A body armor system comprising an existing body armor vest with a plurality of armor plates, an adhering layer, an insulation layer and a plurality of heat exchangers wherein said plurality of armor plates is attached with said plurality of heat exchangers via said adhering layer; the plurality of heat exchangers comprises plurality of metallic plates made preferably of copper or aluminium with pipes brazed to the back-side of the metallic plates.

Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.

A thermosiphon device includes one or more flat multiport tube structures having at least one section that defines a plurality of flow channels and at least one web that extends from the section in a plane of the flat multiport tube structures. The flow channels may function as condensing channels, e.g., in a counterflow device, or as evaporation channels. A multiport tube structure may include two sections that each define a plurality of flow channels and the two sections may be joined by a web that extends between the sections in the plane of the multiport tube structure. The sections may function as condensing channels, as evaporation channels, or one section may function as a set of evaporation channel and the other section may function as a set of condensing channels. Multiport tube sections may alternately function as a vapor supply path or liquid return path.

A manufacturing method and structure of heat pipe with adjustable working temperature range are provided. The heat pipe includes a tube, a capillary structure and a working liquid. The tube includes a passage having a length direction and a diameter direction. Besides, a part of the tube has a pressed deformation zone in the pipe diameter direction, and the pressed cross-sectional area of the deformation zone in the diameter direction is reduced by a reduction ratio with respect to an original cross-sectional area before pressing, so that the deformation zone has a higher fluid resistance. Thereby, the heat pipe can be operated under a certain working temperature range, and the working object can achieve the working efficiency.

A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.

Methods, systems, and device for bendable flat heat pipes are provided in accordance with various embodiments. For example, some embodiments include a device that includes one or more containment layers. A wick and vapor layer may be positioned between two containment layers or between two portions of a containment layer; the wick and vapor layer may include both wick and vapor channels. Some embodiments include multiple cross ribs that may run laterally on either side or both sides of the wick and vapor layer. In some embodiments, the containment layer(s), the wick and vapor layer, and the multiple cross ribs are bonded with each other to form the device. In addition, the device may be charged with a working fluid.

A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.

A device in a utility distribution system may comprise a housing, a heat source, a first heat sink, a second heat sink, a heat pipe, and a flexible directional thermal interface material (DTIM) with a high-conductivity orientation. The first heat sink may be thermally coupled to the heat source. The second heat sink may be attached to the first heat sink, and the flexible DTIM and the heat pipe may be arranged between the first and second heat sinks. The flexible DTIM may be thermally coupled with the first heat sink and the heat pipe. The heat pipe may be capable of movements with respect to the flexible DTIM. During the movements, the heat pipe may maintain the thermal coupling with the flexible DTIM, such that heat present in the first heat sink may be transferred to the heat pipe via the high-conductivity orientation of the flexible DTIM.

A filling system that has a chamber, at least one heat pipe used for heat transfer and extending along the chamber, at least one ammonia tube that pure ammonia is able to be stored at room temperature as saturated vapour, at least one delivery line that enables to deliver ammonia from the ammonia tube to the heat pipe and the heat pipe is removably engaged, at least one valve is located on the delivery line and allows ammonia flow to controlled, at least one detector located on the delivery line and providing seal control, at least one heater to heat the heat pipe, and at least one cooler to cool the heat pipe.

A cooling device and a motor are provided. The cooling device that cools a heating element is provided with: a cooling chamber for cooling the heating element with a first cooling medium; a radiator chamber for releasing the heat of the first cooling medium to the outside; and a first connection path and a second connection path for connecting the cooling chamber and the radiator chamber. When part of the first cooling medium in the cooling chamber is gasified, at least part of the gasified first cooling medium moves into the first connection path, thus causing a circulation in which the first cooling medium in the cooling chamber flows into the radiator chamber via the first connection path, and the first cooling medium in the radiator chamber flows into the cooling chamber via the second connection path.