A heat exchanger can be configured to utilize multiple sections of hardway fins that can be configured so that an upper first section of the fins can build up liquid head and a second lower section of the fins can be configured to distribute liquid in an even, or uniform, manner. The first section of fins can utilize a different type of hole arrangement than the second section of fins. For instance, the diameter or width of the holes in the first section may differ from the diameter or width of the holes of the second section. In addition (or as an alternative), fin frequency and/or spacing between immediately adjacent holes in the first section of fins may be different from the spacing between immediately adjacent holes in the second section of fins.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

The present disclosure relates to a heat exchanger and an air conditioner including the same. The heat exchanger may be provided for heat exchange between refrigerant and air. The heat exchanger may include a plurality of refrigerant tubes that are disposed with a clearance (C) therebetween in a first direction (A), in which the air moves, and are disposed to be spaced apart in a second direction (B) crossing the first direction (A) and a plurality of heat exchange fins that are disposed between the plurality of refrigerant tubes disposed to be spaced apart in the second direction (B).

An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

The present disclosure provides a louvered fin including a leading edge, a trailing edge, and a surface extending between the leading edge and the trailing edge. The surface defines a first set of holes along a first axis, a second set of holes along a second axis and offset from the first set of holes, and a third set of holes along a third axis and offset from the second set of holes. Each of the first axis, the second axis, and the third axis extends substantially parallel to a longitudinal axis of the fin. A first offset distance between the second and first set of holes is greater than a second offset distance between the third and second set of holes. The second and the third set of holes define a substantially obtuse trapezoidal matrix.

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

A heat exchanger prevents cracking in heat transfer plates while avoiding lowering heat-exchange efficiency. Heat transfer plates are arranged with a space between them, and a hollow pipe extends through the plates. A high-temperature gas flows through the space to exchange heat with a liquid in the hollow pipe. The heat transfer plates are elongated in the direction in which parts of the hollow pipe are aligned and can thus have thermal expansion accumulating in the elongation direction. The heat transfer plates each include a thermal expansion absorber between an edge of the heat transfer plate receiving inflow of the high-temperature gas and an inter-pipe portion between adjacent parts of the hollow pipe to absorb thermal expansion of the heat transfer plate. A selected one or more of the inter-pipe portions, rather than all, include the thermal expansion absorber.

A heat exchanger system is provided and includes a heat sink, fins arrayed on a central region of the heat sink to form channels between adjacent fins and an integrated blower. Each of the fins extends radially outwardly from the central region and has a height that increases with increasing distance from the central region. The integrated blower is disposed at the central region to generate flows of coolant directed into and through the channels.