A building envelope for a building wall, floor, or roof of a building, includes at least two shells spaced some distance apart from one another, which encloses an intermediate space therebetween, the shells including an exterior-facing shell configured to face an exterior of the building, and an interior-facing shell configured to face an interior of the building. The shells spaced apart from one another are filled with a building material and optionally include structural reinforcement and supply-engineering elements.

A building envelope for a building wall, floor, or roof of a building, includes at least two shells spaced some distance apart from one another, which encloses an intermediate space therebetween, the shells including an exterior-facing shell configured to face an exterior of the building, and an interior-facing shell configured to face an interior of the building. The shells spaced apart from one another are filled with a building material and optionally include structural reinforcement and supply-engineering elements.

This invention relates to flat plate solar collectors and, particularly, to solar panels applied in these flat plate solar collectors.

The proposed solar panel is designed as a shallow box, with rear and front walls, which are conditionally vertically positioned a most part of the external surface of the front wall is provided with a coating absorbing solar radiation.

In addition, the internal side of the rear wall is joined with an auxiliary perforated sheet.

There is a rectangular pipe, which is installed vertically or horizontally on the exterior side of the front wall and serves for passage of a liquid to be heated.

The solar panel is functioning as a flat heat pipe with zones of evaporation and condensation on the front wall.

Elastic deformations of the front and rear walls under difference between atmospheric and internal pressure allows to prevent overheating of liquid in the vertical rectangular pipe.

A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

An apparatus combining a solar tracker and a dual heat source collector includes a heat engine assembly and the solar tracker. The heat engine assembly includes a heat collector, a heat collecting lens, and a heat engine. The heat collector includes a solar heat collecting room and a heat source room. The heat collecting lens is arranged on the heat collector and corresponds to the solar heat collecting room. The heat engine is located in the solar heat collecting room. The solar tracker includes a primary mirror, a secondary mirror, a pivot member, and a driving member. The primary mirror has a first reflective surface and a back surface. The primary mirror has a mounting hole passing through the primary mirror. The secondary mirror is mounted above the primary mirror.

This invention relates to a photovoltaic module intended to convert solar radiation energy in electricity, and, more specifically, to a concentrating photovoltaic module provided with a parabolic dish-shaped mirror and a small-size photovoltaic receiver positioned in the focal plane of this parabolic dish-shaped mirror and the focal spot is overlapped mostly by the photovoltaic receiver. The photovoltaic module is based on usage of combination of a two-phase thermosiphon, which includes a flexible sub-section designed as a bellows, with the parabolic dish-shaped mirror installed on the distal (lower) sub-section of the two-phase thermosiphon by the truss struts. A tracking manipulator is installed below the parabolic dish-shaped mirror and joined with a certain spot of a supporting structure of the parabolic dish-shaped mirror; it provides orientation of the axis of the dish-shaped mirror towards the sun.

Falling particle solar receivers, systems, and methods are disclosed that include one non-linear falling particle curtain or two or more falling particle curtains within a solar receiver that receives incident solar radiation. The particles heated in the solar receiver may be used to heat a secondary fluid. In an embodiment, the particles may be recirculated to improve energy capture and thermal efficiency. In other embodiments, an air curtain may be used across the aperture of the receiver, and flow-control devices may be used to evenly spread particles across the width of the receiver inlet. Finally, feed particles may be preheated using heat from the solar receiver.

Falling particle solar receivers, systems, and methods are disclosed that include one non-linear falling particle curtain or two or more falling particle curtains within a solar receiver that receives incident solar radiation. The particles heated in the solar receiver may be used to heat a secondary fluid. In an embodiment, the particles may be recirculated to improve energy capture and thermal efficiency. In other embodiments, an air curtain may be used across the aperture of the receiver, and flow-control devices may be used to evenly spread particles across the width of the receiver inlet. Finally, feed particles may be preheated using heat from the solar receiver.

In one general aspect, a microelectronics cooling device can include a microchannel heat exchanger within an enclosure that houses the device at a heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at a heat sink end outside the enclosure. One or more pipes flowably connect the two ends for transporting liquid working fluid to the heat absorber and vaporized working fluid to the heat sink. The heat pipes may also be used to transfer heat outside a room that contains the electronic devices.

In one general aspect, a microelectronics cooling device can include a microchannel heat exchanger within an enclosure that houses the device at a heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at a heat sink end outside the enclosure. One or more pipes flowably connect the two ends for transporting liquid working fluid to the heat absorber and vaporized working fluid to the heat sink. The heat pipes may also be used to transfer heat outside a room that contains the electronic devices.