A flexible graphite sheet support structure forms a thermal management arrangement for device having a heat source. The flexible graphite sheet support structure includes first and second spaced apart support members and a flexible graphite sheet secured to the spaced apart support members forming a free standing flex accommodating section that spans between them. Curve retention members having convex curved surfaces are used to keep the flex accommodating section in a bell shaped curve while preventing the flexible graphite sheet from exceeding a minimum bend radius. The thermal management arrangement formed by the flexible graphite sheet support structure enables the flexible graphite sheet to move heat from one support structure to the other while reducing the transmission of vibration between them and allowing relative movement between the spaced apart support structures.

The invention relates to a heat exchanger for a battery, in particular for a hybrid drive, with connections for the inflow and outflow of a heat exchange medium and with a frame which is connected on both sides with film walls to form a pouch through which a flow can pass, wherein the frame comprises flow guiding elements The invention is characterised in that the frame comprises a separating plate with two parallel lateral surfaces, wherein the separating plate divides the pouch into a first chamber and a second chamber which are delimited in a fluid-tight manner by the lateral surfaces and the respective film walls, wherein in each of the lateral surfaces a channel field of parallel flow channels is formed, the inflow side of which is fluidically connected via a distributor channel and the outflow side of which is fluidically connected via a collecting channel to the respective connections. The invention also relates to a battery with at least one heat exchanger, a vehicle with one such battery as well as a manufacturing method for the heat exchanger.

When products to be shipped are temperature-sensitive, it is necessary to maintain a substantially uniform and constant temperature to avoid spoilage. As a result, thermal shields are often placed on top of the products. Many designs for thermal shields have been considered in the past but improvements are still desired. Accordingly, there is provided a multilayer thermal shield (100) comprising a thermally conductive layer (108), and at least one heat exchange fluid circuit (120) coupled to a first surface of the thermally conductive layer, the at least one heat exchange fluid circuit comprising at least one inlet (124) configured to permit the ingress of heat exchange fluid. The thermal shield further comprises an outer insulation layer (104) connected to a first surface of the thermally conductive layer (108) and comprising grooves designed to receive the heat exchange fluid circuit. The thermal shield further comprises an inner insulation layer (110) connected to a second surface of the thermally conductive layer (108).

A cooler module has a cooling tube and a support member. The cooling tube has a first protruding tube portion and a second protruding tube portion. The first protruding tube portion is provided with a first flexible portion formed in an annular shape. The second protruding tube portion is provided with a second flexible portion formed in an annular shape. The support member has a first fitting portion fitted to the first protruding tube portion and a second fitting portion fitted to the second protruding tube portion. The support member supports a longitudinal center portion of the cooling tube on a condition that the first protruding tube portion and the first fitting portion are fitted together, the second protruding tube portion and the second fitting portion are fitted together, and the first flexible portion and the second flexible portion are recessed toward an inside of the cooling tube.

A heat exchanger is provided. The heat exchanger includes a core that receives a plurality of mediums. The heat exchanger includes a manifold. The manifold includes a first end that receives a first medium of the plurality of mediums. The manifold includes a second end that intersects the core at a manifold/core interface. The manifold includes a plurality of individual layers that provide gradual transitions for the first medium from the first end to the second end to reduce or eliminate discontinuities at the manifold/core interface that cause stress to the heat exchanger.

A method of manufacturing a heat exchanger array that includes stacking a plurality of heat exchanger units in an aligned configuration with respective first ports of the plurality of heat exchanger units aligned. The method can further include generating heat in the first coupling elements at the same time and at a temperature sufficient to generate a first plurality of respective couplings between adjacent sheets of adjacent heat exchanger units about adjacent first ports and without a coupling being generated between the first and second sheets of a given heat exchanger unit.

A heat transfer apparatus includes an outer shell, an internal core body, and a flexible diaphragm extending from the core body to an interior surface of the outer shell. The shell includes a first inlet that receives a first fluid, a second inlet that receives a second fluid, a first outlet through which the first fluid exits the shell, and a second outlet through which the second fluid exits the shell. The core body forms first interior passageways that fluidly couple the first inlet with the first outlet and second interior passageways that fluidly couple the second inlet with the second outlet. The flexible diaphragm forms a flexible transition between each of the first inlet and the second inlet of the shell and the core body, and forms a seal that prevents the first fluid in the first interior passageways from flowing into the second interior passageways.

A cold plate structure, wherein a thermally active region includes fins metal injection molded in a single piece with a fin base sufficiently thin so that the active region mechanically conforms to the heat generating device that the cold plate cools. The fin base is formed as a common structure with a bottom wall of the cold plate, reducing thermal resistance between the device and the fins and also enhancing mechanical flexibility. Another cold plate structure can include multiple thermally active regions, with flexible outer walls and a reduced thickness between active regions, allowing for position variation between multiple heat generation devices that are cooled by the common cold plate. A common base having multiple physically separate active regions can be metal injection molded in a single step, or bases of multiple active regions can be formed individually and joined later to form a common single cold plate structure.

Negative-stiffness-producing mechanisms can be incorporated with structural devices that are used on spacecraft that provide thermal coupling between a vibrating source and a vibration-sensitive object. Negative-stiffness-producing mechanisms can be associated with a flexible conductive link (FCL) or “thermal strap” or “cold strap” to reduce the positive stiffness of the FCL. The negative-stiffness-producing mechanisms can be loaded so as to create negative stiffness that will reduce or negate the natural positive stiffness inherent with the FCL. The FCL will still be able to provide maximum thermal conductance while achieving low or near-zero stiffness to maximize structural decoupling.

A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.