The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

A method of achieving high heat transfer during cooling includes providing an aluminum body having an inner surface enclosing a channel, where the inner surface comprises microscale roughness features and microcavities configured to enhance nucleation site density during flow boiling. A refrigerant is transported through the channel. During the transport, the refrigerant absorbs heat from a thermal load and undergoes flow boiling. The heat is transferred to the refrigerant at an average heat transfer coefficient of at least about 10 kW/(m.sup.2.Math.K) at a mass flux of about 300 kg/(m.sup.2.Math.s).

A heat exchanger includes a bag-like outer packaging material. A heat medium flows into an inside of the outer packaging material. An inner core material is arranged in the inside of the outer packaging material. The outer packaging material has an outer packaging laminate material including a metal heat transfer layer and a resin thermal fusion layer on a surface side of the heat transfer layer. The outer packaging laminate materials form a bag shape by integrally joining the thermal fusion layers along the peripheral edge portions. The inner core material includes the inner core laminate material with a metal heat transfer layer and resin thermal fusion layers on surface sides of the heat transfer layer. The thermal fusion layers of a concave portion bottom and a convex portion top of the inner core material and the thermal fusion layers of the outer packaging laminate material are integrally joined.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A super-wetting layer is formed on a connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-wetting layer has a wetting angle of less than 10 degrees to water. Alternatively, a super-hydrophobic layer is formed on the connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-hydrophobic layer has a wetting angle of greater than 120 degrees to water.

Among two main surfaces of a heat dissipation member, one main surface is curved to be convex in an outward direction and the other convex in an inward direction. When a straight line passing through both endpoints P.sub.1 and P.sub.2 of the curve is l.sub.1, a point at which a distance to l.sub.1 on the curve is maximum is P.sub.max, an intersection point between l.sub.1 and a perpendicular drawn from P.sub.max to l.sub.1 is P.sub.3, a middle point of a line segment P.sub.1P.sub.3 is P.sub.4, an intersection point between the curve and a straight line that passes through P.sub.4 and is perpendicular to l.sub.1 is P.sub.mid, a length of the line segment P.sub.1P.sub.3 is L, a length of a line segment P.sub.3P.sub.max is H, and a length of a line segment P.sub.4P.sub.max is h, (2 h/L)/(H/L) is 1.1 or more.

A sink composed of metal, preferably composed of a solid metal block, in particular composed of aluminium, and also to a method and a tool for the production of same. The heat sink has a plurality of fluid lines for conducting cooling fluid which are separated from one another by heat sink ribs arranged between them, which are arranged next to one another and which run in a parallel manner. It is characterized in that the fluid lines are formed by grooves which are milled into the metal.

There are provided a heat exchanger having a flat tube and a fin bonded together, without causing melting of a coating material covering the fin, and a method of manufacturing thereof. A heat exchanger includes: a flat tube having a flat cross-sectional shape and covered with an anticorrosive layer; and a fin bonded to the flat tube with a bonding agent on a first surface of the anticorrosive layer interposed therebetween, and covered with a coating material, the first surface of the anticorrosive layer having been roughened, and the bonding agent being fixed to the roughened first surface.

Mg and Bi are contained in each of a first fillet in a first braze joining portion in which a tube and a fin join, a second fillet in a second braze joining portion in which the tube and a header plate join, and a third fillet in a third braze joining portion in which the header plate and a tank body join. A concentration of Mg of each of the first to third fillets is from 0.2% or more to 2.0% or less by mass. When the tube includes a brazing material layer, a concentration of Mg of the tube at its plate thickness center is from 0.1% or more to 1.0% or less by mass. When the fin includes a brazing material layer, a concentration of Mg of the fin at its plate thickness center is from 0.2% or more to 1.0% or less by mass.