A heat exchanger system includes a heat exchanger device, which has elastocaloric elements made of elastocaloric material and is designed to move the elastocaloric elements, as a result of which said elements are deformed, so that an elastocaloric effect is achieved. The heat exchanger system further includes a vibrating unit, which generates mechanical vibrations, and a vibration transfer device arranged between the vibrating unit and the heat exchanger device, and which transfers the vibrations from the vibrating unit into the elastocaloric elements so that the elastocaloric elements move.

A phase change cell includes a housing enclosing a phase change chamber that holds a phase change material and a gas pocket. The housing includes a side wall extending between first and second end walls. A capillary is disposed in an interior surface of the side wall. In response to heating of the phase change cell, the capillary is configured to draw the phase change material in a liquid phase towards the periphery of the phase change chamber. A temperature sensor is coupled to the housing in a vicinity of the capillary to measure the phase change temperature. According to another aspect, the housing includes a moveable surface that bounds a portion of the phase change chamber. The phase change temperature of the phase change material changes based on the position of the moveable wall.

A thermal rectifier includes a first panel, a second panel, and a switching mechanism. The switching mechanism includes a first thermally conductive portion thermally connected to the first panel and a second thermally conductive portion thermally connected to the second panel. The switching mechanism switches, as at least one of the first thermally conductive portion or the second thermally conductive portion changes their shape or dimensions, from a heat radiation state to a heat insulation state, or vice versa. The heat radiation state is a state where the first thermally conductive portion and the second thermally conductive portion are thermally coupled together. The heat insulation state is a state where the first thermally conductive portion and the second thermally conductive portion are thermally isolated from each other.

A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.

A thermal management system includes a heat exchanger and a housing that receives the heat exchanger. The heat exchanger defines a heat transfer region within which thermal exchange occurs between a process fluid and a thermal management fluid. The thermal management system further includes a process fluid conduit to convey the process fluid through the heat transfer region and an actuator assembly configured to position the heat exchanger relative to the housing. The actuator assembly is configured to selectively assume a position between a stowed position and a deployed position. When the actuator assembly is in the deployed position, the heat transfer region extends within a flow of the thermal management fluid such that the process fluid flow flows in heat exchange relation with the thermal management fluid flow. In some such embodiments, the actuator assembly automatically transitions between the stowed position and the deployed position.

A socket includes a housing configured to receive a removable Data Storage Device (DSD) and a Thermal Interface Material (TIM). An assembly of the socket is attached to the housing and configured to expand due to heat. In a thermally expanded state, the assembly causes the TIM to come into contact with the removable DSD to draw heat away from the removable DSD. According to another aspect, a retaining strip or assembly is attached to a housing in a configuration such that the retaining strip or assembly expands due to heat to increase a resistance to removal of the removable DSD from the housing when the retaining strip or assembly is in a thermally expanded state.

A heat sink assembly can comprise a heat sink and a shaping element made of a shape memory material. The shaping element is incorporated into the heat sink assembly in an assembly shape. An actuation energy can cause the shape memory material to change the shaping element to an actuation shape, and the actuation shape can produce a thermal coupling shape in the heat sink. A method comprises forming a shaping element, of a shape memory material, into an actuation shape. The method includes re-forming the shaping element from the actuation shape into an assembly shape and incorporating the shaping element in a heat sink assembly that includes a heat sink. In the method, applying an actuation energy causes the shape memory material to change the shaping element from the assembly shape to the actuation shape to produce a thermal coupling shape in the heat sink.

An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

An electronic subassembly includes an enclosure, a circuit board, a plurality of electronic components, and a plurality of flexible elastic thermal elements. Each flexible elastic thermal bridge is disposed in the gap between a different one of the electronic components and a first wall of the enclosure. Each flexible elastic thermal bridge includes a first thermally conductive metallic structure, a second thermally conductive metal structure, and an elastically deflectable thermal element. The first thermally conductive metallic structure contacts the first wall. The second thermally conductive metallic structure contacts the top surface of the electronic component and is spaced apart from the first thermally conductive metallic structure to define a void. The elastically deflectable thermal element is disposed in the void and directly contacts both the first thermally conductive metallic structure and the second thermally conductive metallic structure. The elastically deflectable thermal element comprises at least one thermally conductive material.

A heat dissipation device for an electronic device is provided. The heat dissipation device comprises a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity; and a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. With a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device.