The present invention relates to an enhanced heat dissipation module, a cooling fin structure and a stamping method thereof. The enhanced heat dissipation module includes a first cooling fin and a second cooling fin. The first cooling fin includes a first tapered tunnel protruding outwards, and the second cooling fin includes a second tapered tunnel protruding outwards. The first tapered tunnel and the second tapered tunnel jointly encircle and form a flow guide channel. Accordingly, a pressure difference is generated by hot air passing through the tapered tunnels, thereby increasing natural thermal convection and further enhancing heat dissipation efficiency of the cooling fins.

A method includes providing a first metal sheet and a second metal sheet, printing patterns of a plurality of obstructers, a plurality of channels, an evaporator channel, a condenser channel, and a connecting channel on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, the evaporator channel, the condenser channel, and the connecting channel by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

A transfer tube for a thermal transfer device can include at least one wall having an inner surface and an outer surface, where the inner surface forms a cavity, where the at least one wall further has a first end and a second end. The first end can be configured to couple to a terminus of a heat exchanger of the thermal transfer device. The second end can be configured to couple to a collector box of the thermal transfer device. At least a portion of the at least one wall can be disposed in a vestibule of the thermal transfer device. The cavity can be configured to simultaneously receive a first fluid that flows from the first end to the second end and a second fluid that flows from the second end to the first end.

A finned heat sink (1) comprising a stack of N finned heat sink plates (3). The N finned heat sink plates comprise a top plate (3a) on top of a bottom plate (3b) and optionally at least one sandwiched plate (3c). The bottom plate (3b), the top plate (3a) and the sandwiched plate (3c) comprise a heat dissipating fin (9) and an opening (7). The fins (9) are bent out of plane of the plates (3). The fin (9) of the bottom plate (3b) and the sandwiched plate (3c) extend through the opening (7a) in the top plate (3a) in the same direction as the fin (9a) of the top plate (3a).

The present invention relates to a capsule type heat conduction column and a method for manufacturing the same. The method comprises the steps of mixing a thermally conductive base material thoroughly, stuffing and compacting the thermally conductive base material into a capsule formed by a first pipe and a second pipe, and sealing the capsule by a plurality of thermal interface materials. Each of the first pipe and the second pipe has a first opening and a second opening at two terminals thereof, and the second opening of the first pipe is assembled to the first opening of the second pipe.

The present invention relates to a capsule type heat conduction column and a method for manufacturing the same. The method comprises the steps of mixing a thermally conductive base material thoroughly, stuffing and compacting the thermally conductive base material into a capsule formed by a first pipe and a second pipe, and sealing the capsule by a plurality of thermal interface materials. Each of the first pipe and the second pipe has a first opening and a second opening at two terminals thereof, and the second opening of the first pipe is assembled to the first opening of the second pipe.

A manufacturing method of heat dissipation unit includes steps of: providing a mold having an upper mold section and a lower mold section, the lower mold section being formed with a receiving depression and at least one sink; providing an upper plate, a lower plate, a capillary structure and at least one heat conduction member, the heat conduction member being positioned in the sink, the lower plate, the capillary structure and the upper plate being sequentially positioned in the receiving depression, then the heat conduction member, the lower plate, the capillary structure and the upper plate being thermally pressed and connected with each other by means of the upper and lower mold sections; and integrally connecting the heat conduction member with the lower plate when the upper and lower plates are thermally pressed and connected to form the plate body by means of the upper and lower mold sections.

A secondary heat exchanger includes a case and a first heat transfer tube portion. The case includes a box body and a first closing member. The box body is provided with a second opening on one side in a third direction. A first assembly in which the first heat transfer tube portion and the first closing member are assembled integrally is mounted to the box body so that a plurality of first heat transfer tubes are is inserted into the box body from the second opening and so that the second opening is closed by the first closing member.

A heat exchanger and a fin are provided. The heat exchanger includes: a fin. The fin includes a fin body and a flange, the fin body being provided with a heat exchange tube hole, the flange being provided on the fin body and surrounding the heat exchange tube hole; and a heat exchange tube passing through the heat exchange tube hole and connected to the flange. The flange includes a first sub-flange and a plurality of second sub-flanges, the first sub-flange is connected to the fin body, the plurality of second sub-flanges are connected to the first sub-flange and spaced apart from one another, and a height of the first sub-flange is less than a height of the second sub-flange.