A waterless portable precision heating device includes an ingredient container to contain a food-related, a health-related, or a crafting-related ingredient; a thin heating element configured to surround and contact the ingredient container; an insulation layer configured to surround and contact the heating element; an outer shell surrounding the insulation layer; a lid that encloses the product container and fluidly seals it from the environment; at least one sensor configured to detect the temperature of the device; and a circuit board with a controller that controls the heating of the heating in response to signals received from the at least one sensor indicating whether the product container has reached a threshold temperature.

Apparatus and methods for debinding articles. The apparatus and methods may transform binder from furnace exhaust before the exhaust is discharged to the atmosphere. The apparatus may include a furnace retort and a reactor. The furnace retort may be configured to: exclude ambient air; and receive a carrier gas. The reactor may be configured to: receive from the retort (a) the carrier gas and (b) material removed in the retort from the article; and combust, at a temperature no greater than 750 C., the material. The material may be decomposed binder. The material may be hydrocarbon from binder that is pyrolyzed in the retort. The carrier gas may include gas that is nonflammable gas.

Apparatus and methods for debinding articles. The apparatus and methods may transform binder from furnace exhaust before the exhaust is discharged to the atmosphere. The apparatus may include a furnace retort and a reactor. The furnace retort may be configured to: exclude ambient air; and receive a carrier gas. The reactor may be configured to: receive from the retort (a) the carrier gas and (b) material removed in the retort from the article; and combust, at a temperature no greater than 750 C., the material. The material may be decomposed binder. The material may be hydrocarbon from binder that is pyrolyzed in the retort. The carrier gas may include gas that is nonflammable gas.

A continuous lighting lamp irradiates a semiconductor wafer held by a quartz susceptor with light from below to perform preliminary heating, and then irradiation of a flash of light is performed by a flash lamp from above. A light absorption ring is provided so as to be close to a peripheral portion of the semiconductor wafer held by the susceptor. The light absorption ring absorbs infrared light and transmits visible light through itself. During preliminary heating, the light absorption ring absorbs light emitted from the continuous lighting lamp to be increased in temperature so that heat radiated from the peripheral portion of the wafer is compensated to cause in-plane temperature distribution of the semiconductor wafer to be uniform. Meanwhile, the flash of light is transmitted through the light absorption ring, so that the light absorption ring is prevented from being damaged by the irradiation of the flash of light.

A continuous lighting lamp irradiates a semiconductor wafer held by a quartz susceptor with light from below to perform preliminary heating, and then irradiation of a flash of light is performed by a flash lamp from above. A light absorption ring is provided so as to be close to a peripheral portion of the semiconductor wafer held by the susceptor. The light absorption ring absorbs infrared light and transmits visible light through itself. During preliminary heating, the light absorption ring absorbs light emitted from the continuous lighting lamp to be increased in temperature so that heat radiated from the peripheral portion of the wafer is compensated to cause in-plane temperature distribution of the semiconductor wafer to be uniform. Meanwhile, the flash of light is transmitted through the light absorption ring, so that the light absorption ring is prevented from being damaged by the irradiation of the flash of light.

The invention relates to a facility for producing a metal component having at least two regions of different strength properties, said facility consisting of a heating unit (2) comprising heat-producing radiation sources (4) as well as a positioning device for at least one base body (1) consisting of metal, and a protecting device comprising at least one covering part for the contactless protection of a pre-determined surface region of the base body (1), the protecting device being arranged in the heating unit such that it remains therein during a temperature control of the base body (1) before the forming of the base body in a forming tool, the protecting part comprising a plurality of separately manipulatable covering parts (3a, 3b, 3c, 3d, 3e) which are respectively used to protect a predetermined surface region (1a, 1b, 1c, 1d, 1e) of the Base Body (1), and a Manipulator (5) is Provided for Each Covering Part (3a to 3e), by means of which the covering part (3a to 3e) can be moved, independently from the other covering parts (3a to 3e) in the heating unit (2), into a covering position in which it covers the pre-determined surface region (1a to 1e), or into an uncovering position in which it uncovers the pre-determined surface region (1a to 1e) for the irradiation of the radiation sources (4).

The invention relates to a facility for producing a metal component having at least two regions of different strength properties, said facility consisting of a heating unit (2) comprising heat-producing radiation sources (4) as well as a positioning device for at least one base body (1) consisting of metal, and a protecting device comprising at least one covering part for the contactless protection of a pre-determined surface region of the base body (1), the protecting device being arranged in the heating unit such that it remains therein during a temperature control of the base body (1) before the forming of the base body in a forming tool, the protecting part comprising a plurality of separately manipulatable covering parts (3a, 3b, 3c, 3d, 3e) which are respectively used to protect a predetermined surface region (1a, 1b, 1c, 1d, 1e) of the Base Body (1), and a Manipulator (5) is Provided for Each Covering Part (3a to 3e), by means of which the covering part (3a to 3e) can be moved, independently from the other covering parts (3a to 3e) in the heating unit (2), into a covering position in which it covers the pre-determined surface region (1a to 1e), or into an uncovering position in which it uncovers the pre-determined surface region (1a to 1e) for the irradiation of the radiation sources (4).

An apparatus useful in treating a carbon fibre precursor material under predetermined conditions of temperature and gaseous environment. The apparatus includes a housing, and a reaction chamber disposed within the housing. The reaction chamber is elongate and has an entry port at a first end and an exit port at a second end. The entry and exit ports are configured to allow passage of a carbon fibre precursor material into and out of the reaction chamber respectively. A heater or heating system is configured to heat a wall of the reaction chamber. In use, a precursor material is passed through the reaction chamber and is thereby heated.

The present invention relates to a furnace device for heating a plate, in particular a metal plate, by convection. The furnace device has a housing, in which a temperature control region for temperature-controlling a component part and an adjustment region are formed, wherein the adjustment region has a temperature control device for adjusting a temperature of a temperature control fluid. Further, the furnace device has a positioning device for positioning the plate in the temperature control region in a predetermined orientation, and a ventilator, which is arranged in the housing and which is adapted to circulate the temperature control fluid in the housing between the temperature control region and the adjustment region such that the temperature control fluid is flowable in a flow direction along a surface of the plate.

According to one embodiment, an organic film forming apparatus includes a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure, at least one processing room provided inside the chamber and being surrounded by a cover, and an exhaust part configured to exhaust the inside the chamber. The processing room includes an upper heating part including first heaters, a lower heating part including second heaters, and facing the upper heating part, an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a lower heat equalizing plate provided on the upper heating part side of the lower heating part, and workpiece supporters configured to support a workpiece through a gap between the upper and lower heat equalizing plates.