F28D15/0208

TRANSFER-OF-MASS SYSTEM AND METHOD FOR INCREASING ROTATIONAL ENERGY OUTPUT
20220178622 · 2022-06-09 ·

A transfer-of-mass system for increasing rotational energy output thereof includes a sealed container having a central axis and an outer wall radially spaced apart from the central axis. A liquid partially fills the container. A motor causes the container to rotate about its central axis at a speed of rotation such that the liquid is acted upon by centrifugal forces to move it to the container's outer wall. Energy is applied to the liquid to cause at least a portion of the liquid at the container's outer wall to move towards the container's central axis wherein the container rotates faster than the speed of rotation caused by the motor.

VAPOUR CHAMBER

Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.

Lightweight structurally and thermally efficient oscillating heat pipe panel

A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.

COOLING SYSTEMS COMPRISING PASSIVELY AND ACTIVELY EXPANDABLE VAPOR CHAMBERS FOR COOLING POWER SEMICONDUCTOR DEVICES

A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.

Cooling systems comprising passively and actively expandable vapor chambers for cooling power semiconductor devices

A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.

Thermal management system
11306976 · 2022-04-19 · ·

The present invention provides a vehicle (100) comprising: a body (4) having a skin; a heat source (12); and a thermal management system. The thermal management system comprises: a heat pipe (14) comprising: an evaporator end (close to 12) and a condenser end (close to heat exchanger 22a, 22b); a vapour arranged to flow from the evaporator end to the condenser end; and a working fluid arranged to flow from the condenser end to the evaporator end, wherein the heat pipe (14) is arranged such that the evaporator end is arranged in proximity to the heat source to absorb heat from the heat source; and one or more heat exchangers arranged in proximity to the condenser end and integrated with the skin. The present invention also provides a method of managing temperature in a vehicle.

LIGHTWEIGHT STRUCTURALLY AND THERMALLY EFFICIENT OSCILLATING HEAT PIPE PANEL

A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.

COMPLIANT OSCILLATING HEAT PIPES

An oscillating heat pipe device can include a body formed to be at least partially flexible, one or more channels within the body and defined by the body, an evaporator portion within the body at a first end of the one or more channels and in fluid communication with the one or more channels, and a condenser portion within the body at a second end of the one or more channels and in fluid communication with the one or more channels. The body can be configured to flex between the evaporator portion and the condenser portion. The device can include a heat transfer fluid trapped within the channels to transfer heat between the evaporator portion and the condenser portion.

Heat pipe structure

A heat pipe structure is used for cooling a heat source. The heat pipe structure includes a sleeve tube and a shaft. The sleeve tube includes an inner wall. The sleeve tube has a trench on the inner wall. The trench is at an outlet end of the sleeve tube. The trench extends in a circumferential direction of the sleeve tube. The shaft is connected to the heat source. The shaft is inserted into the sleeve tube from the outlet end such that the shaft is rotatable relative to the sleeve tube. The trench surrounds the shaft.

HEAT PIPE STRUCTURE
20210278140 · 2021-09-09 ·

A heat pipe structure is used for cooling a heat source. The heat pipe structure includes a sleeve tube and a shaft. The sleeve tube includes an inner wall. The sleeve tube has a trench on the inner wall. The trench is at an outlet end of the sleeve tube. The trench extends in a circumferential direction of the sleeve tube. The shaft is connected to the heat source. The shaft is inserted into the sleeve tube from the outlet end such that the shaft is rotatable relative to the sleeve tube. The trench surrounds the shaft.