A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod includes a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

Embodiments of the present disclosure provide techniques and configurations for a semiconductor package with thermal fins, in accordance with some embodiments. In embodiments, a package assembly includes a die and a mold compound disposed on the die, to encapsulate the die. The package may further include a thermal solution including one or more thermal fins attached to the mold compound at their respective ends. The thermal fins may be disposed substantially flat on a top surface of the mold compound at a first temperature, and rise away from the top surface of the mold compound in response to a change of temperature to a second temperature, to reach an enclosure that surrounds the package assembly, to provide direct heat conductivity between the die and the enclosure. The second temperature may be greater than the first temperature. Other embodiments may be described and/or claimed.

A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.

A shape-morphing fin includes a fixed portion, a multistable portion, a coupling portion, and a vibration source. The multistable portion functions as a negative stiffness element. The multistable portion is selectively movable between a first position and a second position. The movement between first position and the second position is configured to remove the ice formation from the structure. The coupling portion couples the fixed portion to the multistable portion. The vibration source is configured to produce a resonant vibration to engage the movement of the multistable portion from the first position to the second position.

A heat exchanger comprises a base, and a plurality of deformable fins connected to a surface of the base. Some deformable fins have a free end configured to move away from the surface of the base as a function of a local temperature increase of the base. The deformable fins are distributed on the surface of the base to be exposed to a coolant flowing over the surface of the base, wherein a distribution of the deformable fins on the surface of the base is non-uniform.

A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod may include a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

A heat sink includes a threaded rod. The spacing between a first fin and a second fin of the heat sink may be adjusted by the threaded rod. The threaded rod includes a first portion and a second portion. The first portion may engage with the first fin and a second portion may engage with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first knurl of the threaded rod may be smaller than the pitch of a second threaded knurl of the threaded rod. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

A valve for a heat exchanger includes a base configured to be positioned adjacent to an inlet end of a heat exchanger, a heating element positioned on the base, and a flap connected to the base that is movable between an open position and a closed position. The open position permits the flow of fluid into the inlet end of the heat exchanger and the closed position blocks the flow of fluid into the inlet end. The flap is made from a heat responsive material.

A heat exchanger includes a heat transfer tube and a baffle. The baffle includes a main body portion, a first protruding portion, a second protruding portion, a first wall, and a second wall. The first protruding portion protrudes from the main body portion into a first space and the second protruding portion protrudes into a second space. The first wall includes a first protruding wall and a second protruding wall. The second wall includes a third protruding wall and a fourth protruding wall. The first protruding wall and the third protruding wall protrude into the first space and the second protruding wall and the fourth protruding wall protrude into the second space.

A cooling structure includes a plurality of heat radiation parts configured to cool a heat generating component and a holding member configured to hold the plurality of heat radiation parts. Moreover, the heat radiation parts of the cooling structure each include a base portion located on the side of the heat generating component and a fin portion extending from the base portion and radiating heat. Furthermore, the base portions of the heat radiation parts abut on each other.