Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.

A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.

A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.

This invention relates to temperature control of rotating shafts or assemblies to ensure proper operation and high reliability. Though it is particularly well suited for cooling high power, compact motors used in automotive applications, it can also be used to dissipate heat efficiently from other rotating assemblies to ensure that their temperatures remain within acceptable limits. The invention achieves this by utilizing a rotating heat pipe that incorporates a solid-liquid phase change material as the heat transfer/transport material. In addition, it comprises a scraped surface heat exchange mechanism at the heat dissipation region to allow for high cooling rates as required.

A heat pipe, a heat pipe assembly and a method for assembling the heat pipe assembly. The heat pipe includes a main body part and an insertion part. The insertion part is connected to the main body part. The main body part and the insertion part together form a single hollow pipe. The insertion part has an outer surface and at least one recessed part formed on the outer surface.

An enclosure for an optoelectronic sensor. The enclosure includes a thermodynamically open first chamber; a thermodynamically closed second chamber; and a rotor extending from the first chamber into the second chamber. The rotor includes a shaft part in the second chamber coaxial to the rotational axis of the rotor. The shaft part mounts an optoelectronic sensor device. The rotor includes a head part in the first chamber coaxial to the rotational axis of the rotor. A heat dissipation fan is fixedly arranged on and surrounds the head part. The head part and the fan are rotatably and thermally coupled to the shaft part to rotate simultaneously with the shaft part. The rotor transfers heat over the shaft part from the second chamber to the head part and the fan dissipates the transferred heat to an environment.

Deployable radiator devices, systems, and methods utilizing composite laminates are provide in accordance with various embodiments. For example, some embodiments include a deployable radiator system. The system may include one or more radiators and one or more thermally-conductive, bendable hinges. Each respective thermally-conductive, bendable hinge from the one or more thermally-conductive, bendable hinges may be coupled with a respective radiator from the one or more radiators. Each respective thermally-conductive, bendable hinge from the one or more thermally-conductive, bendable hinges may be configured to conduct heat to the respective radiator from the one or more radiators. Some embodiments include one or more heat pipes, which may be flat. Some embodiments include heat pipes with vapor channels and liquid channels configured in a same plane of the heat pipe. Methods of utilizing the systems and/or devices may be also provided.

A heat transport device 1 includes a housing 2 with a hollow structure, working fluid 3 sealed in a sealed space of the housing 2, and a porous structure member 4 having a capillary structure disposed in the sealed space, and the housing 2 is configured to be rotatable around a rotation axis P by a motor as a drive source. The housing 2 includes an evaporation part S1 for vaporizing the working fluid 3 by heat from a heating element 5 and a condensation part S2 for condensing vapor to restore it to the working fluid 3, and the evaporation part S1 is provided on an outer side in the radial direction than the condensation part S2 with respect to the rotation axis P.

An oscillating heat pipe that can maintain efficient heat transfer even in a high gravity force equivalent environment is provided. The heat pipe can comprise a condenser region having a first plurality of bends, an evaporator region having a second plurality of bends, and a plurality of intermediate portions. The plurality of intermediate portions can extend between the first plurality of bends and the second plurality of bends. The plurality of intermediate portions can include a first intermediate portion and a second intermediate portion. A cross-sectional area of the first intermediate portion can be larger than a cross-sectional area of the second intermediate portion in a plane at a first distance from the evaporator region. The cross-sectional area of at least one of the first or second intermediate portions can increase from the condenser region towards the evaporator region.

The present disclosure discloses a defrosting device, including a heating unit provided in an evaporator; and a heat pipe, both end portions of which are connected to an inlet and an outlet of the heating unit, respectively, and at least part of which is disposed adjacent to a cooling tube to dissipate heat to the cooling tube of the evaporator due to high-temperature working fluid heated and transferred by the heating unit, wherein the heating unit includes a heater case provided with a vacant space therein, and provided with the inlet and the outlet at positions separated from each other, respectively, along a length direction; and a heater attached to an outer surface of the heater case to heat working fluid within the heater case.