A thermal management loop system may include an accumulator, an evaporator in fluid receiving communication with the accumulator, a condenser in fluid receiving communication with the evaporator, and a rotary separator in fluid receiving communication with the condenser. Gas exiting the rotary separator may recirculate back to the condenser and liquid exiting the rotary separator may flow to the accumulator. The thermal management loop system may be a dual-mode system and thus may be operable in a powered-pump mode or a passive-capillary mode.

In some embodiments, a thermosiphon configured for use within a temperature-regulated storage device includes: a condenser region, including a plurality of evenly spaced condenser channels with horizontally symmetrical bifurcated branches connected to an adiabatic channel, each of the plurality of condenser channels connected at a top position to an upper channel; an evaporator region, including a plurality of evaporator channels, wherein each of the plurality of evaporator channels has a flow channel formed in a serpentine channel pattern and each subunit of the serpentine channel pattern is attached to a vapor return channel at a top of the subunit, and wherein the evaporator region has at least one lowest position connected directly to a vapor return channel; and an adiabatic region including at least one adiabatic channel connecting the evaporator channels and the condenser channels.

According to one embodiment, a heat transport apparatus includes an evaporator, a cooling unit, a channel structure, and a heating mechanism. The evaporator vaporizes a refrigerant by heat generated by a heat-generating element. The cooling unit is provided above the evaporator and cools and condenses the refrigerant vaporized in the evaporator. The channel structure constitutes a channel through which the refrigerant circulates between the evaporator and the cooling unit. The heating mechanism heats the cooling unit and suppresses solidification of the refrigerant at the cooling unit.

A thermal management loop system may include an accumulator, an evaporator in fluid receiving communication with the accumulator, a condenser in fluid receiving communication with the evaporator, and a membrane separator in fluid receiving communication with the condenser. Gas exiting the membrane separator may recirculate back to the condenser and liquid exiting the membrane separator may flow to the accumulator. The thermal management loop system may be a dual-mode system and thus may be operable in a powered-pump mode or a passive-capillary mode.

A thermal management loop system may include an accumulator, an evaporator in fluid receiving communication with the accumulator, a condenser in fluid receiving communication with the evaporator, and a membrane separator in fluid receiving communication with the condenser. Gas exiting the membrane separator may recirculate back to the condenser and liquid exiting the membrane separator may flow to the accumulator. The thermal management loop system may be a dual-mode system and thus may be operable in a powered-pump mode or a passive-capillary mode.

A communication-type thermal conduction device includes a vapor chamber, at least one heat pipe, and at least one third capillary structure. The vapor chamber has a bottom board, and a first capillary structure is disposed on an inner surface of the bottom board. A second capillary structure is disposed in the heat pipe. One end portion of the heat pipe is connected to the bottom board, and the end portion has an open portion in communication with the heat pipe and the vapor chamber. The second capillary structure has a connected portion exposed by means of the open portion. The third capillary structure is connected to the first capillary structure and the connected portion, so that the first and second capillary structures are in communication with each other. Accordingly, holistic thermal conduction can be achieved, and the vapor chamber incorporating the heat pipe can provide the desired heat dissipation effect.

A system may include a pump, an evaporator, a condenser, an accumulator, a pump bypass line, a first valve, and a second valve. The system may operate in a powered-pump mode, in which the pump drives fluid circulation, the first valve prevents fluid circulation through the pump bypass line, the pump pumps liquid from the accumulator to the evaporator, gas exiting the evaporator flows to the condenser, liquid exiting the evaporator flows through the second valve to the accumulator, and liquid exiting the condenser flows to the accumulator. The system may operate in a passive-capillary mode, in which capillary pressure in the evaporator drives fluid circulation, the first valve prevents fluid circulation through the pump, liquid flows from the accumulator, through the pump bypass line, and to the evaporator, gas exiting the evaporator flows to the condenser, the second valve is closed, and liquid exiting the condenser flows the accumulator.

A thermal management loop system may include an accumulator, an evaporator in fluid receiving communication with the accumulator, a condenser in fluid receiving communication with the evaporator, and a membrane separator in fluid receiving communication with the condenser. Gas exiting the membrane separator may recirculate back to the condenser and liquid exiting the membrane separator may flow to the accumulator. The thermal management loop system may be a dual-mode system and thus may be operable in a powered-pump mode or a passive-capillary mode.

A thermal management loop system may include an accumulator, an evaporator in fluid receiving communication with the accumulator, a condenser in fluid receiving communication with the evaporator, and a rotary separator in fluid receiving communication with the condenser. Gas exiting the rotary separator may recirculate back to the condenser and liquid exiting the rotary separator may flow to the accumulator. The thermal management loop system may be a dual-mode system and thus may be operable in a powered-pump mode or a passive-capillary mode.

Embodiments for a heat pipe heat flux rectifier are provided. One embodiment includes a first curved diode heat pipe that includes an adiabatic section that includes a curved portion, an evaporator section that is coupled to the adiabatic section, and a condenser section that is coupled to the adiabatic section. In some embodiments, the first curved diode heat pipe includes a non-condensable gas reservoir that is coupled to the condenser section for storing non-condensable gas, where the first curved diode heat pipe stores a fluid and a wicking material. In some embodiments, the first curved diode heat pipe operates as a thermal conductor when heat is applied to the evaporator section and as a thermal insulator when heat is applied to the condenser section.