A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.

A filling system that has a chamber, at least one heat pipe used for heat transfer and extending along the chamber, at least one ammonia tube that pure ammonia is able to be stored at room temperature as saturated vapour, at least one delivery line that enables to deliver ammonia from the ammonia tube to the heat pipe and the heat pipe is removably engaged, at least one valve is located on the delivery line and allows ammonia flow to controlled, at least one detector located on the delivery line and providing seal control, at least one heater to heat the heat pipe, and at least one cooler to cool the heat pipe.

A flexible heat dissipation device includes an evaporator, a vapor tube, a liquid tube and a condenser. The evaporator has at least one vapor chamber. A capillary structure and a working fluid are received in the vapor chamber. Two ends of the vapor tube is respectively in communication with one end of the evaporator and the condenser. Two ends of the liquid tube are respectively in communication with the evaporator and the condenser, whereby the evaporator, the vapor tube, the condenser and the liquid tube form a loop for the working fluid to flow through. At least one bellows section is disposed on one or both of the vapor tube and the liquid tube. The bellows section has multiple waved stripes. More than one of the heights, widths and pitches of the multiple waved stripes are equal to or unequal to each other.

A heat dissipation unit with floating section includes an upper plate and a lower plate, which are closed together to define a chamber in between them, and the chamber has a working fluid filled therein. The upper and the lower plate respectively include a front section, a read section, and a middle section located between the front and the rear section. The front section and the rear section of one or both of the upper and the lower plate have a plate thickness larger than that of the middle section, such that the middle sections form flexible floating sections that allow for a floating adjustment thereat, making the front and the rear sections of the heat dissipation unit to be located at two positions having a height difference between them.

A panel assembly for use with a spacecraft includes a payload, a radiator panel and a heat pipe. The payload is configured to generate waste heat during operation. The radiator panel is spaced apart from the payload and is configured to dissipate waste heat. The heat pipe is coupled to the payload and the radiator panel. The heat pipe includes a compliant portion to permit the radiator panel to move relative to the payload. Further the heat pipe is configured to transfer waste heat from the payload to the radiator panel.

A liquid cooling device includes a water cooling radiator, a first pump and a cold plate. The water cooling radiator has a first surface and a second surface, the first surface and the second surface are located on opposite sides of the water cooling radiator, the first pump is disposed on the first surface or the second surface of the water cooling radiator, and the cold plate is disposed on the second surface of the water cooling radiator.

A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.

An apparatus includes a structure configured to receive and transport thermal energy. The structure includes one or more materials configured to undergo a solid-solid phase transformation at a specified temperature or in a specified temperature range. The one or more materials form a heat input region configured to receive the thermal energy and a cold sink interface region configured to reject the thermal energy. The structure also includes one or more thermal energy transfer devices embedded in at least part of the one or more materials. The one or more thermal energy transfer devices are configured to transfer the thermal energy throughout the one or more materials and at least partially between the heat input region and the cold sink interface region. The one or more materials are also configured to absorb and store excess thermal energy in response to a temperature excursion associated with a thermal transient event and to release the stored thermal energy after the thermal transient event.

Inner panels including at least one built-in heat pipe connected in a circumferential direction are provided. In a heat pipe panel including the built-in heat pipe, apparatuses are mounted on the outer side of the plural inner panels connected in the circumferential direction to diffuse generated heat of the apparatuses to the circumferential direction of the inner panels. Webbed panels including a built-in heat pipe horizontally arranged and having heat radiation surfaces are radially arranged at corners of the inner panels as well as a heat pipe is horizontally built in and heat radiation surfaces are arranged also on outer panels facing the inner panels to thermally connect the heat pipes to one another.

A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.