The present invention discloses a phase-change heat dissipation device comprising a phase-change assembly internally provided with a phase-change heat exchange medium, and the phase-change heat exchange medium provided in the phase-change assembly is configured such that, in an operating state of the phase-change heat dissipation device, an air pressure within the phase-change assembly is greater than 0.15 MPa. When the phase-change heat dissipation device of the present invention works in a working temperature range of 30-80° C., the internal pressure is far greater than the standard atmospheric pressure, the internal of the phase-change heat dissipation device is in a positive-pressure non-vacuum environment, the heat flux density of the heat source is high, the absolute pressure in the evaporator part of the phase-change assembly is high, the relative pressure difference between different parts of the phase-change assembly under the same temperature difference condition is large, and the pressure difference can drive more phase-change medium. Therefore, the heat exchange capacity is enhanced, the fluidity of the internal phase-change heat exchange medium is improved, which improves the heat flux density of heat transfer and makes it easier to achieve efficient heat dissipation.

A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.

A heat transport device in a container having an internal space filled with a working fluid, includes an evaporator which causes the working fluid to evaporate, a condenser separated from the evaporator and which causes the working fluid to condense, and an intermediate part arranged between the evaporator and the condenser and having at least one main groove which extends continuously from the condenser to the evaporator through the intermediate part. A part or entirety of main grooves among the at least one main groove is a sloped groove having a sloped groove bottom that, when viewing a cross section along an extending direction of the main groove, slopes from a groove bottom position of a groove portion positioned at the condenser towards a groove bottom position of the groove portion positioned at the evaporator, so as to approach a bottom surface of the heat transport device.

A heat dissipation device includes a first pipeline and a second pipeline. The first pipeline is configured to circulate a first fluid. The second pipeline is configured to circulate a second fluid. The second pipeline has a sleeve section, an input portion, and an output portion. The sleeve section sleeved with a part of the first pipeline to form a circulation tunnel between the sleeve section and the part of the first pipeline. The input portion and the output portion are connected to two ends of the sleeve section respectively.

A cryogenic cooling system is provided comprising: a mechanical refrigerator, a heat pipe and a heat switch assembly. The mechanical refrigerator has a first cooled stage and a second cooled stage. The heat pipe has a first part coupled thermally to the second cooled stage and a second part coupled thermally to a target assembly. The heat pipe is adapted to contain a condensable gaseous coolant when in use. The heat switch assembly comprises one or more gas gap heat switches, a first end coupled thermally to the second cooled stage and a second end coupled thermally to the target assembly. The cryogenic cooling system is adapted to be operated in a heat pipe cooling mode in which the temperature of the second cooled stage is lower than the first cooled stage and wherein the temperature of the target assembly causes the coolant within the second part of the heat pipe to be gaseous and the temperature of the second cooled stage causes the coolant in the first part of the heat pipe to condense. The target assembly is cooled by the movement of the condensed liquid coolant from the first part of the heat pipe to the second part of the heat pipe during the heat pipe cooling mode. The cryogenic cooling system is further adapted to be operated in a gas gap cooling mode in which the temperature of the second cooled stage causes freezing of the coolant. The heat switch assembly is adapted to provide cooling from the second cooled stage to the target assembly during the gas gap cooling mode via the one or more gas gap heat switches.

A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

An arrangement for thermal management is disclosed, wherein a heat generating component is arranged within an enclosure, defined by an enclosure wall and in thermal contact with a thermal management fluid. The arrangement comprises an electrohydrodynamic flow unit, comprising a first and a second electrode, for controlling the flow of fluid within the enclosure.

Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.

An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.