A display device includes a display module including a lower surface defined by first and second directions and an upper surface displaying an image and a pulsating heat pipe on the lower surface of the display module. The pulsating heat pipe includes a first heat exchanger including first pipes arranged in the first direction, second pipes connecting the first pipes most adjacent to each other among the first pipes, and a first fluid filled in the first and second pipes and existing in a liquid or gaseous state and a second heat exchanger spaced apart from the first heat exchanger in the second direction and including third pipes arranged in the first direction, fourth pipes connecting the third pipes most adjacent to each other among the third pipes, and a second fluid filled in the third and fourth pipes and existing in a liquid or gaseous state.

Embodiments disclosed are systems and methods for interfacing a metallic capillary in a microchannel of a metallic body. A method may include inserting a portion of the metallic capillary into a portion the microchannel of the metallic body, sintering the portion of the metallic capillary to the portion of the microchannel of the metallic body, disposing a sacrificial powder at least proximate to the metallic capillary and the metallic body after sintering the portion of the metallic capillary and the portion of the microchannel of the metallic body, and infiltrating at least the portion of the metallic capillary sintered to the portion of the microchannel of the metallic body with an infiltrant in the presence of the sacrificial powder disposed at least proximate to the metallic capillary and the metallic body.

An electronic device according to an embodiment may comprise: a first plate; a second plate which supports the first plate; and a vapor chamber which includes a wick structure between the first plate and the second plate. The first plate may comprise: a first region which includes a heat dissipation portion; and a second region which is connected to the first region. The wick structure may comprise: a first wick including a first portion which covers one surface of the first region and a second portion which extends along the second region from the first portion; and a second wick extending from the second plate to the second portion.

Effective two-phase cooling is provided to large devices even with a length of 10 cm due to a channel configuration to achieve formed minichannels comprising porous wall structures. Baseplate features comprise a substrate defining the minichannels, with each minichannel formed between a pair of side walls and a bottom surface thereof. The side walls of the plurality of minichannels respectively form terminal walls for each of the respective minichannels. A microgap configuration is formed between the terminal wall of at least one of the plurality of minichannels and an adjacent layer.