A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.

Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.

Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.

A heat radiating device includes a plurality of heat pipes including respective heat receiving portions that are located above an integrated circuit and that are thermally connected to the integrated circuit, and a heat sink connected to the plurality of heat pipes. A plurality of the heat receiving portions are aligned with each other in a left-right direction and are in contact with the heat receiving portions (73a) of adjacent ones of the heat pipes. The heat receiving portions each have a first width in an upward-downward direction and have a second width smaller than the width in the left-right direction. With this, cooling performance for the integrated circuit can be improved.

A heat dissipation device is provided and includes a vapor chamber unit, a heat pipe set provided on an outer surface of the vapor chamber unit, a first fin set provided on the outer surface of the vapor chamber unit and sleeving the heat pipe set, and a second fin set stacked on the first fin set and sleeving the heat pipe set, where the fin arrangement direction of the first fin set is different from the fin arrangement direction of the second fin set.

A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

A heat dissipation apparatus includes a vapor chamber and multiple flow field fins. The vapor chamber includes a lower plate part and an upper plate part. The lower plate part includes multiple flow channels, a first and a second confluence areas formed on the flow channels. The upper plate part covers on the lower plate part to enclose the flow channels, the first and second confluence areas. Each flow field fin includes an inlet channel, an outlet channel, and a circuitous channel. The inlet channel communicates with the first confluence area, the outlet channel communicates with the second confluence area, and the circuitous channel communicates between the inlet channel and the outlet channel in a single flow direction. The flow field fins are collectively as an inlet surface at one side adjacent to the outlet channel and as an outlet surface at another side adjacent to the inlet channel.

Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.

An electronic device (10) with a liquid cooling mechanism includes an electronic device body (1), a heat dissipation module (2) and a liquid cooling module (3). The electronic device body (1) includes a housing (11) and at least one heat generating element (12) installed in the housing (11). The heat dissipation module (2) is contained in the housing (11) and attached to the heat generating element (12). The liquid cooling module (3) includes a liquid cooling pipe (31) contained in the housing (11) and attached to the heat dissipation module (2), and two ends of the liquid cooling pipe (31) have two interface portions (311) exposed from the housing (11). In this way, the liquid cooling pipe (31) is used for water cooling to achieve a desirable cooling efficiency for the electronic device (10).

A floating heat pipe assembly includes a floating heat pipe and a clamp collar used with the floating heat pipe. The floating heat pipe has a flattened section that has a flattened pipe size smaller than a pipe size of any other section of the floating heat pipe, so that the floating heat pipe is adjustable at the thinner flattened section for other sections of the floating heat pipe located at two opposite ends of the flattened section to displace to two positions having a height difference between them. The clamp collar is fitted on around the flattened section and includes two symmetrically arranged elastic clamping sections that elastically clamp on two opposite outer sides of the flattened section to hold the same in place, so that the sections of the floating heat pipe located at different heights do not deform to cause reduced or failed capillary action efficiency.