A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.

A water cooling apparatus and a water purifier having a water cooling apparatus is provided. The water cooling apparatus may include a case, a water tank provided within the case, a cooling block provided to be in contact with the water tank and to cool the water tank through heat exchange, a thermoelectric element having one side in contact with the cooling block and provided so as to transfer heat from the one side to another side of the thermoelectric element when power is applied thereto, an insulator provided within the case and that covers the water tank and the cooling block, and a heat dissipation block provided outside of the case and provided to be in contact with the other side of the thermoelectric element to dissipate heat from the other side of the thermoelectric element.

A cooling system includes a controller, a plurality of sensor sub-units, a plurality of solid-state cooling sub-units and a heat exchanger. The sensor sub-units are configured to be thermally connected to a heat source. The heat source has a plurality of sub-regions that correspond with each of the sensor sub-units. Each solid-state cooling sub-unit corresponds with and thermally connects to one of the sensor sub-units and is configured to dissipate heat from the sub-regions of the heat source. The heat exchanger is configured to dissipate heat from the sub-regions of the heat source and waste heat. The controller, based on temperatures sampled from the plurality of sensor sub-units and predictions made by an optimizer, is configured to determine the one or more sub-regions of the heat source to cool.

A processing liquid temperature control apparatus includes a block body with an integral structure made of a silicon carbide sintered body, the block body having a flow path through which a semiconductor processing liquid flows, and a temperature adjustment portion provided at the block body to adjust a temperature of the semiconductor processing liquid flowing through the flow path. Accordingly, it is possible to reduce the number of parts and achieve compactness and cost reduction. In addition, it is possible to enhance heat conduction between the processing liquid and the temperature adjustment portion, and improve heat exchange efficiency.

Disclosed herein are embodiments of a temperature-regulating containment system for actively heating and/or cooling a liquid to a desired liquid temperature, and methods of making and using such a temperature-regulating containment system, whereby the temperature-regulating containment system comprises: (i) a container having an internal cavity defined by a sidewall upwardly extending from a bottom wall, the internal cavity configured to contain liquid which has a liquid temperature; (ii) a temperature regulator operatively coupled to the internal cavity, the temperature regulator configured to regulate the temperature of the internal cavity and the liquid therein; (iii) a pressurizable chamber disposed between the internal cavity and the temperature regulator; and (iv) a pressure regulator operatively coupled to the chamber, the pressure regulator configured to regulate the pressure of the chamber.

Provided herein is a thermoelectric system for generating electricity using ambient temperature oscillations (e.g., between day and night time). The thermoelectric system may comprise a first heat exchanger, a thermoelectric generator, one or more heat conducting units, a second heat exchanger, and a container configured to (i) contain the second heat exchanger and a thermal storage material and (ii) insulate the thermal storage material from an external to the container.

A refrigerator may include an inner casing having a storage chamber defined therein; and a thermoelectric module including a thermoelectric element for cooling the storage chamber, a cooling sink in contact with one surface of thermoelectric element, and a heat sink contacting the other surface of thermoelectric element, wherein the heat sink includes: a heat dissipation fin including a stack of a plurality of fins; a heat dissipation plate coupled to the heat dissipation fin; a heat dissipation pipe for connecting the heat dissipation plate to the heat dissipation fin, wherein the heat dissipation pipe is arranged to pass through the heat dissipation fin.

A hybrid cooling storage device, including a main body to store at least one item therein, a lid pivotally disposed on at least a portion of the main body to cover an interior portion of the main body, and a hybrid cooling unit disposed on and within at least a portion of the main body, including a liquid conduit disposed within at least a portion of each side of the main body to transport a liquid therein, a conduit connector connected to a first end and a second end of the liquid conduit to dissipate heat from the liquid received from the liquid conduit, a peltier plate disposed on at least a portion of the conduit connector to create a difference in temperature between a first side and a second side of the peltier plate, such that the first side is cold and the second side is hot, a heat sink disposed on at least a portion of the peltier plate to dissipate heat generated on the peltier plate, and a fan disposed on at least a portion of the heat sink to extract heat from the heat sink via a rotation of the fan.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.