A passive hybrid heat transfer system for cooling a heat source, such as an integrated circuit, includes a thermosiphon heat transfer subsystem that operates in combination with a supplemental heat transfer subsystem to transfer heat away from and thereby cool the integrated circuit. The heat transfer system includes the thermosiphon heat transfer subsystem including a condenser coupled to an evaporator. The evaporator is coupled to the integrated circuit or other heat source and is positioned below the condenser relative to a direction of gravity. The supplemental heat transfer subsystem is thermally coupled to the evaporator of the thermosiphon heat transfer subsystem and has at least a portion extending below the evaporator relative to the direction of gravity. A network device like a switch or router may include the hybrid heat transfer system to cool high power integrated circuits without the need to resort to active cooling systems.

A liquid-vapor composite heat dissipation system includes a heat exchange device filled with a working fluid, a number of liquid-vapor composite heat dissipation units that are positioned higher than the heat exchange device, each of the liquid-vapor composite heat sink units having a housing with an internal capillary occupying the interior of the housing and partially separating a spatially disconnected inlet chamber and an outlet chamber. The bottom of the housing is attached to a heat source. A liquid supply tube is connected to the heat exchange device at one end, and at the other end to a liquid inlet of each of the liquid-vapor composite heat sink units through each of the liquid supply pipes. A liquid return tube is connected to the heat exchange device at one end, and to each of the liquid-vapor composite heat sink units at the other end through each of the return pipes.

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

Systems and method for providing a micro-channel array are provided. In some embodiments, a micro-channel array includes a plurality of micro-channels having a first end and a second end; where at least one of the first end and the second end allows fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes external manifolding for fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes internal manifolding for fluid connectivity between the plurality of micro-channels. This may solve one of the largest causes of low yields and poor performance consistency in the production process while at the same time simplifying production and reducing production costs.

A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.

A heat dissipation base includes a fixing plate and a metal heat conduction block. The fixing plate includes a plurality of heat pipe partitions and a plurality of heat pipe fixing openings, and the heat pipe fixing openings are formed between the heat pipe partitions. The metal heat conduction block is fixed to the fixing plate, and the fixing plate further includes a plurality of supporting portions to support shear surfaces at two ends of the heat conduction block.

Device for an endoscopic illumination apparatus comprising a heat pipe having a first end region and a second end region; a first heat source; a heat dissipation element for dissipating thermal energy from said first heat source; a heat sink spaced apart from the first heat source; and a clamping element, wherein the clamping element is reversibly detachably mounted on the heat dissipation element such that the first end region of the heat pipe is held between the heat dissipation element and the clamping element, wherein the heat pipe is adapted to conduct the thermal energy of the heat source to the heat sink, wherein the second end region of the heat pipe is spaced apart from the first end region, and wherein the second end region ends in the heat sink.

Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.