Patent classifications
F21V29/87
Light module
An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.
Heat dissipation structure for lamp and LED lamp
Examples of the disclosure disclose a heat dissipation structure for a lamp, which includes: a base cup, a supporting top cover, a base cup heat dissipation housing, and a top cover heat dissipation housing. The base cup and the supporting top cover are both made of metal, the supporting top cover is detachably connected to the base cup by interference fitting; and the base cup heat dissipation housing and the top cover heat dissipation housing are both made of thermally conductive plastic. In the present disclosure, the supporting top cover and the base cup are connected to each other by interference fitting to form an internal heat conduction structure; the heat is transferred to the outside by the top cover heat dissipation housing corresponding to the supporting top cover and the base cup corresponding to the base cup.
LED DISPOSED IN A BODY INCLUDING A SOCKET
A device according to embodiments of the invention includes a light emitting diode (LED) mounted on an electrically conducting substrate. A lens is disposed over the LED. A polymer body is molded over the electrically conducting substrate and in direct contact with the lens.
LED DISPOSED IN A BODY INCLUDING A SOCKET
A device according to embodiments of the invention includes a light emitting diode (LED) mounted on an electrically conducting substrate. A lens is disposed over the LED. A polymer body is molded over the electrically conducting substrate and in direct contact with the lens.
SYSTEM AND METHOD OF ENHANCING REPRODUCTION IN AVIAN
Methods and systems of promoting fertilization of eggs of an avian. While inseminating a plurality of avian eggs a spectrum substantially concentrated within a narrow range of wavelength irradiates the plurality of inseminated avian eggs to increase the motility of the sperm to increase the probability of conception of avian from the inseminated eggs.
LIGHT DIFFUSER AND LUMINAIRE
A light diffuser includes: a thermoplastic resin base which has a thermal expansion coefficient of at least 4×10.sup.−5/K and at most 8×10.sup.−5/K; and a light diffusion layer which is disposed on a surface of the thermoplastic resin base and includes an acrylic resin film and an acrylic resin particle, the acrylic resin film including one or more acrylic resins having a glass transition temperature of at least 30° C. and at most 50° C., the acrylic resin particle being included in the acrylic resin film and having an average particle size of at least 1 μm and at most 15 μm.
LIGHT DIFFUSER AND LUMINAIRE
A light diffuser includes: a thermoplastic resin base which has a thermal expansion coefficient of at least 4×10.sup.−5/K and at most 8×10.sup.−5/K; and a light diffusion layer which is disposed on a surface of the thermoplastic resin base and includes an acrylic resin film and an acrylic resin particle, the acrylic resin film including one or more acrylic resins having a glass transition temperature of at least 30° C. and at most 50° C., the acrylic resin particle being included in the acrylic resin film and having an average particle size of at least 1 μm and at most 15 μm.
Scattered-photon extraction-based fixtures
A light fixture includes a light source, a wavelength-conversion material, and a reflector. The light source is configured to emit a first radiation, and has a front surface and a back surface. The wavelength-conversion material is arranged under the front surface and configured to convert the first radiation to a second radiation which has a first portion not able to reach the reflector and a second portion able to reach the reflector. The reflector is arranged over the back surface and configured to reflect the second portion away from the light source without passing through the wavelength-conversion material. The reflector has an end distant from the light source and is arranged in an elevation different from that of the wavelength-conversion material.
OPTICAL LIGHTING SYSTEM AND METHOD
An LED lighting array for illuminating an area with the lighting array comprising a plurality of LED devices set in conical or elliptically conical reflectors, each of which is mounted upon a plate, each of which may be set at various angles to one other, and each of which is backed by a series of elements, first a copper support element, then an optional layer of graphite foam, followed by an aluminum plate, and then an arrangement of copper fins operably lined to a thermal mass mate. The copper support element includes support planes that are off-set relative to each adjacent plate and are in at least three different planes relative to each other. The backing plates may efficiently dissipate heat produced by the LEDs. The apparatus can be mounted upon a stand to illuminate an area such as a portion of a car park, building entrance or the like.
Low-profile lighting device and attachment members and kit comprising same
A luminaire comprising a housing formed of thermally conductive polymer with an optic carried thereby, a trim carried by the optic, and a light source. The light source may comprise an LED board comprising a copper layer and a plurality of light emitting diodes (LEDs) disposed on the LED board. The luminaire may also comprise control circuitry operably coupled to the plurality of LEDs, wherein the LED board is positioned in thermal communication with the housing. The luminaire may further comprise a mounting member configured to be attached to each of the housing and an external structure. The control circuitry may be configured to operate the plurality of LEDs such that heat generated by the plurality of LEDs is dissipated by the copper layer of the LED board.