The present disclosure relates to a technical idea of reducing the surface temperature of a material or temperature under a material by emitting heat under a device to the outside by absorbing and emitting long-wavelength infrared light corresponding to the wavelength range of the atmospheric window while minimizing absorption of light of the solar spectrum. More particularly, the present disclosure relates to a technology for providing a radiative cooling device having a multilayer structure that is capable of increasing sunlight reflection through differences in the refractive indexes of the device-forming materials while performing selective emission over the wavelength range of the atmospheric window using a radiative cooling device having a multilayer structure composed of polymers and inorganic materials.

A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

Thermally conductive materials comprising an olefin block composite and a thermally conductive filler, where the thermally conductive filler is present in an amount sufficient to increase the thermal conductivity of the olefin block composite relative to the olefin block composite in its neat state. Such thermally conductive materials can be used in various articles of manufacture, such as a thermal interface material or a molded heat dissipation component.

A method for forming a hybrid heat exchanger is provided. The method includes laser-texturing a metal surface to create a plurality of microstructures and subsequently melt-bonding a plastic component to the plurality of microstructures. During melt-bonding, plastic material penetrates the plurality of microstructures and conforms to the plastic component to the metal surface. After hardening inside the microstructures, the plastic component adheres to the metal surface as a hybrid component. As a result, a fastener or snap connection is not required, and the plastic-metal joint provides a barrier to water, glycol-based fluids, air, and other fluids.

Provided is a method of manufacturing a heat radiation sheet. The method includes the steps of: electrospinning a first spinning solution comprising an adhesive, first heat conductive particles, and a first solvent to form an adhesive layer in a form of a nano-web having a plurality of pores; mixing second heat conductive particles and a second solvent to obtain a second spinning solution; electrospinning the second spinning solution onto the adhesive layer to form an intermediate layer; mixing a polymer material, a third solvent, and third heat conductive particles to obtain a third spinning solution; and electrospinning the third spinning solution onto the intermediate layer to form a heat radiation layer in a form of a web on the intermediate layer.

Aspects of the disclosure are directed to methods and/or apparatuses involving one or more of a conductive polymer, deposition of a conductive polymer and 3D (three-dimensional) printing of a continuous bead of material. As may be implemented in accordance with one or more embodiments characterized herein, a 3D structure is formed as follows. A stacked layer is formed by depositing a continuous bead of material along an uninterrupted path that defines a first layer of the 3D structure. A sidewall of the 3D structure is formed with opposing surfaces respectively defined by successive stacked layers of the 3D structure by, for each stacked layer (including the first layer), depositing the continuous bead of material along the path and with a surface thereof in contact with a surface of the continuous bead of material of an adjacent one of the stacked layers.

A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 μm and a second peak at 55-195 μm. A ratio between a volume distribution area at particle diameters of 1-35 μm and a volume distribution area at particle diameters of 45-205 μm is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 μm, and the Au layer having a film thickness of 0.05 μm or larger.

In one embodiment, a phase change material is encapsulated by forming a phase change material pellet, coating the pellet with flexible material, heating the coated pellet to melt the phase change material, wherein the phase change materials expands and air within the pellet diffuses out through the flexible material, and cooling the coated pellet to solidify the phase change material.

The invention relates to a heat exchanger comprising one tube, and preferably a plurality of tubes, which extend through a heat-exchange chamber starting from a tube sheet, wherein the tube sheet is made of a fiber-reinforced plastics material. The invention further relates to a method for producing a heat exchanger of this kind and to the use of a heat exchanger of this kind.

A thermally conductive resin molded article having a resin and a thermally conductive filler is provided. The thermally conductive filler is oriented substantially in the thickness direction of the thermally conductive resin molded article. The volumetric filling factor of the thermally conductive filler in the thermally conductive resin molded article is 20-80% by volume. Weld lines in the resin are formed substantially in the thickness direction of the thermally conductive resin molded article. An oil component is included in the thermally conductive resin molded article.