A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

A heat pipe system including a heat pipe having a first end and a second end for transferring working fluid from the first to the second end, a first reservoir in fluid communication with the first end for holding working fluid in liquid form, a first heat exchanger for transmitting thermal energy from a heat source to working fluid in the first reservoir to vaporize the fluid, a second heat exchanger for transmitting thermal energy from vaporized working fluid to a heat sink thereby condensing the fluid, a return conduit and a pump for pumping the condensed working fluid along the return conduit, where the heat pipe, the return conduit and the first reservoir form a hermetically sealed circuit. A method of transferring thermal energy using a heat pipe system is also disclosed.

A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly reduced mass flow rate and lower pressure drop as compared to the evaporator section, which has an increase liquid fraction of working fluid.

A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.

A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface thereof, and is thermally contacted with the heat source to absorb heat generated from the heat source. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator.

A perfluorinated 1-alkoxypropene represented by general Formula (I), compositions that include such compounds, and methods and systems that include such compositions are provided, wherein Formula (I) is represented by: R.sub.fO—CF═CFCF.sub.3 wherein R.sub.f is a linear, branched, or cyclic perfluoroalkyl group having 2 to 10 carbon atoms and optionally further including 1 to 3 nitrogen and/or 1 to 4 oxygen catenary heteroatoms.

Heat transfer apparatuses and methods for directing heat transfer are disclosed. A heat transfer apparatus includes a vapor chamber having a first surface and a second surface where the first surface and the second surface define a chamber space and at least one of the first surface and the second surface includes a hydrophilic coating. The heat transfer apparatus also includes one or more first ultrasonic oscillators coupled to the first surface, one or more second ultrasonic oscillators coupled to the second surface, and a controller having a non-transitory, processor-readable storage medium storing programming instructions for selectively activating the one or more first ultrasonic oscillators or the one or more second ultrasonic oscillators based on an intended direction of heat flux.

Provided are a phase change cooler with enhanced cooling performance and enhanced pressure resistance performance, and an electronic device using such a phase change cooler. The phase change cooler includes a heat receiving unit, a heat dissipating unit, a vapor pipe and a liquid pipe that interconnect the heat receiving unit and the heat dissipating unit to form a loop, and refrigerant encapsulated inside the phase change cooler. The heat receiving unit has an approximately semicircular cross section, and the vapor pipe is coupled to an inclined face of the heat receiving unit.

Provided here is an architectural plan (the solution) for the restoration of the terminal lake, the Salton Sea, an area of prevalent geothermal sources. It includes division of the Lake into three sections, preventing pollution of the Lake from nearby farmlands and importing seawater in central section with pipeline system; providing condition for tourism, and wildlife sanctuary; generating electricity by harnessing hydro, solar, and geothermal energy; and producing potable water and lithium as byproducts. Also includes a system and method for harnessing geothermal energy for generation of electricity by using complete closed loop heat exchange systems combined with onboard drilling apparatus. The system includes several devices operating separately in many different applications in energy sectors, Also, included is alternative use for the In-Line-Pump for marine crafts propulsion.

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.