Example implementations include a camera and a thermal management apparatus for a camera including an outer housing walls, an inner bracket for mounting a camera component. The camera and thermal management apparatus further includes a thermal bridge assembly for selectively increasing a thermal conductivity between the inner bracket and the outer housing walls.

A heat exchanger includes a flow channel operatively connecting a channel inlet to a channel outlet to channel fluid to flow therethrough. The flow channel is defined at least partially by a shape change material. The shape change material changes the shape of the flow channel based on the temperature of the shape change material.

A heat exchanger includes a flow channel operatively connecting a channel inlet to a channel outlet to channel fluid to flow therethrough. The flow channel is defined at least partially by a shape change material. The shape change material changes the shape of the flow channel based on the temperature of the shape change material. The shape change material can include a shape-memory alloy, for example. The shape-memory alloy can include at least one of a nickel-titanium alloy (NiTi), Cu—Al—(X), Cu—Sn, Cu—Zn—(X), In—Ti, Ni—Al, Fe—Pt, Mn—Cu, or Fe—Mn—Si.

A beverage container cooling unit has: (a) a housing having a slot for receiving a container therein, (b) a cooling element having a cold supply, (c) a heat conductive panel enabling heat transfer between a container provided in the slot and the cold supply; wherein the heat conductive panel has two material layers fixed against one another: (I) a first material layer defining a cooling surface facing the container receiving slot and an opposed surface, said first layer made of a material having a thermal expansion coefficient of X.sub.1; (ii) a second material layer having a contact surface facing positioned against the opposed surface of the first material layer and a second opposed surface, the second material layer having a thermal expansion coefficient of X.sub.2, different from X.sub.1, the difference in thermal expansion causing the conductive panel to bulge at a change in temperature.

According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.

Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.

Example implementations include a camera and a thermal management apparatus for a camera including an outer housing walls, an inner bracket for mounting a camera component. The camera and thermal management apparatus further includes a thermal bridge assembly for selectively increasing a thermal conductivity between the inner bracket and the outer housing walls.

An apparatus and method for cooling a fluid within a turbine engine. A fan casing assembly for the turbine engine can include an annular fan casing with a peripheral wall having a flow path defined through the casing. A fan casing cooler includes a body to confront the peripheral wall with at least one conduit configured to carry a flow of heated fluid to convectively cool the heated fluid with a flow of air through the flow path.

A heat exchanger is configured to adjust a flow restriction of flow passages through the heat exchanger in response to changes in temperature of elements that define at least a portion of the flow passages. The elements include a first material having a first coefficient of thermal expansion, and a second material having a second coefficient of thermal expansion that is different from the first coefficient of thermal expansion.

Heat transfer devices, electronic devices, and methods for heat transfer with an external body. Heat transfer devices include a first disc, a second disc positioned adjacent to the first disc, and at least one spacer positioned between the first disc and the second disc. The first disc defines an aperture and comprises a pin cooling structure extending from around the aperture. The pin cooling structure comprises a distal end configured to facilitate heat exchange between the pin cooling structure and an external/adjacent/separate body and one or more side walls. At least one of the one or more side walls, the distal end, and the aperture at least partially define a pin volume. The second disc defines an inlet that is configured to (i) receive a fluid, and (ii) allow the fluid to flow from the inlet and into the pin volume.