Patent classifications
F27B5/18
Substrate treatment apparatus
Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber body having a passage, through which substrates are transferred, in one side thereof, the chamber body having opened upper and lower portions, an inner reaction tube disposed above the chamber body to provide a process space in which a process with respect to the substrates is performed, the inner reaction tube having an opened lower portion, a substrate holder disposed in the opened lower portion of the chamber to move between a stacking position at which the substrates transferred through the passage are vertically stacked and a process position at which the substrate holder ascends toward the process space to perform the process with respect to the stacked substrates, a blocking plate connected to a lower portion of the substrate holder to ascend or descend together with the substrate holder, the blocking plate closing the opened lower portion of the inner reaction tube at the process position, a connection cylinder vertically disposed on a lower portion of the blocking plate to ascend or descend together with the blocking plate, and a blocking member connected between the opened lower portion of the chamber body and the connection cylinder to isolate the opened lower portion of the chamber body from the outside.
Substrate treatment apparatus
Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber body having a passage, through which substrates are transferred, in one side thereof, the chamber body having opened upper and lower portions, an inner reaction tube disposed above the chamber body to provide a process space in which a process with respect to the substrates is performed, the inner reaction tube having an opened lower portion, a substrate holder disposed in the opened lower portion of the chamber to move between a stacking position at which the substrates transferred through the passage are vertically stacked and a process position at which the substrate holder ascends toward the process space to perform the process with respect to the stacked substrates, a blocking plate connected to a lower portion of the substrate holder to ascend or descend together with the substrate holder, the blocking plate closing the opened lower portion of the inner reaction tube at the process position, a connection cylinder vertically disposed on a lower portion of the blocking plate to ascend or descend together with the blocking plate, and a blocking member connected between the opened lower portion of the chamber body and the connection cylinder to isolate the opened lower portion of the chamber body from the outside.
Dental furnace
The invention relates to a dental furnace comprising a firing hood equipped with a heating device that is movably supported for the opening and closing of the dental furnace relative to a base intended for receiving a dental restoration part, and further comprising a heat detection device that is directed towards an area above the base, in particular towards one or more dental restoration parts, and further comprising a control or regulating device for the dental furnace that is coupled to the heat detection device, wherein the heat detection device is configured as a thermal imaging camera (30) which is directed towards the area above the base while the firing hood (12) is partially or completely opened, and which feeds an at least two-dimensional image in the form of a matrix of the one or more inserted dental restoration parts (60) to the control or regulating device and/or to a muffle (26) that is intended for the generation of the dental restoration parts (60).
Dental furnace
The invention relates to a dental furnace comprising a firing hood equipped with a heating device that is movably supported for the opening and closing of the dental furnace relative to a base intended for receiving a dental restoration part, and further comprising a heat detection device that is directed towards an area above the base, in particular towards one or more dental restoration parts, and further comprising a control or regulating device for the dental furnace that is coupled to the heat detection device, wherein the heat detection device is configured as a thermal imaging camera (30) which is directed towards the area above the base while the firing hood (12) is partially or completely opened, and which feeds an at least two-dimensional image in the form of a matrix of the one or more inserted dental restoration parts (60) to the control or regulating device and/or to a muffle (26) that is intended for the generation of the dental restoration parts (60).
System and/or method for heat treating conductive coatings using wavelength-tuned infrared radiation
Certain example embodiments relate to systems and/or methods for preferentially and selectively heat treating conductive coatings such as ITO using specifically tuned near infrared-short wave infrared (NIR-SWIR) radiation. In certain example embodiments, the coating is preferentially heated, thereby improving its properties while at the underlying substrate is kept at low temperatures. Such techniques are advantageous for applications on glass and/or other substrates, e.g., where elevated substrate temperatures can lead to stress changes that adversely effect downstream processing (such as, for example, cutting, grinding, etc.) and may sometimes even result in substrate breakage or deformation. Selective heating of the coating may in certain example embodiments be obtained by using IR emitters with peak outputs over spectral wavelengths where the conductive coating (or the conductive layer(s) in the conductive coating) is significantly absorbing but where the substrate has reduced or minimal absorption.
System and/or method for heat treating conductive coatings using wavelength-tuned infrared radiation
Certain example embodiments relate to systems and/or methods for preferentially and selectively heat treating conductive coatings such as ITO using specifically tuned near infrared-short wave infrared (NIR-SWIR) radiation. In certain example embodiments, the coating is preferentially heated, thereby improving its properties while at the underlying substrate is kept at low temperatures. Such techniques are advantageous for applications on glass and/or other substrates, e.g., where elevated substrate temperatures can lead to stress changes that adversely effect downstream processing (such as, for example, cutting, grinding, etc.) and may sometimes even result in substrate breakage or deformation. Selective heating of the coating may in certain example embodiments be obtained by using IR emitters with peak outputs over spectral wavelengths where the conductive coating (or the conductive layer(s) in the conductive coating) is significantly absorbing but where the substrate has reduced or minimal absorption.
Temperature control mechanism, temperature control method and substrate processing apparatus
There is provided a temperature control mechanism comprising: a plurality of combinations of a heater and a thyristor, wherein at least one combination of the heater and the thyristor is provided on a zone-by-zone basis, and wherein an area of an electrostatic chuck for mounting a substrate is divided into a plurality of zones; a power supply configured to supply current to heaters of the plurality of combinations respectively through the thyristors of the plurality of combinations; a pair of filters disposed at a power supply line for supplying electric power from the power supply to the heaters and configured to eliminate high frequency power applied to the power supply.
Temperature control mechanism, temperature control method and substrate processing apparatus
There is provided a temperature control mechanism comprising: a plurality of combinations of a heater and a thyristor, wherein at least one combination of the heater and the thyristor is provided on a zone-by-zone basis, and wherein an area of an electrostatic chuck for mounting a substrate is divided into a plurality of zones; a power supply configured to supply current to heaters of the plurality of combinations respectively through the thyristors of the plurality of combinations; a pair of filters disposed at a power supply line for supplying electric power from the power supply to the heaters and configured to eliminate high frequency power applied to the power supply.
OVEN AND OVEN DOOR OPENING AND CLOSING METHOD
Provided herein are an oven and a method of opening or closing the door. In more detail, disclosed herein are an oven having a door opening or closing unit capable of opening or closing a door driven by remote control and a method of opening or closing the door of the oven. Some of embodiments provide an oven capable of opening or closing a door by using a door opening or closing unit according to remote control and a method of opening or closing the door of the oven.
OVEN AND OVEN DOOR OPENING AND CLOSING METHOD
Provided herein are an oven and a method of opening or closing the door. In more detail, disclosed herein are an oven having a door opening or closing unit capable of opening or closing a door driven by remote control and a method of opening or closing the door of the oven. Some of embodiments provide an oven capable of opening or closing a door by using a door opening or closing unit according to remote control and a method of opening or closing the door of the oven.