A temperature plate device includes a plate body and a bent structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent structure is connected to and traverses the first step section between the first step section and the second step section.

A display device is disclosed. The display device includes a display panel, a vapor chamber positioned behind the display panel, a board, which is positioned behind the vapor chamber and is coupled to the vapor chamber, and an adhesive member disposed between the display panel and the vapor chamber so as to be coupled thereto, wherein the vapor chamber includes a first plate, which defines a front surface thereof and faces the display panel, a second plate, which defines a rear surface thereof and is coupled to the first plate, and fluid flowing in a space defined between the first plate and the second plate, and wherein the first plate includes a coupler, which is depressed rearwards from the first plate and to which the adhesive member is coupled.

A thermal ground plane comprises top and bottom layers that are substantially impervious to fluid and together defining an inner space, a vapour transport mesh layer having a relatively coarse mesh structure and located within said space, and at least one liquid transport mesh layer having a relatively fine mesh structure and located between said vapour transport mesh layer and one of said top and bottom layers, the two said mesh layers being in contact with one another across substantially their entire planar extents. The top and bottom layers are sealed with a substantially fluid tight seal, and said inner space contains a liquid and is partially evacuated.

A heat exchange system for heat dissipation of an electronic control assembly includes: a first heat exchange portion including a first end having a first communication port and a second end having a second communication port; a second heat exchange portion including a first end having a third communication port and a second end having a fourth communication port, and at least a part of the second heat exchange portion being configured to be in contact with the electronic control assembly; a first connection tube communicating the first communication port with the third communication port; and a second connection tube communicating the second communication port with the fourth communication port. The first and second heat exchange portions and the first and second connection tubes constitute a loop, the loop has an opening, and the opening is closed when the heat exchange system is in an operative state.

A heat dissipation net disposed on a base plate of a vapor chamber unit includes a base net portion and conduction units formed on the base net portion. Each conduction unit has a protruding area, a recessed area, and a curved section formed between the protruding area and the recessed area. When the heat dissipation net is disposed on the base plate, the existence of the recessed area and the curved section prevents the base net portion from being unduly pressed and stuck to the base plate to thereby improve a capillary action of the heat dissipation net. A space formed between each protruding area and the base plate facilitates the quick conduction of vaporized working fluid of the vapor chamber unit. Thus, the entire heat dissipation efficiency is increased.

A system for distilling water is disclosed. The system comprises a heat source, and a plurality of open-cycle adsorption stages, each stage comprising a plurality of beds and an evaporator and a condenser between a first bed and a second bed, wherein each bed comprises at least two vapor valves, a plurality of hollow tubes, a plurality of channels adapted for transferring water vapor to and from at least one of the condenser or the evaporator, a thermally conductive water vapor adsorbent, and wherein each vapor valve connects a bed to either the condenser or the evaporator.

Methods, systems, and device for thermal energy storage are provided. For example, some embodiments include a thermal energy storage device that may include: a first casing wall; a second casing wall; and/or multiple support structures located between the first casing wall and the second casing wall. The multiple support structures may provide continuous thermal paths and/or continuous mechanical paths between the first casing wall and the second casing wall. The thermal energy storage device may be fabricated utilizing an additive manufacturing technique, such as direct laser metal sintering. Some embodiments may be manufactured utilizing printed metals, such as an aluminum alloy. In some embodiments, a phase-change material is charged between the first casing wall and the second casing wall. The phase-change material may include paraffin.

A defrosting apparatus comprises a heater case comprising a heat pipe seating part formed to extend from one surface thereof in a recessed shape and a heater receiving part formed to extend to be parallel with the heat pipe seating part. The defrosting apparatus also includes a heater which is mounted in the heater receiving part so as to emit heat when power is applied thereto, a heat pipe which has a flow path through which a working fluid filled therein flows, which has a part seated on the heat pipe seating part, and which is disposed to be adjacent to a cooling pipe of an evaporator such that heat is radiated to the cooling pipe of the evaporator by means of the working fluid at a high temperature which is heated by the heater and then is transferred, and a holder which is detachably coupled to the heater case so as to cover the heat pipe seated on the heat pipe seating part.

An enhanced gravity-driven, thin film condensation heat transfer condenser is disclosed for use in a thermosyphon performing in two perpendicular orientations, as well as orientations in between. The thermosyphon includes an evaporator fluidly coupled to a first condenser configured with a plurality of fins, with each of the plurality of fins having notches adjacent to flanges, the notches forming vapor flow channels through the plurality of fins. The first condenser is fluidly coupled to a second condenser, and vapor flowing from the evaporator must first pass through the first condenser before entering the second condenser.

A protective shroud includes a top plate, a first side plate that is adapted to be disposed proximate a first edge region of a plurality of cooling fins of a heat exchanger for an integrated circuit, and a second side plate that is adapted to be disposed proximate a second edge region of the plurality of cooling fins.