The present invention relates to transfer of heat by thermosiphon blocks, thermosiphons or thermosiphon systems configured to be used or assembled to transfer heat. Thermosiphon block configured for a refrigerant to circulate between a first header and a second header interconnected with a fluid communicator arrangement comprising multiple MPE-tubes with fins in-between. The first header may have a receiving volume adapted to receive liquid refrigerant and to distribute the liquid refrigerant to the second header via a liquid communicator. The bock may be sealed. The invention also relates to a thermosiphon system comprising at least a first thermosiphon block. The first thermosiphon block may be configured as an evaporator with the receiving volume in the first header connected to a condenser. The thermodynamic system may have a piping between the first thermosiphon block and the condenser. The first thermosiphon block may be configured to be placed inside of a building, housing or a cabinet.

A refrigerant heat dissipation apparatus has an evaporator, a condenser having a first condensing tube and a second condensing tube, a first refrigerant tube, two second refrigerant tubes, and a refrigerant. The first refrigerant tube is connected between the top of the evaporator and an upper part of a first condensing tube. The second refrigerant tubes are respectively connected with a lower part of the first condensing tube and a lower part of the second condensing tube, so as to form a multi-flow closed-loop cycle. The refrigerant is filled into the multi-flow closed-loop cycle. The controlling of cycling direction of the refrigerant achieves the efficiency in heat dissipating of the refrigerant heat dissipation apparatus.

A cooling pipe system, including an evaporation pipe slantly arranged, a water inlet pipe, and a water removal assembly. An output end of the water inlet pipe is connected to an input end of the evaporation pipe, the water inlet pipe is connected to a three-way valve for introducing low molecular weight gas into the evaporation pipe. The water removal assembly is located below the evaporation pipe and includes a water sealing cavity, the output end of the evaporation pipe is connected to the water sealing cavity by means of a recovery pipe, the water sealing cavity is connected to a first pipeline extending upwards and communicated with the input end of the evaporation pipe, a lower end of the first pipeline is connected to a molecular sieve for preventing water vapor from passing through, and the water removal assembly is configured for absorbing the water vapor.

A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.

A cooling module includes a first casing, a second casing, and a cooling unit. The first casing includes a lower chamber filled with at least one working fluid. The first casing includes a heat source connecting face. The second casing includes an upper chamber. The cooling unit is located between the first and second casings. The cooling unit includes a plurality of tubes. Each of the plurality of tubes includes an end intercommunicating with the lower chamber and another end intercommunicating with the upper chamber, thereby the lower and upper chambers intercommunicate with each other. A plurality of cooling fin units is coupled to outer peripheries of the plurality of tubes. An angle between each of the plurality of tubes and the heat source connecting face is larger than 0° and smaller than 90°, or each of the plurality of tubes is parallel to the heat source connecting face.

In a dual material vapor chamber and an upper shell thereof, the dual material vapor chamber includes an upper shell, a copper lower shell, and a working fluid. The upper shell includes an aluminum substrate and plural aluminum fins. The aluminum substrate has an outer surface and an inner wall. The aluminum fins individually extend from the outer surface and are formed integrally. A copper deposition layer is coated on the inner wall. The copper lower shell is sealed to the upper shell correspondingly. A chamber is formed between the upper shell and the copper lower shell. The working fluid is filled in the chamber. Therefore, the weight and material cost of the whole vapor chamber can be reduced, and the packing combination between the upper shell and the copper lower shell can be simplified.

This cooling device (100) is a compressor for performing cooling by utilizing latent heat of vaporization without a compressor and is provided with a liquid feeding unit (10) for feeding a refrigerant, an evaporator (20) for evaporating the fed refrigerant, a condenser (30) for condensing the evaporated refrigerant, and a controller (50) for controlling the flow rate of the refrigerant. The controller is configured to determine whether or not dryout has occurred based on the temperature of the evaporator and the refrigerant temperature of the evaporator, the dryout being defined as a state in which a gas-phase refrigerant is in contact with an inner surface of a refrigerant flow path of the evaporator.

Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.

A pump-augmented Loop Heat Pipe (LHP) includes a conventional LHP evaporator/reservoir assembly; one or more additional evaporators; a condenser; a condenser bypass; and a pump upstream of the condenser and condenser bypass and configured to pump fluid generally toward the one or more additional evaporators.

Provided are a flat plate pulsating heat pipe having flexibility and having an improved sealing ability so as not to leak a working fluid therein, and a manufacturing method thereof. The flat plate pulsating heat pipe includes a base part having an upper surface or a lower surface which is plasma-treated, wherein the base part has a plurality of channels formed therein and both end portions of each of the channels are bent and connected to each other to form a closed-loop type or a closed type; and a pair of surface films bonded to an upper portion and a lower portion of the base part and bonded to each other at an outer portion of the base part to seal the channels.