A cooling sub-assembly for cooling a heat dissipating electronic device. The sub-assembly may include a vapor chamber, a peltier element and a coldplate placed on top of each other forming a stack such that the peltier element is sandwiched between the vapor chamber and the coldplate. The vapor chamber has a head facing the peltier element, a foot for facing the heat dissipating electronic device, and a wall extending between the foot and the head. The area of the head is larger than the area of the foot.

In a phase-change cooling apparatus including an indoor unit and an outdoor unit, a configuration to prevent dew condensation in the indoor unit causes the cooling performance to decrease; therefore, a refrigerant circulating apparatus according to an exemplary aspect of the present invention includes refrigerant-liquid thermal equilibrium means for mixing a first refrigerant liquid with a second refrigerant liquid and sending a reflux refrigerant liquid composed of the first refrigerant liquid and the second refrigerant liquid, the first refrigerant liquid being a liquid-phase refrigerant included in a gas-liquid two-phase refrigerant flowing in from heat receiving means, the second refrigerant liquid arising due to the gas-liquid two-phase refrigerant cooled by heat radiating means; a refrigerant passage configured for the gas-liquid two-phase refrigerant and the reflux refrigerant liquid to circulate between the heat receiving means and the refrigerant-liquid thermal equilibrium means; refrigerant-liquid reflux means for refluxing the reflux refrigerant liquid to the heat receiving means through the refrigerant passage; and refrigerant-liquid flow control means for controlling a flow rate of the reflux refrigerant liquid.

A cooling module includes a thermally conductive plate and a heat pipe. The thermally conductive plate includes a groove having two inner walls that are opposite to each other, a first upper protrusion protrusively located on the plate body and the first inner wall, a second upper protrusion protrusively located on the plate body and the second inner wall, a first lower protrusion protrusively located on the first inner wall, and a second lower protrusion protrusively located on the second inner wall. The heat pipe is located in the groove, and cooperatively secured by the first upper protrusion, the second upper protrusion, the first lower protrusion and the second lower protrusion.

The disclosure provides a heat dissipation structure and a manufacturing method thereof. The heat dissipation structure includes a heat pipe and multiple heat dissipation fins. The heat pipe has an outer annular wall with multiple conic annular grooves. A slant inner annular wall is disposed in each conic annular groove. Each heat dissipation fin has a through hole and a conic annular wall disposed on an outer edge of the through hole. The heat dissipation fins are adapted to sheathe the heat pipe in a spacedly stacked manner. Each conic annular wall is embedded in each conic annular groove to be adapted to sheathe each slant inner annular wall in a compressive manner. Therefore, efficiency of heat dissipation and structural strength of the heat dissipation structure are improved.

A thermal module includes a base seat, at least two heat pipes and multiple heat dissipation units. Each heat pipe has a heat absorption end and a heat dissipation end outward extending from the heat absorption end. The heat absorption ends are disposed on the base seat. The heat dissipation ends of the at least two heat pipes are positioned above the base seat at different heights and misaligned from each other. The multiple heat dissipation units are connected with the heat dissipation ends of the heat pipes and arranged at intervals. By means of arranging the multiple heat dissipation unit at intervals as multiple layers, the heat dissipation areas is enlarged to prevent the airflow from being interrupted so as to effectively greatly enhance the heat dissipation efficiency.

A battery module includes a module case, a battery cell assembly that is received in the module case, a heat sink mounted below the module case, and a heat pipe member mounted inside an upper side of the module case. The battery cell assembly includes battery cells, each of which has an electrode lead drawn to one or two sides thereof. The battery cells are stacked along a horizontal direction of the module case such that an edge of each of the battery cells not having an electrode lead is oriented downwardly facing the heat sink. The heat pipe member includes an evaporator and a condenser, the evaporator being formed on a side of the electrode leads of the battery cells, and the condenser being in contact with an inner surface of the module case.

Disclosed is a covering for an information handling system. The covering includes an aluminum alloy layer that can include at least a portion of recycled aluminum. The covering includes a copper heat pipe that can include at least a portion of recycled copper. The heat pipe and the aluminum alloy layer can be directly coupled to each other, with a heat-conductive carbonaceous material provided at the interface between the aluminum alloy layer and the heat pipe.

A heat dissipation structure has a heat dissipation base and at least one heat conduction assembly mounted in a through hole of the heat dissipation base. Each of the at least one heat conduction assembly includes a resilient clamp and a heat pipe. When a transceiver is inserted in the through hole of the heat dissipation base, two heat conducting sections of the heat pipe are pushed by the resilient clamp to abut against the transceiver and the heat dissipation base respectively. Heat generated while the transceiver is operating can be quickly and efficiently conducted through the heat pipe to the heat dissipation base and then dissipated. Temperature increase of the transceiver can be effectively avoided and performance and reliability of the transceiver during operation can be ensured.

An ultrasonic probe including ultrasonic vibrators for transmitting ultrasound and a housing for encasing the ultrasonic vibrators. The ultrasonic probe includes a heat dissipation member encased in the housing in thermal connection with the ultrasonic vibrators and housing, and constructed separately from the housing, wherein the heat dissipation member has opposing surfaces and facing inner surfaces of the housing, the opposing surfaces being secured in close contact with the inner surfaces.

A thermosiphon heat exchanger includes a chassis, an evaporation assembly and a condensation assembly. The chassis has an internal circulation chamber and an external circulation chamber separated from each other. The evaporation assembly is disposed in the internal circulation chamber. The condensation assembly is disposed in the external circulation chamber and horizontally positioned higher than the evaporation assembly, and the condensation assembly is coupled to the evaporation assembly by plural separated loops.