A loop-type heat pipe includes a loop-type heat pipe main body including a loop-shaped flow path in which a working fluid is enclosed, a first magnet provided to the loop-type heat pipe main body, a heat dissipation plate thermally connected to the loop-type heat pipe main body, and a second magnet provided to the heat dissipation plate and provided to face the first magnet. The first magnet and the second magnet are provided so that different magnetic poles face to each other.

A refrigerated merchandiser including a case defining a product display area and including an air inlet and an air outlet in communication with the product display area to form an air curtain across a front of the product display area. The refrigerated merchandiser also includes a shelf that is coupled to the case within the product display area. The shelf includes insulation between a top and a bottom of the shelf, and a passive heat exchanger that has a heat pipe embedded in the shelf within the insulation and that extends from a front of the shelf to a back of the shelf. Ambient air infiltrating the air curtain initiates passive heat transfer within the plurality of heat tubes.

A cooling apparatus for a medium voltage switchgear includes an evaporator section; a fluid conduit; and a condenser section. The evaporator section surrounds a current carrying contact and is configured such that fluid within the evaporator section can contact an outer surface of the current carrying contact. The evaporator section is fluidly connected to the fluid conduit. At least part of the evaporator section is electrically insulating and is connected to the fluid conduit. The fluid conduit is fluidly connected to the condenser section. In use, a working fluid in the evaporator section is heated to a vapor state, the vapor is transferred by the fluid conduit to the condenser section, and the vapor in the condenser section is condensed to the working fluid. The working fluid is passively returned to the evaporator section.

Disclosed is a heat pipe arrangement method for a heat dissipation and transfer device. The heat dissipation and transfer device includes a metal base, a heat dissipation fin, a heat dissipation fan and a plurality of heat pipes. Each heat pipe includes a heat absorption end and a heat dissipation end. The heat dissipation ends of the plurality of heat pipes are provided in the heat dissipation fin in a penetrating manner. The heat dissipation fan is provided on the heat dissipation fin. Tops of the heat absorption ends of the plurality of heat pipes are tightly mounted on a mounting surface of the metal base. The heat pipe arrangement method includes: arranging the heat absorption ends of the plurality of heat pipes in parallel to each other, center distances between the heat absorption ends of the plurality of heat pipes being different.

A plate vapor chamber array assembly with a plurality of plate vapor chambers joined in an array and each chamber having an evaporation area and an evacuated sealed chamber. The plate vapor chambers may be in direct contact with adjacent plate vapor chambers. A vapor chamber clamp surrounding the array has an inner surface engaging an outer edge of at least two of the plate vapor chambers of the array to press a surface of the plate vapor chamber array directly against the heat source.

A thermal module includes a base seat and multiple heat pipes. The base seat has a heat absorption side and a heat conduction side. Each heat pipe has a heat absorption end and a heat dissipation end. The heat absorption end has a pair of long sides and a pair of short sides. The long sides and the short sides are connected with each other in the form of a loop to form the heat absorption end. The heat pipes are assembled with each other with the long sides attached to each other. The heat pipes are assembled with the base seat with the short sides attached to the heat conduction side of the base seat. By means of the above arrangement, the number of the heat pipes disposed in a limited area or space can be greatly increased to enhance the heat conduction efficiency.

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19° C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40° C.). An additional two watts of power was generated by the TEGs.

A heat dissipation module for dissipating heat from a heat source of a projection apparatus includes a thermoelectric module, a heat dissipation member, an absorption material, a transmission member and an insulating material. The thermoelectric module is disposed between the heat source and the heat dissipation member and has a cold side and a hot side opposite to each other, where the cold side is for dissipating heat from the heat source, and the hot side contacts with the heat dissipation member. The transmission member has a connection end and an evaporation end, wherein the connection end connects with the absorption material. The insulating material covers the absorption material and the transmission member. A projection apparatus uses the heat dissipation module. The heat dissipation module and the projection apparatus can prevent possibility of condensed moisture flowing into the system to damage electronic devices, and therefore have higher structural reliability.

A heat dissipation device including a heat dissipation fin group, a plurality of heat pipes, and a vapor chamber is provided. The heat dissipation fin group includes a plurality of fins arranged along an extension direction and is divided into a first fin group, a second fin group, and a third fin group. The third fin group is disposed between the first fin group and the second fin group. Each fin of the first fin group and the second group includes a plurality of through holes. Each fin of the third fin group includes a plurality of notches. The heat pipes are disposed through the first fin group and the second fin group by the through holes. The vapor chamber is correspondingly disposed on the third fin group and includes a plurality of grooves. The vapor chamber is in contact with the heat pipes exposed from the notches.