An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel. First and second tube parts are in fluid communication with evaporation portion.

A heat dissipating device includes a thermosyphon, a first liquid cooling tube and a first heat dissipating fin set. The thermosyphon has an evaporation portion and a condensation portion. The first liquid cooling tube is sleeved on the condensation portion. The first heat dissipating fin set is sleeved on the first liquid cooling tube.

A heat pipe includes an extruded profile body, with a hollow body closed at the ends, filled with a predefined volume of diphasic working fluid. A plurality of longitudinal channels are included, with each having a section delimited by a bottom formed by one tubular peripheral wall of the profiled body, and laterally by two longitudinal dividers. A circumferential transfer channel, which is arranged transversely to the local axial direction and provides mutual fluid connection between the longitudinal channels, is provided at a position along the longitudinal path and or at an end, where the longitudinal dividers are interrupted, partially or completely, in the area of the circumferential channel, with optional use of a closure ring.

A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19° C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40° C.). An additional two watts of power was generated by the TEGs.

Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.

A method and apparatus for recovering water from a heated gas mixture. The heated gas mixture is passed across one or more heat pipe heat exchangers connected in series. Each heat pipe heat exchanger includes an upper chamber separated from a lower chamber, and sealed heat pipes extending between the chambers. The heated gas mixture is passed across the lower chamber, where the heated gas mixture is cooled with the plurality of heat pipes, passing heat into the heat pipe fluid and thereby condensing water vapor to liquid water on an outside of the of heat pipes. Ambient air or other gas of a cooling temperature is passed across the upper chamber to reduce the heated temperature controlled fluid inside the plurality of heat pipes.

A traction battery assembly includes a thermal exchange device of a battery pack, and battery arrays disposed adjacent the thermal exchange device. A phase change material is secured to an area of the thermal exchange device. A method of managing thermal energy within a battery pack includes, among other things, positioning battery arrays against a thermal exchange device, and securing a phase change material to the thermal exchange device. The phase change material is configured to take on thermal energy from at least one of the battery arrays.

The disclosure relates to a heat dissipation module and a manufacturing method thereof. The heat dissipation module includes a heat pipe, multiple heat dissipation fins and multiple rings. The heat pipe has a peripheral wall. Each heat dissipation fin has a through hole and an annular wall disposed on an outer edge of the through hole. The heat dissipation fins are adapted to sheathe the heat pipe in a spacedly stacked manner through the through hole. Each ring annularly is adapted to sheathe each annular wall in a compressive manner to embed and compressedly connect each annular wall to the peripheral wall. Therefore, efficiency of heat dissipation and structural strength of the heat dissipation structure are improved.

A heat pipe heat exchanger is used in combination with a damper assembly to selectively control an amount of heat exchange provided. A divider defines discrete heat pipe plenums and bypass plenums within a duct, and the heat pipe system is configured so that all of the coils of one portion of the heat pipe system are received in the heat pipe plenum(s), while the bypass plenum(s) are free of any coils. The damper assembly includes adjustable heat pipe dampers aligned with the heat pipe plenums and adjustable bypass dampers aligned with the bypass plenums.

A heat exchanger comprises a jacket element and an insert element. The jacket element is configured as a fluid channel for a fluid to be tempered. The insert element is arranged in the fluid channel. The insert element includes web elements which are connected to the jacket element at different locations. Some of the web elements contain web element channels which are fluidly connected with the jacket element, so that in the operating state, a heat transfer fluid which is supplied to the jacket element can flow through the web elements. The jacket element contains chambers for a heat transfer fluid. The chambers contain one inlet opening and one outlet opening for the heat transfer fluid. The inlet opening and the outlet opening of the chamber are connected to the web element channels of two web elements each, which belong to the same row of web elements.