Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.

A boiling cooling device and a boiling cooling system which can promote boiling and restrain the cooling capacity of the device from deteriorating. A boiling cooling device includes: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing the microbubbles is supplied and which boils the refrigerant; a radiator to cool the refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump 11; and a gas-liquid separator 15 to separate gas from the circulating refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump.

This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.

A system may include a pump, an evaporator, a condenser, an accumulator, a pump bypass line, a first valve, and a second valve. The system may operate in a powered-pump mode, in which the pump drives fluid circulation, the first valve prevents fluid circulation through the pump bypass line, the pump pumps liquid from the accumulator to the evaporator, gas exiting the evaporator flows to the condenser, liquid exiting the evaporator flows through the second valve to the accumulator, and liquid exiting the condenser flows to the accumulator. The system may operate in a passive-capillary mode, in which capillary pressure in the evaporator drives fluid circulation, the first valve prevents fluid circulation through the pump, liquid flows from the accumulator, through the pump bypass line, and to the evaporator, gas exiting the evaporator flows to the condenser, the second valve is closed, and liquid exiting the condenser flows the accumulator.

A method which allows the ejection of non-condensable gases, notably air, from a closed loop power generation process or heat pump system, is disclosed. A vessel in which a working fluid is absorbed or condensed can be separated from the power generation processes by valves. Residual gas comprising C02, non-condensable gas such as air, water and alkaline materials including amines may be compressed by raising the liquid level in said vessel. The concurrent pressure increase leads to the selective absorption of C02 by alkaline materials. In simpler embodiments, mainly air is removed from one- or two-component processes. Following the compression, non-condensable gas may be vented, optionally through a filter. The method is simple and economic as vacuum pumps may be omitted. The method is useful for any power generation and Rankine cycle, and particularly useful for the power generation process known as C3 or Carbon Carrier Cycle.

Provided is an automatic secondary degassing fixed-length mechanism for an ultrathin heat pipe. The automatic secondary degassing fixed-length mechanism comprises an automatic lifting device A installed on a length adjustment sliding table, an automatic clamping device B, a length positioning and extension device C and a PLC. The present invention, having the advantages of simple structure, high efficiency and stability, is suitable for the secondary degassing fixed-length processing of heat pipes of different lengths, and particularly suitable for processing ultrathin heat pipes made of a thin-walled heat pipe by a flattening process, having advanced structural design and stable and high-efficiency production. In this mechanism, size positioning and automatic clamping in the secondary degassing fixed-length process for the heat pipes are correspondingly achieved through the automatic lifting device A and the automatic clamping device B. Downward component force applied to the thin-walled heat pipes in the die-opening-sealing process is released through the length positioning and extension device C, so that deformation of bending or partial sinking of pipe bodies of the thin-walled heat pipes in the secondary degassing fixed-length process is avoided. In this way, the qualification rate of the products and the economic benefit of the enterprise are greatly improved, and the problems with the existing secondary degassing fixed-length processing of the ultrathin heat pipe are solved.

Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.

Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.

A thermal management loop system may include an accumulator, an evaporator in fluid receiving communication with the accumulator, a condenser in fluid receiving communication with the evaporator, and a rotary separator in fluid receiving communication with the condenser. Gas exiting the rotary separator may recirculate back to the condenser and liquid exiting the rotary separator may flow to the accumulator. The thermal management loop system may be a dual-mode system and thus may be operable in a powered-pump mode or a passive-capillary mode.

A communication-type thermal conduction device includes a vapor chamber, at least one heat pipe, and at least one third capillary structure. The vapor chamber has a bottom board. A first capillary structure is disposed on an inner surface of the bottom board. A second capillary structure is disposed in the heat pipe. One end portion of the heat pipe is connected to the bottom board, and the end portion has an open portion in communication with the heat pipe and the vapor chamber. The second capillary structure has a connected portion exposed by means of the open portion. The third capillary structure is connected to the first capillary structure and the connected portion, so that the first and second capillary structures are in communication with each other. Accordingly, holistic thermal conduction can be achieved, and the vapor chamber incorporating the heat pipe can provide the desired heat dissipation effect.