A heating system for heating a heat shrink layer of a heat shrink component during a heat shrink process includes a heating unit arranged in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heating unit has a first heating zone and a second heating zone. The first heating zone has a different heating energy than the second heating zone for a period of time of the heat shrink process.

A heat shrink component includes a heat shrink layer and a heating unit in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heating unit includes an electrically conductive lead formed of copper and/or aluminum and having an electrical conductivity of more than 3.Math.10.sup.7 S/m. The heat shrink component has a first dimension in an expanded state and a second dimension in a shrunk state after heating. The first dimension is larger than the second dimension.

A heat shrink component includes a heat shrink layer and a heating unit in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heating unit includes an electrically conductive lead formed of copper and/or aluminum and having an electrical conductivity of more than 3.Math.10.sup.7 S/m. The heat shrink component has a first dimension in an expanded state and a second dimension in a shrunk state after heating. The first dimension is larger than the second dimension.

A conduit embedded in thermoplastic and adhered to a pipeline with a porous material assisting in the adhesion. The porous material is adhered to the pipeline, the porous material having at least some pores occupied by the thermoplastic. The porous material may be a sleeve of fibrous material. The adhesion may be accomplished by positioning a sleeve of fibrous material around a guide, bringing the thermoplastic into contact with the sleeve and heating the thermoplastic to cause the thermoplastic to enter pores of the sleeve. The guide forms a barrier preventing the thermoplastic from reaching a portion of the sleeve, and that portion is adhered to the object. This method may also be applied to adhere a thermoplastic, with or without a conduit, to any object.

A conduit embedded in thermoplastic and adhered to a pipeline with a porous material assisting in the adhesion. The porous material is adhered to the pipeline, the porous material having at least some pores occupied by the thermoplastic. The porous material may be a sleeve of fibrous material. The adhesion may be accomplished by positioning a sleeve of fibrous material around a guide, bringing the thermoplastic into contact with the sleeve and heating the thermoplastic to cause the thermoplastic to enter pores of the sleeve. The guide forms a barrier preventing the thermoplastic from reaching a portion of the sleeve, and that portion is adhered to the object. This method may also be applied to adhere a thermoplastic, with or without a conduit, to any object.

A method for forming a connection between two tubular sections having a polymeric outer surface jacket, using electrofusion to fusion bond a casing of similar, non-crosslinked polymer to the outer surface of the tubular sections.

The invention described herein relates to reservoirs within appliances. The present invention includes a reservoir made of a length of reservoir tubing. In particular embodiments, the length of the reservoir tubing is formed in an overlapping circular portion and conforms to the available space requirements within an appliance. Particular embodiments of the present invention include reservoirs, reservoir systems including a reservoir, processes for forming a reservoir, and processes for forming the aforementioned reservoir systems.

A heat shrink component includes a heat shrink layer and a heating unit in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heating unit includes an electrically conductive lead formed of copper and/or aluminum and having an electrical conductivity of more than 3.Math.10.sup.7 S/m. The heat shrink component has a first dimension in an expanded state and a second dimension in a shrunk state after heating. The first dimension is larger than the second dimension.

A heat shrink component includes a heat shrink layer and a heating unit in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heating unit includes an electrically conductive lead formed of copper and/or aluminum and having an electrical conductivity of more than 3.Math.10.sup.7 S/m. The heat shrink component has a first dimension in an expanded state and a second dimension in a shrunk state after heating. The first dimension is larger than the second dimension.

A pipe joining system and pipe joint are shown m which two sections of molecularly oriented pipe are joined using heat shrinking techniques. A first section of pipe is provided having a straight, pre-formed socket with an internal diameter and with an end opening having enough clearance to allow a mating spigot section having a given external diameter to be inserted into the socket end opening. After the spigot end is inserted to a given depth, the socket is heated sufficiently so that the internal diameter of the socket end comes into contact with the external diameter of the spigot end, the molecularly oriented pipe being in a rubbery state and exhibiting a low elastic modulus which allows the socket end to conform tightly to the spigot end external diameter without deforming the spigot end.