Technologies provide a heat pipe having a controlled torque resistance. The techniques disclosed herein provide a heat pipe that can function as a coupling device and as a thermal interface between two moving components of a device without the need of a mechanical hinge. In some configurations, a heat pipe comprises a housing having an outer surface and having an inner surface defining a cavity. The heat pipe can also comprise one or more components for transferring heat from a first region to a second region. In addition, the heat pipe is configured to provide a predetermined torque resistance about a first axis that is perpendicular to a longitudinal axis of the heat pipe. Components, such as a heat source and a heat sink, that are attached to the heat pipe can be hingeably coupled with a predetermined torque resistance without requiring a hinge and a separate thermal interface device.

It is impossible to avoid the increase in device cost and maintenance cost in order to cool a heat source efficiently using a natural-circulation type phase-change cooling device; therefore, a cooling device according to an exemplary aspect of the present invention includes a heat receiving unit for receiving heat; a condensing unit for releasing heat; and a refrigerant intermediary unit for connecting the heat receiving unit with the condensing unit, and transporting refrigerant circulating between the heat receiving unit and the condensing unit, wherein the refrigerant intermediary unit includes a refrigerant retaining unit for retaining the refrigerant, a primary tube connecting the refrigerant retaining unit with the condensing unit, and a secondary tube connecting the refrigerant retaining unit with the heat receiving unit and including a bendable tube.

A heat pipe includes a container in which a corrugated portion is formed, the container having a hollow portion formed therein that is sealed, a wick structure provided on an inner peripheral surface of the hollow portion and a working fluid enclosed in the hollow portion. The wick structure has a vapor channel penetrating therethrough in a longitudinal direction of the hollow portion, the wick structure producing a capillary force. The wick structure is a sintered body of a powder metal material and projected into a crest portion of the corrugated portion. The wick structure is provided at a region in the crest portion of the corrugated portion and at a position of a trough portion of the corrugated portion.

Thermal management systems and corresponding use methods are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an outer surface and an inner surface. The computing device also includes a heat generating component supported by the housing. The computing device includes a phase change device adjacent or physically connected to the heat generating component. The phase change device includes a first side and a second side. The first side is closer to the heat generating component than the second side. The second side is opposite the first side. The phase change device is compressible, such that when a force is applied to the outer surface of the housing, the inner surface of the housing flexes towards the second side of the phase change device and the phase change device is compressed.

An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.

An apparatus and corresponding approaches for a combined energy dissipation include an energy dissipater forming a hollow chamber therein containing a partial pressure working fluid and a first adjustable thermal connector configured to be placed in an opening of the energy dissipater between an energy generating component to transfer energy there between. The first adjustable thermal connector includes a heat spreader at least partially disposed within the opening of the dissipater, an elastic member operably coupled to the energy dissipater, a flexible membrane coupled to the energy dissipater and the heat spreader, and a phase change material configured to at least partially fill an area defined by the opening, heat spreader, elastic member, and flexible membrane. Upon changing the phase change material to a first material phase, the elastic member applies a biasing force to the energy generating component to align the heat spreader with the energy generating component.

A heat dissipation device includes two connected components and a flexible metal conduit. Each connected component is selected from a manifold, a quick connector, an evaporator, a condenser or a pump. The two connected components are in communication with each other through the flexible metal conduit. The use of the flexible metal conduit is effective to absorb the designing tolerance. In addition, the flexible metal conduit is recyclable.

Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.

Provided are a flat plate pulsating heat pipe having flexibility and having an improved sealing ability so as not to leak a working fluid therein, and a manufacturing method thereof. The flat plate pulsating heat pipe includes a base part having an upper surface or a lower surface which is plasma-treated, wherein the base part has a plurality of channels formed therein and both end portions of each of the channels are bent and connected to each other to form a closed-loop type or a closed type; and a pair of surface films bonded to an upper portion and a lower portion of the base part and bonded to each other at an outer portion of the base part to seal the channels.

A variable fin stack for cooling components in a chassis of a portable information handling system. The variable fin stack comprises a first array of fins coupled to a first conduit and a second array of fins coupled to a second conduit. When the chassis is in a compact configuration for use in a mobile mode, fins in the second array of fins are positioned between fins in the first array of fins and the chassis maintains a form factor. When the chassis is in an expanded configuration for use in a workstation mode, the second array of fins is withdrawn from the first array of fins and the increased surface area provides increased cooling of components operating at higher power levels.