A thermosiphon heat exchanger includes a chassis, an evaporation assembly and a condensation assembly. The chassis has an internal circulation chamber and an external circulation chamber separated from each other. The evaporation assembly is disposed in the internal circulation chamber. The condensation assembly is disposed in the external circulation chamber and horizontally positioned higher than the evaporation assembly, and the condensation assembly is coupled to the evaporation assembly by plural separated loops.

A dual heat transfer structure, comprising: at least a heat pipe and at least a vapor chamber; the heat pipe having a first end, an extension portion, and a second end, the first and second ends disposed at the two ends of the extension portion; the vapor chamber being concavely bent with its two ends being joined together and selectively compasses, encircles, encloses, or surrounds one of the first and second ends and extension portion. The dual heat transfer structure of the present invention is a complex structure that can both transfer heat with a large area and to the distal end of the structure.

A heat transfer device includes a sleeve, which forms an interior in which a working medium and one vaporization element having structural elements, or multiple vaporization elements having structural elements, for converting at least part of the working medium from the liquid to the gaseous state are contained, wherein the vaporization element or the vaporization elements has or have a porosity, and is or are connected to the sleeve.

A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.

A vapor chamber structure includes a thermally conductive shell, a capillary structure layer, and a working fluid. The thermally conductive shell includes a first thermally conductive portion and a second thermally conductive portion. The first thermally conductive portion and the second thermally conductive portion are a thermally conductive plate that is integrally formed, and the thermally conductive shell is formed by folding the thermally conductive plate in half and then sealing the thermally conductive plate. The first thermally conductive portion has at least one first cavity, the second thermally conductive portion has at least one second cavity. At least one sealed chamber is defined between the thermally conductive plate, the first cavity and the second cavity. A pressure in the sealed chamber is lower than a standard atmospheric pressure. The capillary structure layer covers an inner wall of the sealed chamber. The working fluid is filled in the sealed chamber.

A cold plate apparatus is disclosed. A cold plate includes a first set of sinusoidal conduits and a second set of sinusoidal conduits formed therein. The first set of sinusoidal conduits is arranged in a first direction, and the second set of sinusoidal conduits is arranged in a second direction. Crests of the first set of sinusoidal conduits overlap troughs of the second set of sinusoidal conduits. Crests of the second set of sinusoidal conduits overlap troughs of the first set of sinusoidal conduits. A first set of header plates is fluidically coupled to the first set of sinusoidal conduits, and a second set of header plates is fluidically coupled to the second set of sinusoidal conduits.

A vapor chamber includes a case, an evaporation portion, a condensation portion, a transmission portion, and a working fluid. The case has a chamber. The evaporation portion, the condensation portion and the transmission portion are formed in different areas of the case. The evaporation portion has a first chamber room. The condensation portion has a second chamber room. A cross-sectional width of the second chamber room is less than a cross-sectional width of the first chamber room. The transmission portion is formed between the evaporation portion and the condensation portion. The transmission portion has a passage communicating with the first and the second chamber room. The passage has a first end adjacent to the evaporation portion and a second end adjacent to the condensation portion. A width of the first end is greater than a width of the second end. The working fluid is disposed in the chamber.

A heat dissipation device is provided and includes: a first vapor chamber filled with a first working fluid therein and used for contacting at least one heat source; at least one heat transfer structure disposed on a side of the first vapor chamber; and a second vapor chamber filled with a second working fluid therein and connected to the first vapor chamber via the heat transfer structure, where the first working fluid absorbs heat of the heat source and then vaporizes, and the vaporized first working fluid transfers the heat to the second working fluid via the heat transfer structure.

A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a first loop, a first working fluid fills the first loop to transfer heat via phase transformation, and a first high-temperature section and a first low-temperature section are formed on the first pipe. The second pipe is connected to the second tank to form a second loop, a second working fluid fills the second loop to transfer heat via phase transformation, and a second high-temperature section and a second low-temperature section are formed on the second pipe. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.

A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate comprises a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir. The heat exchanger is formed by an aluminum extrusion and stamping process and comprises three main steps, a providing step, a closing and welding step, and an insertion, vacuuming and closing step.