There is provided a heat-conductive flexible sheet that is formed of a non-silicone material and excellent in flexibility as well as durability such as heat-aging resistance, hydrothermal resistance, and thermal shock resistance, and a heat dissipation structure using the same, as well as a resin composition that exhibits excellent handleability in the kneading step in producing a heat-conductive sheet and can be suitably used as a binder material for a heat-conductive flexible sheet. A resin composition comprising a blocked urethane prepolymer, a predetermined epoxy compound, and a curing catalyst, the blocked urethane prepolymer being a reaction product of an aliphatic diisocyanate compound and a hydrogenated polybutadiene polyol having a hydroxy group at each of both ends, wherein the reaction product has at an end thereof an isocyanate group blocked with an aromatic hydroxy compound; a heat-conductive flexible sheet formed of a cured product of a mixed composition comprising the same and a heat-conductive inorganic filler; and a heat dissipation structure using the same.

A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state.

Processes produce a compound material structure by producing a composite material which extends along an axis of elongation from carbon nanostructures anchored in a matrix of a first metal extending along the axis of elongation of the composite material. The processes comprise dividing the composite material into segments of the composite material, arranging the segments in a plane of a die matrix, filling free spaces in the die matrix with a filler material and subsequently sintering in the die matrix to form a compound material structure or squeeze casting in the die matrix, and exposing the carbon nanostructures of the composite material on at least one surface of the compound material structure such that the carbon nanostructures protrude out of this surface. Compound material structures and uses thereof as a heat conductor and/or a heat exchanger are also provided.

A device which includes a heat generator, a resinous housing covering the heat generator, and a heat radiation material disposed on at least some of the surfaces of the heat generator, wherein the heat radiation material includes metal particles and a resin and has a region where the metal particles arranged along the surface direction are present at a relatively high density.

A heat dissipation member dissipates heat generated at a heat source. The heat dissipation member may include a substrate having a porosity ratio of 5 volume % or less; and an inorganic porous layer disposed on a surface of the substrate, wherein the inorganic porous layer may have a porosity ratio ranging from 25 volume % or more to 85 volume % or less and have lower thermal conductivity than the substrate. In this heat dissipation member, 15 mass % or more of constituents of the inorganic porous layer may be alumina.

Embodiments described herein relate a tunable heat transfer system. The tunable heat transfer system includes a controller, a first body, and a second body. The first body is communicatively coupled to the controller. The second body is communicatively coupled to the controller and spaced apart from the first body. The second body has a plurality of semimetal layers and a dielectric portion positioned between each of the plurality of semimetal layers. Each of the dielectric portions has a thickness to define a gap between each the plurality of semimetal layers in an expanded state and permitting each of the plurality of semimetal layers to abut each other in a contracted state. The controller is configured to change a near-field radiative heat transfer between the first body and the second body by changing the thickness of each of the dielectric portions between the expanded state and the contracted state.

A composite heat dissipation device includes an electromagnetic radiation dissipation pile including a polar dielectric material assembly including a plurality of polar dielectric material units. The polar dielectric material assembly is configured to interact with solar radiation. Surfaces of the polar dielectric material units each are configured to interact with the solar radiation to generate scattering of light. The polar dielectric material units each include an optical phonon configured to interact with thermal radiation to increase strength of the thermal radiation.

A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material bonded to the thermal-interface surface. The composite thermal-interface material comprises a particulate filler material dispersed within a metallic carrier material having a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials. The particulate filler material can have a higher bulk thermal conductivity than that of the metallic carrier material and can be wetted by the metallic carrier material, providing a bulk thermal conductivity of the composite thermal-interface material that is higher than that of the carrier material without the particulate filler material. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.

The present invention relates to a process for cooling a metal component, the process comprising the step of cooling said component in a confined space, said cooling involving cooling by means of a gas, the gas being cooled by heat exchange with a cooling surface of a heat sink inside said confined space, wherein a low frequency sound wave is provided into said confined space in order to improve heat exchange both between the gas and a cooling surface of the at least one heat sink, and between the gas and the metal component, characterised in that the cooling gas comprises at least one protective inert gas. The invention further relates to an apparatus for performing the process.

A composite heat dissipation device includes an electromagnetic radiation dissipation pile including a polar dielectric material assembly including a plurality of polar dielectric material units. The polar dielectric material assembly is configured to interact with solar radiation. Surfaces of the polar dielectric material units each are configured to interact with the solar radiation to generate scattering of light. The polar dielectric material units each include an optical phonon configured to interact with thermal radiation to increase strength of the thermal radiation.