A heat exchanger includes a plurality of first members, and a plurality of second members located between adjacent first members of the plurality of first members. The plurality of first members each include a plurality of openings and a first flow path connected to the plurality of openings. The plurality of second members each include a second flow path connected to the openings of the adjacent first members. The plurality of openings and the first flow path of the first member, and the second flow path of the second member define a flow path for a first fluid. A region between the adjacent first members defines a flow path for a second fluid. The heat exchanger further includes a third member extending toward the region on the first member.

A heat pipe containing a working fluid includes a first metal layer and a second metal layer. The first metal layer includes an upper surface and bottomed holes depressed from the upper surface. The second metal layer includes a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface. The recess forms a vapor layer in which vapor vaporized from the working fluid moves. Adjacent bottomed holes are in communication with each other so that the bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.

A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.

Permeable membrane microchannel heat sinks and methods of producing such a heat sink, wherein such a heat sink includes a base and at least first and second microchannels defined by at least one porous and permeable membrane that is on the base and defines primary heat exchange surfaces of the heat sink. The membrane has opposing faces exposed to the first and second microchannels, and a fluid flowing through the heat sink flows from the first microchannel to the second microchannel through pores in the membrane.

A thermodynamic transistor has a vacuum sealed body that has a top end and a bottom end. A first heater is positioned adjacent the bottom end of the vacuum sealed body. A working fluid fills a portion of the vacuum sealed body from the bottom end such that the first heater heats the working fluid. The working fluid is a liquid at a first temperature and becomes a gas at a second temperature.

A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.

A vapor chamber structure includes a first flexible substrate, a second flexible substrate, a spacer, a flexible sealing member, and a working fluid. The first flexible substrate includes a first organic material layer, a first copper foil layer, and a first capillary structure layer. The second flexible substrate includes a second organic material layer, a second copper foil layer, and a second capillary structure layer. The first copper foil layer, the first capillary structure layer, the spacer, the second copper foil layer, and the second capillary structure layer are retracted by a distance relative to the first and second organic material layers to form a space. The first and second organic material layers and the flexible sealing member define a sealed chamber. The working fluid is disposed in the sealed chamber and located among the first and second capillary structure layers and grooves of the spacer.

A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.

A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.

Methods, systems, and device for two-phase thermal management are provided in accordance with various embodiments. For example, some embodiments include a two-phase thermal management device that may include: a liquid chamber; one or more inlets configured to deliver a liquid to the liquid chamber; an evaporator chamber; a capillary layer positioned within the evaporator chamber and configured to spread the liquid from the liquid chamber; a liquid manifold configured to deliver the liquid from the liquid chamber to at least the capillary layer or the evaporator chamber; and/or one or more outlets configured to remove at least a vapor or a portion of the liquid from the evaporator chamber. Some embodiments that may include a two-phase thermal management device coupled with at least: a heat exchanger, a pump, a heat recuperator, a pre-heater, and/or a variable volume reservoir. Some embodiments include a two-phase thermal management method.