The disclosure provides a heat exchanger and an, air conditioner with the heat exchanger. A heat exchange assembly includes a first channel and a second channel which are used for allowing a refrigerant to pass through, a communication portion communicated with the first channel and the second channel, and a plurality of protrusions.

A heat exchanger adapted to transmit a first fluid through an interior, having a tubular body receptive of a second fluid, whereby heat transfer occurs between the fluids is provided, the tubular body extending longitudinally through the interior, having a non-circular cross-section, and being formed to define microchannels extending longitudinally along the tubular body through which the second fluid is transmitted.

Counter-flow heat exchanger is constructed with plenums at either end that separate the opposing fluids, the channels of which are arrayed in a checkerboard patterns, such that any given channel is surrounded by channels of opposing streams on four sides—laterally on both sides and vertically above and below.

This invention relates to a method of manufacturing an object with microchannels provides therethrough, and more particularly, but not exclusively, to a method of manufacturing a micro heat exchanger with microchannels provided therethrough. The method includes the steps of providing a metal base layer made from a first metal; forming a plurality of spaced apart ridges, made from a second metal, on the base layer; depositing more of the first metal onto the ridges in order to cover the ridges; and re moving the ridges using a chemical etching process so as to produce microchannels in a body made of the first metal.

A microchannel evaporator includes a plurality of microchannels. Each of the plurality of microchannels includes a first end and a second end. A first end-tank is coupled to each first end of the plurality of microchannels and a second end-tank is coupled to each second end of the plurality of microchannels. A second-fluid inlet is coupled to either the first end-tank or the second end-tank and configured to receive a fluid into the microchannel evaporator and a second-fluid outlet is coupled to either the first end-tank or the second end-tank and configured to expel the fluid from the microchannel evaporator. Each microchannel of the plurality of microchannels includes at least one bend along a length thereof.

A tubing element for a heat exchanger is at least partially a rigid elongated tubing having a first end, a second end, a first side wall and a second side wall. First and second side walls are substantially parallel to each other. The distance between first side wall and second side wall is considerably smaller than the width of first side wall and second side wall, resulting in a substantially overall flat tubing structure with connection walls on both sides. The tubing element has a plurality of fins on at least one of the outer surfaces of the first side wall and/or of the second side wall. Fins define an angle enclosed by the fins and a connection wall. A heat exchanger, use of a tubing element, use of a heat exchanger and method of manufacturing of a tubing element to manufacture at least partially a heat exchanger are included.

Embodiments disclosed herein describe manifold microchannel heat sinks having a gridded microchannel assembly with free-form fin geometries for cooling heat-generating devices in the electronics modules. In an embodiment, a manifold microchannel heat sink includes a target surface and a gridded microchannel assembly comprising a plurality of microchannel cells. Each microchannel cell is surrounded by thermally-conductive sidewalls and includes a fluid inlet, a microchannel structure fluidly coupled to the fluid inlet and a fluid outlet. The microchannel structure extends from the target surface and defines a microchannel extending in a normal direction with respect to the target surface. The microchannel structure includes a base plate disposed on the target surface and a three-dimensional fin structure disposed on the base plate. The three-dimensional fin structure has a shape optimized for thermal performance and fluid performance.

An evaporator may be provided comprising a manifold, a plurality of micro-channel passageways, a distributor, and a separator. The manifold may comprise a shell defining a cavity. The plurality of micro-channel passageways may extend outwardly from the shell of the manifold, wherein the cavity may be in fluid communication with the plurality of micro-channel passageways. The distributor may comprise an inlet, an elongated body extending into the cavity of the manifold and defining a lumen, and a plurality of openings arranged on an outer surface of the elongated body and spaced along a length of the elongated body, wherein the openings may be configured to allow fluid communication between the lumen and the cavity of the manifold. The separator may be positioned between the plurality of openings within the cavity of the manifold.

Apparatuses, systems and methods implementing a multi-coil heat exchanger are directed to providing good heat transfer performance, capacity, and efficiency, and while reducing pressure drop through multi-coil microchannel evaporators. The multi-coil heat exchanger in some examples is a multi-coil microchannel evaporator. The multi-coil microchannel evaporator can be implemented in a refrigerant system that is a single circuit, where the multi-coil microchannel evaporator is an air to refrigerant type heat exchanger. The multi-coil microchannel evaporator includes a distribution to the multiple coils of the multi-coil microchannel evaporator, where the distribution includes one or more separations to transmit refrigerant to each of the coils of the multi-coil microchannel evaporator and one or more junctions to transmit refrigerant from the coils.

Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.