inner volume. The oven may be configured to receive and heat the enclosure. The vacuum pump may evacuate gases from within the inner volume and create the vacuum pressure. Under the vacuum pressure, the body may be configured to make surface contact with a surface of the at least part of the component, and to apply a mechanical pressure against the surface of the at least part of the component.

An embodiment includes an apparatus for controlling temperature of a substrate, an apparatus for treating a substrate comprising the same, and a method of controlling the same, which may control the temperature of the substrate by each area and not increasing the volume of the apparatus. The substrate temperature control apparatus comprises: a support plate for supporting a substrate; a plurality of heating units placed in different area of the substrate and controlling a temperature of the substrate by each area; a power supply unit for providing a power to control the temperature of the substrate; a switch unit connected between the plurality of heating units and the power supply unit, and obtaining one or more of a transistor device; and a controller for controlling a power which is supplied to each heating units by controlling unit.