An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19° C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40° C.). An additional two watts of power was generated by the TEGs.

A vapor chamber that includes a housing having a first sheet and a second sheet facing each other, wherein at least a part of an outer edge of the housing has a step shape in which an end portion of the second sheet is positioned inside an end portion of the first sheet, and the housing has a bonded portion inside the end portion of the second sheet where the first sheet and the second sheet are bonded to each other; a protective film covering a boundary between the end portion of the second sheet and the first sheet at the step shape; a working fluid enclosed in the housing, and a wick on an inner wall surface of the first sheet or the second sheet.

An integrated vapor chamber includes an outer shell and a plurality of composite capillary structures. The outer shell includes a flat casing and a plurality of partitions integrally formed. The flat shell includes a chamber, and the partitions are disposed in the chamber to separate the chamber into a plurality of flow channels. Each composite capillary structure is extended along each flow channel and distributed in the chamber. The composite capillary structure includes a metal mesh and a plurality of sintered powder uniformly sintered in the metal mesh. Furthermore, this disclosure also discloses a manufacturing method of the integrated vapor chamber. Therefore, the manufacturing method of the thin vapor chamber is simplified to improve the yield rate.

Various systems and methods are provided for creating a wicking structure. In one example, a method for creating a wicking structure can include creating, using a 3D printing technique, a macro wicking element including a lattice structure formed by a grid of a first material, the lattice structure including pores formed between the grid of first material. The method can also include creating, using the 3D printing technique, a first micro wicking element including powder particles distributed within the pores of the lattice structure, and creating, using the 3D printing technique, a second micro wicking element by removing at least a portion of the lattice structure.

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

A heat conduction structure includes a shell, a wick structure, a separating sheet, and a working fluid. The shell includes a chamber. The chamber is divided into an evaporation room, a condensation room and a connection room formed between the evaporation room and the condensation room. The wick structure covers an inner bottom wall of the chamber. The separating sheet is received in the connection room and stacked on the wick structure. An airflow channel is formed between the separating sheet and the inner top wall of the connection room. The working fluid is disposed in the chamber. Therefore, the liquid working fluid and the gaseous working fluid are split by the separating sheet to increase the heat dissipating efficiency of the heat conduction structure.

A microchannel heat exchanger structure with a nozzle and a working method thereof. The microchannel heat exchanger structure with a nozzle, includes a first heat exchange portion, a second heat exchange portion, and at least one nozzle portion between the first heat exchange portion and the second heat exchange portion, the first heat exchange portion having a high-pressure heat exchange channel, a first micro-fin array being provided inside the high-pressure heat exchange channel, and the second heat exchange portion having a low-pressure heat exchange channel, the high-pressure heat exchange channel and the low-pressure heat exchange channel being in communication through at least one nozzle disposed in the nozzle portion. The heat exchanger structure has a good heat exchange effect and can achieve a better heat flux during heat exchange.

A heat transfer device includes a bag and a working fluid. The bag includes a first sheet and a second sheet with edges that are sealed together. The working fluid is enclosed in the bag. The working fluid changes a phase thereof between gas and liquid. The bag includes a vaporizing portion in which the liquid-phase working fluid is vaporized and a condensing portion in which the gas-phase working fluid is condensed. The bag includes a two-phase flow channel in which liquid-gas two-phase slug flow including the liquid-phase working fluid and the gas-phase working fluid occurs from the vaporizing portion to the condensing portion. The two-phase flow channel is provided in an internal space of the bag.

A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.