A pump is provided having a communication portion that provides continuous communication between a pump section and a discharge section in a state where a discharge-side check valve suppresses a backflow, and a size of the communication portion is set so that, when the continuously expanding and contracting pump section contracts, a volume of gas mixed in liquid in the pump section is contracted.

The present invention relates to a pump (15) for pumping a coolant (9) within a Dewar vessel (1) and to a corresponding Dewar vessel (1) for storing samples in a coolant (9). The Dewar vessel (1) comprises a thermally insulated reservoir (3) for the coolant (9) and a sample vessel (11) provided separately and arranged in the thermally insulated reservoir (3). The reservoir (3) is connected to the sample vessel (11) in such a way that the level of coolant (9) is constant in the sample vessel (11). Pump (15) may help in keeping the level of coolant (9) in the sample vessel (11) constant. For this purpose the pump (15) comprises a chamber (17) with an inlet (19) and an outlet (21), a closing element (23) and a pressure increasing device (25). Therein, the inlet (19) is connectable to the reservoir (3) and the outlet (21) is connectable to a sample vessel (11) of the Dewar vessel (1). The chamber (17) is adapted to fill with coolant (9) through the inlet (19) by gravity and the closing element (23) is adapted to automatically close the chamber (17) when it is full of coolant (9). The pressure increasing device (25) is adapted to increase the pressure within the chamber (17), after the chamber (17) is closed, until the coolant (9) is released through the outlet (21).

A thermal-pumping apparatus according to a non-limiting example embodiment may include a first volume structure defining a first inlet opening and a first outlet opening in fluid communication with a first volume, a second volume structure defining a second inlet opening and a second outlet opening in fluid communication with a second volume, and a connection structure joining the first outlet opening of the first volume structure to the second inlet opening of the second volume structure. The connection structure may include a one-directional valve configured to allow fluid flow between the first and second volume structures in one direction only from the first volume of the first volume structure to the second volume of the second volume structure.

A thermal-pumping apparatus according to a non-limiting example embodiment may include a first volume structure defining a first inlet opening and a first outlet opening in fluid communication with a first volume, a second volume structure defining a second inlet opening and a second outlet opening in fluid communication with a second volume, and a connection structure joining the first outlet opening of the first volume structure to the second inlet opening of the second volume structure. The connection structure may include a one-directional valve configured to allow fluid flow between the first and second volume structures in one direction only from the first volume of the first volume structure to the second volume of the second volume structure.

A heat-activated pump removes waste heat from an electronic chip. An evaporator integrated into the chip packaging receives heat from the chip, converting a working fluid into vapor. Piping from the evaporator to a heat exchanger and back form a fluid circulation system. A pressure-control valve set for a specified electronic operating temperature allows vaporized working fluid to vent into a liquid-piston chamber, where it expands adiabatically, displacing pumped liquid in a pumping stage and expelling it from the chamber through a unidirectional valve to the shared heat exchanger(s). The heat exchanger(s) has a heatsink transferring heat away to a flow of cooler fluid. The pumped liquid returns in a suction cycle to the chamber through another unidirectional valve. An injector valve returns jets of condensed working fluid to the evaporator in successive brief spurts responsive to periodic pressure pulses in the chamber.

A heat-activated pump removes waste heat from an electronic chip. An evaporator integrated into the chip packaging receives heat from the chip, converting a working fluid into vapor. Piping from the evaporator to a heat exchanger and back form a fluid circulation system. A pressure-control valve set for a specified electronic operating temperature allows vaporized working fluid to vent into a liquid-piston chamber, where it expands adiabatically, displacing pumped liquid in a pumping stage and expelling it from the chamber through a unidirectional valve to the shared heat exchanger(s). The heat exchanger(s) has a heatsink transferring heat away to a flow of cooler fluid. The pumped liquid returns in a suction cycle to the chamber through another unidirectional valve. An injector valve returns jets of condensed working fluid to the evaporator in successive brief spurts responsive to periodic pressure pulses in the chamber.

A microfluidic pump on a monolithic chip. A closed length of channel is disposed on the chip, with a plurality of energizers disposed along the length of the channel. Each energizer is associated with a unique energizer designation. An onboard controller and energizer fire control lines are also disposed on the chip. One each of the energizer fire control lines is electrically connecting one each of the energizers to the onboard controller. Inputs are electrically connected to the onboard controller, for connecting the onboard controller to an external controller that is not disposed on the chip. The inputs include a power input, a ground input, and an enable input. The onboard controller has circuitry to (a) receive from the external controller an enable on the enable input, (b) send a timed sequence of fire commands on the energizer fire control lines to a selected number of energizers that is greater than one, starting with a stored starting energizer and ending with an ending energizer, and (c) update the stored starting energizer with the designation for the energizer next following the ending energizer.

A solid particulate pump includes a plurality of segments linked to each other in a serial, closed loop arrangement with gaps between neighboring pairs of the segments. A flexible seal extends across the gaps and seals an interior of the closed loop arrangement from an exterior of the closed loop arrangement.

A solid particulate pump includes a plurality of segments linked to each other in a serial, closed loop arrangement with gaps between neighboring pairs of the segments. A flexible seal extends across the gaps and seals an interior of the closed loop arrangement from an exterior of the closed loop arrangement.

A magnetic fluid drive unit 100 having a double tube 10 comprising an inner tube 11 and an outer tube 12 formed on the outer side of the inner tube 11, and a magnetic field applicator 30 installed on the outer side of the double tube 10, the inner tube 11 having, in the region where a magnetic field is applied by the magnetic field applicator 30, a high heat conducting region 21 and a low heat conducting region 22 aligned in the lengthwise direction of the inner tube 11, the inside of the inner tube 11 being a heating medium flow path, and the area between the inner tube 11 and the outer tube 12 being a magnetic fluid flow path.